Here are relevant reports on : organ-on-chip-market

• System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029

  The System-on-Chip (SoC) market size is expected to grow from USD 138.46 billion in 2024 to USD 205.97 billion by 2029, at a compound annual growth rate (CAGR) of 8.3% during the forecast period.The kay players Qualcomm Technologies, Inc. (US), MediaTek Inc. (Taiwan), Samsung (South Korea), Apple Inc. (US), Broadcom (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), NVIDIA Corporation (US), HiSilicon (China), Microchip Technology Inc. (US).

  • Published: January 2025
  • Price: $ 4950
  • TOC Available:

• 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

  The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).

  • Published: May 2023
  • Price: $ 4950
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• Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, and High-Power), and Geography (APAC, North America, Europe, RoW) - Global Forecast to 2023

  Chip-scale package (CSP) LEDs are the latest trend in the LED package market. According to IPC's standard J-STD-012 (implementation of flip chip and chip scale technology), to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die, and it must be a single-die and direct surface mountable package. As of 2017, CSP LEDs have only penetrated 4% in the global LED package market—valued at USD 16 billion in 2017; with low-cost potential and attractive features, CSP LEDs are expected to penetrate about 10% of the total LED package market by 2023. Major players in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).

  • Published: October 2018
  • Price: $ 4950
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• Micro Battery Market Size, Share & Industry Trends Growth Analysis Report by Type (Thin Film, Printed, Solid-state Chip, Button), Capacity (Below 10 mAh, 10 to 100 mAh, Above 100 mAh), Battery Type (Primary, Secondary), Application (Smart cards, Wireless Sensors) and Region - Global Forecast to 2028

  The global micro battery market is expected to grow from USD 0.5 billion in 2023 to USD 1.3 billion by 2028, at a compound annual growth rate (CAGR) of 22.4% during the forecast period.The key players Cymbet Corporation (US), Enfucell (Finland), Ultralife Corporation (US), Molex, LLC (US), Panasonic Holdings Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), TDK Corporation (Japan), Maxell, Ltd. (Japan), VARTA AG (Germany), Renata SA (Switzerland), and Duracell Inc. (US) among others.

  • Published: July 2023
  • Price: $ 4950
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• Data Center Liquid Cooling Market by Component (Solution and Services), End Use (Cloud, Colocation, Enterprises, and Hyperscale), Enterprise (BFSI, IT, Research, Healthcare), Cooling Tech. (Direct to Chip, Immersion) and Region - Global Forecast to 2030

  The data center liquid cooling market is expected to grow from USD 4.9 billion in 2024 to USD 21.3 billion by 2030, at a CAGR of 27.6% during the forecast period. Rittal GmbH & Co. KG (Germany), Vertiv Group Corp. (US), Green Revolution Cooling Inc. (GRC) (US), Submer (Spain), Schneider Electric (France), LiquidStack Holding B.V(US), Iceotope Precision Liquid Cooling (UK), COOLIT SYSTEMS (Canada), DUG Technology (Australia), DCX Liquid Cooling Systems (Poland), Delta Power Solutions (Taiwan), Wiwynn (Taiwan), LiquidCool Solutions, Inc. (US), Midas Immersion Cooling (US), BOYD (US), Kaori Heat Treatment Co,. Ltd (Taiwan), Chilldyne, Inc. (US), Asperitas (Netherlands), and STULZ GMBH (Germany) are the key players in data center liquid cooling market.

  • Published: August 2024
  • Price: $ 4950
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• System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

  The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.

  • Published: November 2017
  • Price: $ 4950
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• Advanced Tires Market by Type (Pneumatic, Run-Flat, Airless), Technology (Self-Inflating, Chip-Embedded, Multi-chamber, All-in-one, Self-Sealing), Vehicle (ICE, Electric, Hybrid, Off-highway), Niche Technology, Material & Region - Global Forecast to 2030

  The advanced tires market is projected to reach USD 3.2 billion by 2030, at a CAGR of 14.4% during the forecast period. The advanced tire market is dominated by several global and regional players. Some of the manufacturers in the advanced tires market are Bridgestone Corporation (Japan), Michelin (France), Continental AG (Germany), Pirelli & C. S.p.A (Italy), The Goodyear Tyre and Rubber Company (US), Sumitomo Rubber Industries Ltd (Japan), Yokohama Tire Corporation (Japan), Hankook Tire & Technology Co., Ltd., (South Korea), and Nokian Tyres plc (Finland).

  • Published: May 2023
  • Price: $ 4950
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• DLP Projector Market by Light Source (Lamp, LED, and Laser), Chip Model, by Brightness, Throw Distance (Normal Throw, Short Throw, and Ultra-short Throw), Application, and by Geography (The Americas, Europe, APAC, and RoW) - Global Forecast to 2020

  The DLP projector market is estimated to reach USD 5.52 Billion by 2020, at a CAGR of 6.3% between 2015 and 2020. This report estimates the market size and future growth potential of the DLP projector market across different segments such as light source, chip model, brightness, throw distance, application, and geography. The base year considered for the study is 2014 and the market size is forecasted for the period between 2015 and 2020. The increase in the number of digital screens in the film industry, growing digitalization in the education sector, and increasing adoption of 3D projection in emerging applications are the factors that are expected to drive the market during the forecast period.

  • Published: December 2015
  • Price: $ 4950
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• High Throughput Screening Market / HTS Market by Offering (Instruments, Consumables (Reagents, Kits), Software, Services), Technology (Cell-based Assays, Lab-on-Chip, Label-free), Application (Drug Discovery, Life Sciences Research) - Global Forecast to 2029

  The global high throughput screening market, valued at US$25.7B in 2023, is forecasted to grow at a 11.8% CAGR, reaching US$28.8B by 2024 and US$50.2B by 2029. Growth in this market is primarily driven by the growing adoption of open innovative models in pharmaceutical & biotechnology companies, & the growing availability of funds for research

  • Published: July 2024
  • Price: $ 4950
  • TOC Available:

• MEMS Oscillator Market by Packaging Type (Surface-Mount Device Package and Chip-Scale Package), Band (MHz and kHz), General Circuitry (SPMO, TCMO, VCMO, FSMO, DCMO, and SSMO), Application, and Geography - Global Forecast to 2022

  The overall MEMS oscillator market was valued at USD 79.2 Million in 2016 and is expected to reach USD 802.8 Million by 2022, at a CAGR of 46.08% between 2017 and 2022. This report provides the size and future growth potential of the MEMS oscillator market across different segments such as packaging type, band, general circuitry, application, and geography. The study identifies and analyzes the market dynamics such as drivers, restraints, opportunities, and industry-specific challenges; and detailed value chain and Porter’s five forces analysis.

  • Published: February 2017
  • Price: $ 4950
  • TOC Available:

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