Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026
Updated on : October 23, 2024
The global semiconductor bonding market in terms of revenue was estimated to be worth USD 887 million in 2021 and is poised to reach USD 1,059 million by 2026, growing at a CAGR of 3.6% from 2021 to 2026.
The semiconductor bonding market is experiencing significant growth, driven by the increasing demand for advanced packaging technologies in the electronics industry. As semiconductor devices become smaller and more powerful, effective bonding solutions are essential for enhancing performance and reliability in applications such as consumer electronics, automotive, telecommunications, and industrial automation. Key trends influencing the market include the rising adoption of innovative bonding techniques, such as flip-chip bonding, wire bonding, and thermal compression bonding, which enable higher integration densities and improved thermal management. Additionally, the growing emphasis on miniaturization and energy efficiency in electronic components, coupled with the expansion of emerging technologies like 5G, Internet of Things (IoT), and artificial intelligence (AI), is further propelling demand for semiconductor bonding solutions. As the electronics industry continues to evolve, the semiconductor bonding market is expected to expand, driven by technological advancements and increasing production needs.
Factors such as growing demand for MEMs and surge in demand for electric vehicle are driving the growth of the market during the forecast period.
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Global Semiconductor Bonding Market Trends
With the increasing spread of COVID-19, there is a rise in the number of healthcare facilities to accommodate the growing number of patients globally. This has increased the demand for energy-efficient LED lighting technologies in healthcare facilities, which is expected to drive the demand for semiconductor bonding equipment.
LED is anticipated to be the fastest-growing application segment of the semiconductor bonding industry with a CAGR of 5.1% between 2021 and 2026. This segment has witnessed a lower impact compared with other segments, due to the growing penetration of LEDs in several sectors, such as consumer electronics, automotive, commercial, residential, and architectural. LEDs are widely used in commercial and industrial spaces, as LED lighting offers various benefits, including energy efficiency, lower heat emission, cost-effectiveness, and nanosecond switching capability. The use of thin wafers in LED devices offers various benefits, such as high efficiency and low power consumption. The increasing demand for LED components in the healthcare sector propelled the market growth after the COVID-19 pandemic.
Semiconductor bonding Market Dynamics
Driver: Increasing adoption of stacked die technology in IoT devices
The increasing adoption of stacked die technology in IoT devices is driving the growth of the semiconductor bonding market. Stacked die refers to attaching one bare die on top of each other within a single semiconductor package; it is used to utilize the same placement area on a substrate for multiple functionalities. Die stacking leads to better electrical performance of devices, as the shorter routing of interconnections between circuits results in faster signal generation. Original equipment manufacturers (OEMs) in the semiconductor industry are focusing on leveraging the benefits of IoT beyond connectivity. IoT devices and technologies such as sensors, RFID tags, smart meters, smart beacons, and distribution control systems are increasingly being deployed in applications such as building and home automation, smart manufacturing, connected logistics, smart retail, smart mobility and transportation, etc. Semiconductor bonding techniques are used in IoT devices to attach multi-stacked dies on substrates using minimum space.
Restraint: High cost of ownership
Semiconductor bonding equipment are sophisticated machines that require high input power to perform die attach operations. The power consumed by these equipment varies from hundreds to thousands of watts. The manufacturing cost of semiconductor bonding equipment is also very high due to the implementation of complex expensive components. The assembly of different big and small parts, such as screen, bonding hand, vacuum, sensors, and the heat source, is also costly. Thus, the overall production and ownership costs of semiconductor bonding equipment for die bonder equipment are relatively high. Additionally, the exorbitant cost of semiconductor wafers increases the operating cost of the semiconductor bonding, thereby hindering the market’s growth.
Opportunity: Expanding IC industry in China
The growing demand for thin wafers in the semiconductor industry is a major reason for the growth of the wafer bonding market. The advancements in thin wafers have helped overcome many traditional fabrication processes. With benefits such as ultra-low power consumption and ultra-high electrical performance, the thin wafer industry is attracting Chinese IC manufacturers looking to leverage this technology. At present, the need for thin chips for high performance at a low operating voltage and low cost is the main motive of many IC suppliers in China. Therefore, thin wafer technologies, including wafer bonding, are gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd. (China), Spreadtrum Communications (China), and RDA Microelectronics (China).
For instance, in June 2020, GlobalWafers Co., Ltd. invested NTD 10 billion (USD 339 million) in its Taisil (Taiwan) branch to boost the 300-mm silicon wafer capacity. The increased production capacity is expected to meet the growing demand for high-quality silicon wafers. Such expansions in the country are driving the demand for wafer bonding equipment.
Challenge: Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress
Die bonder equipment use mechanical movements to pick and place the die for the bonding process. The equipment have many moving parts that require precise movement to accurately attach the die to the substrate. However, sometimes, the moving parts can vibrate due to several issues, such as instability and abnormal movement of mechanical joints. The vibration in die bonders can result in misplacement or cracking of the die. The vibration of mechanical parts has become a major challenge for semiconductor bonding equipment manufacturers, which needs to be overcome.
Thin wafers are volatile and susceptible to damage from pressure or stress. A thin wafer is highly flexible and faces breakage issues even due to little pressure or stress. Dies made from thin wafers can break easily during the internal process of wafer thinning. Companies operating in the market are working toward overcoming this challenge by developing support systems to handle a thin wafer through various processes, such as wafer bonding and debonding. Also, companies are using a high-quality adhesive in carriers that handle thin wafers.
APAC held the largest market for the semiconductor bonding market in 2026
APAC is expected to register the highest CAGR in the overall semiconductor bonding market during the forecast period. More than 60% of OSAT players present across the world have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor fabrication process. The increasing number of IDMs in the region is expected to boost the semiconductor bonding market growth in the near future. Similarly, the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan is also likely to accelerate the market’s growth in APAC.
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Top Semiconductor Bonding Companies - Key Market Players
The semiconductor bonding companies report is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
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Scope of the Report
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|
Report Metric |
Scope |
| Estimated Value | USD 887 Million |
| Expected Value | USD 1,059 Million |
| Growth Rate | CAGR of 3.6% |
|
Market size available for years |
2018–2026 |
|
On Demand Data Available |
2030 |
|
Forecast period |
2021–2026 |
|
Forecast units |
Value (USD Million) and Volume (Million Units) |
|
Segments covered |
|
|
Geographies covered |
|
|
Companies covered |
The key players operating in the semiconductor bonding market are BE Semiconductor Industries N.V.(Netherland), ASM Pacific Technology Ltd.(Singapore), Kulicke & Soffa(Singapore), Panasonic(Japan), Fuji Corporation(Japan), Yamaha Motor Robotics Corporation Co.(Japan), SUSS MicroTech SE(Germany), and Shiaura Mechatronics(Japan). |
| Key Market Driver | Increasing adoption of stacked die technology in IoT devices |
| Key Market Opportunity | Expanding IC industry in China |
| Largest Growing Region | Asia Pacific |
The study categorizes the semiconductor bonding market share based on process type, technology, type, application, technology at the regional and global levels.
By Type
- Die Bonder
- Wafer Bonder
- Flip Chip Bonder
By Process Type
- Die-To-Die Bonding
- Die-To Wafer Bonding
- Wafer-To-Wafer Bonding
By Bonding Technology
-
Die Bonding Technology
- Eutectic Die Bonding
- Epoxy Die Bonding
- Flip Chip Attachment
- Hybrid Bonding (For 3d-Nand)
Wafer Bonding Technology
- Direct Wafer Bonding
- Anodic Wafer Bonding
- Tcb Wafer Bonding
- Hybrid Bonding
- Others
By Application
- RF Devices
- Mems And Sensors
- Cmos Image Sensors
- LED
- 3D NAND
Recent Developments
- In April 2021, ASM Pacific Technology launched three new manufacturing systems with X-Celeprint’s Micro Transfer Printing and ASM AMICRA’s high precision die bonding technology to enable high volume heterogeneous integration of ultra-thin dies up to 300 mm base wafer.
- In January 2021, ASM Pacific Technology partnered with the EV Group (Austria) to enable ultra-precision die-to-wafer hybrid bonding solutions for 3D-IC heterogeneous integration.
- In September 2020, Palomar® Technologies launched its new, fully automated, thermosonic, high-speed wire bonder, incorporating the latest technology.
Frequently Asked Questions (FAQ):
What is the current size of the global semiconductor bonding market?
The semiconductor bonding market is projected to grow from USD 887 million in 2021 to USD 1,059 billion by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026.
What is the key opportunity for semiconductor bonding market are used?
Opportunities for the manufacturers in the semiconductor bonding market include the increasing demand for 3D semiconductor assembly and packaging. However, the high cost of ownership is hindering the market’s growth.
What is the key driver for semiconductor bonding market?
Increasing demand for miniature electronic components is a major driving factor for the growth of the semiconductor bonding market.
What are the technological trends going in the semiconductor bonding market?
MEMS stands for microelectromechanical systems and MOEMS stands for microoptoelectromechanical systems. These systems find extensive applications in the automotive, consumer electronics, medical, aerospace & defense, and telecommunications sectors. In the automotive industry, these devices are used in airbag systems, rollover and skidding detection systems, tire pressure detectors, vehicle dynamic control solutions, vehicle navigation systems, antitheft systems, etc., for passenger and vehicle safety purposes. In the consumer electronics industry, these devices are used in mobile phones, notebooks, TVs, inkjet printers, and so on. Other major applications of MEMS and MOEMS devices include microsensors in biomedical devices, miniaturized strain gauges for orthopedic research, and guidance and navigation systems in defense. Increasing passenger safety concerns have a positive impact on the growth of the MEMS and MOEMS market for automotive applications. The assembly and packaging of these devices require ultra-high accuracy and high precision, which is offered by die bonding equipment. For instance, Kulicke & Soffa’s iStack S+ series of die bonders comprises a thin substrate handling kit (<100 ìm) suitable for the fabrication of MEMS and MOEMS. Adhesive and eutectic die bonding techniques are used to fabricate MEMS and MOEMS
Which are the major companies in the semiconductor bonding market?
BE Semiconductor Industries N.V., ASM Pacific Technology Ltd., Kulicke & Soffa, Panasonic, Fuji Corporation, Yamaha Motor Robotics Corporation Co., SUSS MicroTech SE, and Shiaura Mechatronics are the players dominating the global semiconductor bonding market. .
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TABLE OF CONTENTS
1 INTRODUCTION (Page No. - 24)
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION AND SCOPE
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 SCOPE
1.3.1 MARKETS COVERED
1.3.2 YEARS CONSIDERED
1.4 CURRENCY
1.5 LIMITATIONS
1.6 STAKEHOLDERS
2 RESEARCH METHODOLOGY (Page No. - 28)
2.1 RESEARCH DATA
FIGURE 1 SEMICONDUCTOR BONDING EQUIPMENT MARKET: RESEARCH DESIGN
2.1.1 SECONDARY DATA
2.1.1.1 Secondary sources
2.1.2 PRIMARY DATA
2.1.2.1 Primary sources
2.1.2.2 Breakdown of primary interviews
2.2 SEMICONDUCTOR BONDING MARKET SIZE ESTIMATION
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3—BOTTOM-UP MARKET ESTIMATION FOR SEMICONDUCTOR BONDING EQUIPMENT, BY TYPE
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach for estimating market size by bottom-up approach (demand side)
FIGURE 3 SEMICONDUCTOR BONDING MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach for estimating market size by top-down approach (supply side)
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 5 DATA TRIANGULATION
2.4 ASSUMPTIONS
FIGURE 6 ASSUMPTIONS FOR THE RESEARCH STUDY
2.5 RISK ASSESSMENT
2.6 LIMITATIONS
2.7 PRIMARY INSIGHTS
TABLE 1 MARKET FORECASTING METHODOLOGY ADOPTED FROM 2019 TO 2026
3 EXECUTIVE SUMMARY (Page No. - 37)
FIGURE 7 MARKET FOR WAFER BONDER TO GROW AT HIGHEST CAGR DURING 2021–2026
FIGURE 8 SEMICONDUCTOR BONDING MARKET FOR LED TO GROW AT HIGHEST CAGR DURING 2021–2026
FIGURE 9 APAC TO BE FASTEST-GROWING REGIONAL MARKET FOR SEMICONDUCTOR BONDING DURING FORECAST PERIOD
3.1 IMPACT OF COVID-19 ON MARKET
FIGURE 10 IMPACT OF COVID-19 ON MARKET, 2018–2026 (USD MILLION)
3.2 PRE-COVID-19
3.3 PESSIMISTIC SCENARIO (POST-COVID-19)
3.4 OPTIMISTIC SCENARIO (POST-COVID-19)
3.5 REALISTIC SCENARIO (POST-COVID-19)
4 PREMIUM INSIGHTS (Page No. - 43)
4.1 ATTRACTIVE OPPORTUNITIES IN SEMICONDUCTOR BONDING MARKET
FIGURE 11 RISING NEED FOR 3D CHIPS IS ACTING AS POTENTIAL OPPORTUNITY FOR MARKET
4.2 SEMICONDUCTOR BONDING MARKET, BY TYPE
FIGURE 12 MARKET FOR WAFER BONDER TO GROW AT HIGHER CAGR DURING FORECAST PERIOD
4.3 MARKET FOR CLOUD SEMICONDUCTOR BONDING, BY COUNTRY
FIGURE 13 MARKET IN JAPAN TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
4.4 SEMICONDUCTOR BONDING INDUSTRY IN APAC IN 2026, BY COUNTRY & APPLICATION
FIGURE 14 LED TO HOLD LARGEST MARKET SHARE IN APAC IN 2026
4.5 MARKET, BY APPLICATION
FIGURE 15 SEMICONDUCTOR BONDING INDUSTRY FOR LED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026
5 MARKET OVERVIEW (Page No. - 46)
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 16 GROWING DEMAND FOR MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE SEMICONDUCTOR BONDING MARKET
5.2.1 DRIVERS
5.2.1.1 Growing demand for miniature electronic components
FIGURE 17 MEMS MARKET, 2017–2020 (USD MILLION)
5.2.1.2 Increasing adoption of stacked die technology in IoT devices
FIGURE 18 INDUSTRIAL IOT MARKET, BY DEVICE AND TECHNOLOGY, 2017–2020 (USD BILLION)
5.2.1.3 Rising demand for electric and hybrid vehicles
FIGURE 19 ELECTRIC VEHICLE SALES, 2013–2018 (MILLION UNITS)
FIGURE 20 MARKET DRIVERS AND THEIR IMPACT
5.2.2 RESTRAINTS
5.2.2.1 High cost of ownership
FIGURE 21 SEMICONDUCTOR BONDING MARKET RESTRAINTS AND THEIR IMPACT
5.2.3 OPPORTUNITIES
5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET FOR 3D ICS, 2020–2025 (USD MILLION)
5.2.3.2 Expanding IC industry in China
TABLE 3 CHINA'S PROVINCES HAVE SIGNIFICANT INVESTMENT IN CHIP FUNDS (AS OF JUNE 2020)
5.2.3.3 Growing adoption of IoT and AI in automotive sector
FIGURE 22 PROJECTED IOT CONNECTIONS BY 2025 (BILLION)
FIGURE 23 MARKET OPPORTUNITIES AND THEIR IMPACT
5.2.4 CHALLENGES
5.2.4.1 Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress
5.2.4.2 Increased complexities related to miniaturized structures of circuits
FIGURE 24 SEMICONDUCTOR BONDING INDUSTRY CHALLENGES AND THEIR IMPACT
5.3 VALUE CHAIN ANALYSIS
5.3.1 SEMICONDUCTOR BONDING VALUE CHAIN
FIGURE 25 VALUE CHAIN OF SEMICONDUCTOR BONDING MARKET: MAJOR VALUE IS ADDED BY SEMICONDUCTOR BONDING EQUIPMENT PROVIDERS
5.3.2 ASP ANALYSIS
TABLE 4 AVERAGE SELLING PRICES OF DIFFERENT TYPES OF BONDING MACHINES
5.3.3 REGULATIONS
5.3.4 EXPORTS–IMPORTS REGULATIONS
5.3.5 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE)
5.3.6 REGISTRATION, EVALUATION, AUTHORIZATION, AND RESTRICTION OF CHEMICALS (REACH)
5.4 ECOSYSTEM
TABLE 5 ECOSYSTEM PLAYERS
5.5 TECHNOLOGY ANALYSIS
5.5.1 MEMS AND MOEMS
5.5.2 WAFER BONDING
5.5.3 DIE BONDING
5.5.4 SOFT SOLDER
5.6 CASE STUDIES
5.6.1 LATEST DIE BONDING SOLUTIONS FOR PHOTONICS MANUFACTURING
5.6.2 MRSI SOLVES ONE OF GREATEST CHALLENGES IN MODERN PHOTONICS MANUFACTURING
5.6.3 QUICK SETTING RFID TAG BONDING – GLUTAG BONDING
5.6.4 WORLD'S FIRST 300 MM COMPATIBLE 3D-INTEGRATED LSI ROOM TEMPERATURE WAFER BONDING DEVICE
5.7 PATENTS ANALYSIS
FIGURE 26 KEY PATENT HOLDERS DURING 2010–2020
TABLE 6 LIST OF PATENTS
5.8 PORTER’S FIVE FORCES ANALYSIS
TABLE 7 MARKET: PORTER’S FIVE FORCES ANALYSIS
5.8.1 BARGAINING POWER OF SUPPLIERS
5.8.2 BARGAINING POWER OF BUYERS
5.8.3 THREAT OF NEW ENTRANTS
5.8.4 THREAT OF SUBSTITUTES
5.8.5 INTENSITY OF COMPETITIVE RIVALRY
TABLE 8 IMPACT OF EACH FORCE ON MARKET, 2020 VS. 2026
5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER’S BUSINESS
FIGURE 27 REVENUE SHIFT FOR SEMICONDUCTOR BONDING MARKET
5.10 TRADE ANALYSIS
TABLE 9 IMPORTS DATA FOR MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION)
TABLE 10 EXPORTS DATA OF MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION)
6 SEMICONDUCTOR BONDING MARKET, BY PROCESS TYPE (Page No. - 73)
6.1 INTRODUCTION
FIGURE 28 DIE-TO-WAFER BONDING IS EXPECTED TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
TABLE 11 MARKET SIZE, BY PROCESS TYPE, 2018–2020 (USD MILLION)
TABLE 12 SEMICONDUCTOR BONDING INDUSTRY SIZE, BY PROCESS TYPE, 2021–2026 (USD MILLION)
6.2 DIE-TO-DIE BONDING
6.2.1 DIE-TO-DIE BONDING SEGMENT IS EXPECTED TO GROW AT 4.3% CAGR
TABLE 13 MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2018–2020 (USD MILLION)
TABLE 14 MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2021–2026 (USD MILLION)
6.3 DIE-TO-WAFER BONDING
6.3.1 SEVERAL DIFFERENT DIE-TO-WAFER BONDING APPROACHES ARE BEING CONSIDERED FOR HETEROGENEOUS INTEGRATION
TABLE 15 TYPES OF DIE-TO-WAFER BONDING
TABLE 16 MARKET SIZE FOR DIE-TO-WAFER BONDING, BY REGION, 2018–2020 (USD MILLION)
TABLE 17 MARKET SIZE FOR DIE-TO-WAFER BONDING, BY REGION, 2021–2026 (USD MILLION)
6.4 WAFER-TO-WAFER BONDING
6.4.1 WAFER-TO-WAFER IS USED FOR APPLICATIONS SUCH AS CMOS IMAGE SENSORS AND VARIOUS MEMORY AND LOGIC TECHNOLOGIES
TABLE 18 MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2018–2020 (USD MILLION)
TABLE 19 MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2021–2026 (USD MILLION)
7 SEMICONDUCTOR BONDING MARKET, BY TECHNOLOGY (Page No. - 80)
7.1 INTRODUCTION
7.2 DIE BONDING
FIGURE 29 EPOXY DIE BONDING TECHNOLOGY IS PROJECTED TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD
TABLE 20 DIE BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 21 DIE BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION)
7.2.1 EPOXY DIE BONDING
7.2.1.1 Epoxy bonding to account for largest share of die bonder equipment market due to low cost and low curing temperature
7.2.2 EUTECTIC DIE BONDING
7.2.2.1 Eutectic die bonding is primarily used for fabrication of electronic components
7.2.3 FLIP CHIP ATTACHMENT
7.2.3.1 Flip chip attachment method is used for making electrical connections to chips
7.2.4 HYBRID BONDING (FOR 3D NAND)
7.2.4.1 Main application of hybrid bonding is in advanced 3D device stacking
7.3 WAFER BONDING
FIGURE 30 MARKET FOR HYBRID BONDING TECHNOLOGY TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 22 WAFER BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 23 WAFER BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION)
7.3.1 DIRECT WAFER BONDING
7.3.1.1 Direct wafer bonding offers strong connection due to covalent forces
FIGURE 31 DIRECT WAFER BONDING PROCESS FLOW
7.3.2 ANODIC WAFER BONDING
7.3.2.1 Anodic wafer bonding offers advantage of wide process window, which helps in MEMS fabrication
FIGURE 32 ANODIC WAFER BONDING PROCESS FLOW
TABLE 24 DIFFERENCES BETWEEN DIRECT WAFER BONDING AND ANODIC WAFER BONDING
7.3.3 TCB WAFER BONDING
7.3.3.1 Metals such as Au, Cu, or Al are used for metal thermocompression bonding
FIGURE 33 METAL THERMOCOMPRESSION WAFER BONDING PROCESS FLOW
7.3.4 HYBRID BONDING
7.3.4.1 Xperi has developed new version of its hybrid bonding technology
8 SEMICONDUCTOR BONDING MARKET, BY TYPE (Page No. - 94)
8.1 INTRODUCTION
FIGURE 34 WAFER BONDER SEGMENT IS EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026
TABLE 25 MARKET SIZE, BY TYPE, 2018–2020 (MILLION UNIT)
TABLE 26 MARKET SIZE, BY TYPE, 2021–2026 (MILLION UNITS)
TABLE 27 MARKET SIZE, BY TYPE, 2018–2020 (USD MILLION)
TABLE 28 MARKET SIZE, BY TYPE, 2021–2026 (USD MILLION)
8.2 DIE BONDER
8.2.1 MANUAL DIE BONDERS
8.2.1.1 Manual die bonders play significant role in R&D, testing, and prototyping applications
8.2.2 SEMIAUTOMATIC DIE BONDERS
8.2.2.1 Semiautomatic die bonders are flexible and easy to use
8.2.3 FULLY AUTOMATIC DIE BONDERS
8.2.3.1 Fully automatic die bonders are expected to gain more market traction
TABLE 29 MARKET SIZE FOR DIE BONDER, BY REGION, 2018–2020 (USD MILLION)
TABLE 30 MARKET SIZE FOR DIE BONDER, BY REGION, 2021–2026 (USD MILLION)
8.3 WAFER BONDER
8.3.1 UV-RELEASE ADHESIVES, THERMAL-RELEASE ADHESIVES, AND SOLVENT-RELEASE ADHESIVES ARE USED IN WAFER BONDING
TABLE 31 MARKET SIZE FOR WAFER BONDER, BY REGION, 2018–2020 (USD MILLION)
TABLE 32 MARKET SIZE FOR WAFER BONDER, BY REGION, 2021–2026 (USD MILLION)
8.4 FLIP CHIP BONDER
8.4.1 FLIP CHIP BONDING CAN OFFER SEVERAL ADVANTAGES OVER OTHER INTERCONNECTION PROCESSES
TABLE 33 MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2018–2020 (USD MILLION)
TABLE 34 MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2021–2026 (USD MILLION)
9 SEMICONDUCTOR BONDING MARKET, BY APPLICATION (Page No. - 102)
9.1 INTRODUCTION
FIGURE 35 LED APPLICATION SEGMENT TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
TABLE 35 MARKET SIZE, BY APPLICATION, 2018–2020 (USD MILLION)
TABLE 36 MARKET SIZE, BY APPLICATION, 2021–2026 (USD MILLION)
9.2 MEMS AND SENSORS
9.2.1 GROWTH IS DRIVEN BY HIGH DEMAND FROM CONSUMER ELECTRONICS MANUFACTURERS AND ADOPTION OF PATIENT MONITORING SOLUTIONS DURING COVID-19 PANDEMIC
TABLE 37 MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2018–2020 (USD MILLION)
TABLE 38 MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2021–2026 (USD MILLION)
9.3 CMOS IMAGE SENSORS (CIS)
9.3.1 INCREASING DEMAND FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE DEMAND FOR CIS
TABLE 39 MARKET SIZE FOR CIS, BY REGION, 2018–2020 (USD MILLION)
TABLE 40 MARKET SIZE FOR CIS, BY REGION, 2021–2026 (USD MILLION)
9.4 RADIOFREQUENCY (RF) DEVICES
9.4.1 INCREASING DEMAND FOR RF DEVICES FOR SMARTPHONES TO DRIVE SEMICONDUCTOR BONDING MARKET
TABLE 41 MARKET SIZE FOR RF DEVICES, BY REGION, 2018–2020 (USD MILLION)
TABLE 42 MARKET SIZE FOR RF DEVICES, BY REGION, 2021–2026 (USD MILLION)
9.5 LED
9.5.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT GROWTH DURING FORECAST PERIOD
TABLE 43 MARKET SIZE FOR LED, BY REGION, 2018–2020 (USD MILLION)
TABLE 44 MARKET SIZE FOR LED, BY REGION, 2021–2026 (USD MILLION)
9.6 3D NAND
TABLE 45 MARKET SIZE FOR 3D NAND, BY REGION, 2018–2020 (USD MILLION)
TABLE 46 MARKET SIZE FOR 3D NAND, BY REGION, 2021–2026 (USD MILLION)
10 GEOGRAPHIC ANALYSIS (Page No. - 112)
10.1 INTRODUCTION
FIGURE 36 SEMICONDUCTOR BONDING IN APAC TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
TABLE 47 MARKET, BY REGION, 2018–2020 (USD MILLION)
TABLE 48 MARKET, BY REGION, 2021–2026 (USD MILLION)
10.2 APAC
FIGURE 37 APAC: SEMICONDUCTOR BONDING MARKET SNAPSHOT
TABLE 49 MARKET IN APAC, BY TYPE, 2018–2020 (USD MILLION)
TABLE 50 MARKET IN APAC, BY TYPE, 2021–2026 (USD MILLION)
TABLE 51 MARKET IN APAC, BY PROCESS TYPE, 2018–2020 (USD MILLION)
TABLE 52 MARKET IN APAC, BY PROCESS TYPE, 2021–2026 (USD MILLION)
TABLE 53 MARKET IN APAC, BY APPLICATION, 2018–2020 (USD MILLION)
TABLE 54 MARKET IN APAC, BY APPLICATION, 2021–2026 (USD MILLION)
TABLE 55 MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 56 MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 57 MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 58 MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 59 MARKET IN APAC, BY COUNTRY, 2018–2020 (USD MILLION)
TABLE 60 MARKET IN APAC, BY COUNTRY, 2021–2026 (USD MILLION)
10.2.1 TAIWAN
10.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
10.2.2 CHINA
10.2.2.1 Growing trend of miniaturization of consumer electronic products spurs market growth in China
10.2.3 JAPAN
10.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuel market growth in Japan
10.2.4 SOUTH KOREA
10.2.4.1 South Korea to continue to account for largest market size in APAC during 2021–2026
10.2.5 REST OF APAC
10.2.5.1 Strong presence of semiconductor bonding manufacturers accelerates market growth in Rest of APAC
10.3 AMERICAS
FIGURE 38 AMERICAS: SEMICONDUCTOR BONDING MARKET SNAPSHOT
TABLE 61 MARKET IN AMERICAS, BY TYPE, 2018–2020 (USD MILLION)
TABLE 62 MARKET IN AMERICAS, BY TYPE, 2021–2026 (USD MILLION)
TABLE 63 MARKET IN AMERICAS, BY PROCESS TYPE, 2018–2020 (USD MILLION)
TABLE 64 MARKET IN AMERICAS, BY PROCESS TYPE, 2021–2026 (USD MILLION)
TABLE 65 MARKET IN AMERICAS, BY APPLICATION, 2018–2020 (USD MILLION)
TABLE 66 MARKET IN AMERICAS, BY APPLICATION, 2021–2026 (USD MILLION)
TABLE 67 MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 68 MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 69 MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 70 MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 71 MARKET IN AMERICAS, BY COUNTRY, 2018–2020 (USD MILLION)
TABLE 72 MARKET IN AMERICAS, BY COUNTRY, 2021–2026 (USD MILLION)
10.3.1 US
10.3.1.1 US to continue to lead market in Americas during 2021–2026
10.3.2 CANADA
10.3.2.1 Ongoing government initiatives toward development of electric vehicle infrastructure to create market opportunities in near future
10.3.3 REST OF AMERICAS
10.3.3.1 Increasing demand for IoT and 5G is boosting demand for die bonding equipment in Rest of Americas
10.4 EUROPE
FIGURE 39 EUROPE: SEMICONDUCTOR BONDING MARKET SNAPSHOT
TABLE 73 MARKET IN EUROPE, BY TYPE, 2018–2020 (USD MILLION)
TABLE 74 MARKET IN EUROPE, BY TYPE, 2021–2026 (USD MILLION)
TABLE 75 MARKET IN EUROPE, BY PROCESS TYPE, 2018–2020 (USD MILLION)
TABLE 76 MARKET IN EUROPE, BY PROCESS TYPE, 2021–2026 (USD MILLION)
TABLE 77 MARKET IN EUROPE, BY APPLICATION, 2018–2020 (USD MILLION)
TABLE 78 MARKET IN EUROPE, BY APPLICATION, 2021–2026 (USD MILLION)
TABLE 79 MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 80 MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 81 MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 82 MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 83 MARKET IN EUROPE, BY COUNTRY, 2018–2020 (USD MILLION)
TABLE 84 MARKET IN EUROPE, BY COUNTRY, 2021–2026 (USD MILLION)
10.4.1 GERMANY
10.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
10.4.2 UK
10.4.2.1 Deployment of 5G infrastructure is fueling market growth in UK
10.4.3 FRANCE
10.4.3.1 Developed communication network has prompted market growth in France
10.4.4 IRELAND
10.4.4.1 Presence of Intel’s fab primarily drives market growth in Ireland
10.4.5 ITALY
10.4.5.1 Technology enhancements by players such as STMicroelectronics surge growth of semiconductor manufacturing equipment market in Italy
10.4.6 REST OF EUROPE
10.4.6.1 Initiatives of semiconductor bonding manufacturers to propel market growth in Rest of Europe
10.5 ROW
TABLE 85 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE, 2018–2020 (USD MILLION)
TABLE 86 MARKET IN ROW, BY TYPE, 2021–2026 (USD MILLION)
TABLE 87 MARKET IN ROW, BY PROCESS TYPE, 2018–2020 (USD MILLION)
TABLE 88 MARKET IN ROW, BY PROCESS TYPE, 2021–2026 (USD MILLION)
TABLE 89 MARKET IN ROW, BY APPLICATION, 2018–2020 (USD MILLION)
TABLE 90 MARKET IN ROW, BY APPLICATION, 2021–2026 (USD MILLION)
TABLE 91 MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 92 MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 93 MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
TABLE 94 MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
TABLE 95 MARKET IN ROW, BY REGION, 2018–2020 (USD MILLION)
TABLE 96 MARKET IN ROW, BY REGION, 2021–2026 (USD MILLION)
11 COMPETITIVE LANDSCAPE (Page No. - 141)
11.1 INTRODUCTION
11.2 REVENUE ANALYSIS
FIGURE 40 REVENUE ANALYSIS OF TOP THREE COMPANIES, 2020
11.3 SEMICONDUCTOR BONDING MARKET SHARE ANALYSIS, 2020
TABLE 97 MARKET: MARKET SHARE ANALYSIS (2020)
11.4 KEY PLAYER STRATEGIES/RIGHT TO WIN
11.4.1 OVERVIEW OF STRATEGIES DEPLOYED BY KEY SEMICONDUCTOR BONDING COMPANIES
11.5 COMPETITIVE LEADERSHIP MAPPING
11.5.1 STAR
11.5.2 EMERGING LEADER
11.5.3 PERVASIVE
11.5.4 PARTICIPANT
FIGURE 41 MARKET: COMPETITIVE LEADERSHIP MAPPING, 2020
11.5.5 MARKET: TYPE FOOTPRINT
TABLE 98 COMPANY FOOTPRINT
TABLE 99 APPLICATION FOOTPRINT OF COMPANIES
TABLE 100 REGIONAL FOOTPRINT OF COMPANIES
11.6 COMPETITIVE SITUATIONS AND TRENDS
11.6.1 MARKET: PRODUCT LAUNCHES, JANUARY 2018–APRIL 2021
11.6.2 MARKET: DEALS, JANUARY 2018–APRIL 2021
12 COMPANY PROFILES (Page No. - 151)
(Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
12.1 INTRODUCTION
12.2 KEY PLAYERS
12.2.1 ASM PACIFIC TECHNOLOGY
FIGURE 42 ASM PACIFIC TECHNOLOGY: COMPANY SNAPSHOT
12.2.2 BESI
FIGURE 43 BESI: COMPANY SNAPSHOT
12.2.3 PANASONIC
FIGURE 44 PANASONIC: COMPANY SNAPSHOT
12.2.4 FASFORD TECHNOLOGY
FIGURE 45 FUJI CORPORATION: COMPANY SNAPSHOT
12.2.5 SHINKAWA LTD
FIGURE 46 YAMAHA MOTOR ROBOTICS HOLDING CO.: COMPANY SNAPSHOT
12.2.6 EV GROUP (EVG)
12.2.7 SUSS MICROTECH SE
FIGURE 47 SUSS MICROTECH SE: COMPANY SNAPSHOT
12.2.8 KULICKE & SOFFA INDUSTRIES
FIGURE 48 KULICKE & SOFFA INDUSTRIES: COMPANY SNAPSHOT
12.2.9 PALOMAR TECHNOLOGIES
12.2.10 SHIBAURA MECHATRONICS
FIGURE 49 SHIBAURA MECHATRONICS: COMPANY SNAPSHOT
12.3 OTHER KEY PLAYERS
12.3.1 TDK CORPORATION
12.3.2 TOKYO ELECTRON LIMITED
12.3.3 MITSUBISHI HEAVY INDUSTRIES MACHINE TOOLS
12.3.4 MYCRONIC GROUP
12.3.5 INTEL
12.3.6 SAMSUNG
12.3.7 CANON ANELVA CORPORATION
12.3.8 FINETECH
12.3.9 DR. TRESKY
12.3.10 SET CORPORATION SA
12.3.11 TOKYO OHKA KOYGO
12.3.12 BONDTECH
12.3.13 AYUMI INDUSTRIES
12.3.14 APPLIED MICROENGINEERING LIMITED
12.3.15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)
12.3.16 TORAY ENGINEERING
*Details on Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.
13 APPENDIX (Page No. - 198)
13.1 INSIGHTS OF INDUSTRY EXPERTS
13.2 DISCUSSION GUIDE
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
13.4 AVAILABLE CUSTOMIZATIONS
13.5 RELATED REPORTS
13.6 AUTHOR DETAILS
The study involved four major activities in estimating the size of the semiconductor bonding market. Exhaustive secondary research has been done to collect information on the market, peer market, and parent market. Validation of these findings, assumptions, and sizing with industry experts across the value chain through primary research has been the next step. Both top-down and bottom-up approaches have been employed to estimate the global market size. After that, market breakdown and data triangulation have been used to estimate the market sizes of segments and subsegments.
Secondary Research
The secondary sources referred to for this research study includes TechCrunch News, Semiconductor bonding, Fraunhofer Data, and Photonics Articles.
In the semiconductor bonding market report, both top-down and bottom-up approaches have been used to estimate and validate the size of the semiconductor bonding market, along with other dependent submarkets. The key players in the semiconductor bonding market have been identified through secondary research, and their market presence has been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.
Primary Research
Extensive primary research has been conducted after acquiring an understanding of the semiconductor bonding market scenario through secondary research. Several primary interviews have been conducted with market experts from both the demand- (consumers, industries, healthcare) and supply-side (semiconductor bonding product manufacturers) players across four major regions, namely, Americas, Europe, Asia Pacific, and Rest of the World (the Middle East & Africa). Approximately 70% and 30% of primary interviews have been conducted from the supply and demand side, respectively. Primary data has been collected through questionnaires, emails, and telephonic interviews. In the canvassing of primaries, various departments within organizations, such as sales, operations, and administration, were covered to provide a holistic viewpoint in our report.
After interacting with industry experts, brief sessions were conducted with highly experienced independent consultants to reinforce the findings from our primaries. This, along with the in-house subject matter experts’ opinions, has led us to the findings as described in the remainder of this report.
Market Size Estimation
Both top-down and bottom-up approaches have been used to estimate and validate the total size of the semiconductor bonding market. These methods have also been extensively used to estimate the sizes of various market subsegments. The research methodology used to estimate the market sizes includes the following:
- Identifying market for semiconductor bonding-based type(Wafer bonder, Die bonder and Flip Chip bonder) in each country
- Identifying the major applications of semiconductor bonding-related products
- Estimating the size of the market in each region by adding the sizes of country-wise markets
- Tracking the ongoing and upcoming implementation of semiconductor bonding projects by various companies in each region and forecasting the size of the semiconductor bonding market based on these developments and other critical parameters, including COVID-19 related impacts
- Arriving at the size of the global market by adding the sizes of region-wise markets
Market Size Estimation Methodology-Bottom-up approach
To know about the assumptions considered for the study, Request for Free Sample Report
Data Triangulation
After arriving at the overall market size using the market size estimation processes explained above—the market has been split into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment, data triangulation, and market breakdown procedures have been employed, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply sides.
The main objectives of this study are as follows:
- To define, describe, and forecast the semiconductor bonding market, in terms of value and volume, by process type, technology, application, type, and region
- To forecast the market, for various segments with respect to four main regions—the North Americas, Europe, Asia Pacific (APAC), and Rest of the World (RoW), in terms of value
- To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and contribution to the overall semiconductor bonding market
- To provide detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the semiconductor bonding market growth
- To analyze opportunities in the market for various stakeholders by identifying the high-growth segments of the semiconductor bonding market
- To study the complete value chain and allied industry segments, and perform a value chain analysis of the semiconductor bonding market landscape
- To map competitive intelligence based on company profiles, key player strategies, and key developments
- To strategically profile key players and comprehensively analyze their market ranking and core competencies2
- To track and analyze competitive developments such as joint ventures, mergers and acquisitions, product developments, and research and development (R&D) in the semiconductor bonding market
Available Customizations:
MarketsandMarkets offers the following customizations for this market report:
- Additional country-level analysis of semiconductor bonding market
- Profiling of additional market players (up to 5)
- Country-level analysis of component, and system type Segment
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