Here are relevant reports on : link-belt-bearings-market
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Occupant Classification System (OCS) Market by Vehicle Class (Economy, Mid-size, Luxury), Component Type (ACU, Sensor, Others), Sensor Type (Pressure Sensor, Belt Tension Sensor), Electric Vehicle, Propulsion, and Region - Global Forecast to 2030
The global occupant classification system market is projected to reach USD 3.72 billion by 2030, at a CAGR of -0.9% during the forecast period. The major players in the occupant classification system market include Robert Bosch GmbH (Germany), Denso Corporation (Japan), ZF Friedrichshafen AG (Germany), Continental AG (Germany), IEE Smart Sensing Solutions (Luxembourg), AISIN CORPORATION (Japan), Aptiv (Ireland). These companies provide occupant classification systems for automakers and focus on developing advanced systems that utilize sensor fusion with cameras and radar to enhance safety and expand their market presence. For example, Bosch's safety systems can optimize occupant positioning and reduce neck loads by up to 24%. In contrast, Continental AG's Active Emergency Belt Control system activates tailored restraint systems based on occupant conditions by using camera, radar, and other occupant position/weight data acquired from different sensors. Additionally, ZF Friedrichshafen AG launched intelligent seat belt technology in January 2024 to further improve safety standards.
- Published: May 2020
- Price: $ 4950
- TOC Available:
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5G Industrial IOT Market by Component (Hardware, Solutions, and Services), Organization Size, Application (Predictive Maintenance, Business Process Optimization), End User (Process Industries and Discrete Industries) and Region - Global Forecast to 2026
The 5G Industrial IOT Market is expected to grow from USD 0.5 billion in 2020 to USD 15.7 billion by 2026, at a CAGR of 79.1% during the forecast period. Major vendors operating in the 5G INDUSTRIAL IOT market include Qualcomm Technologies, Inc. (Qualcomm), Ericsson (Ericsson), Nokia (Nokia), Huawei Technologies Co., Ltd. (Huawei), Cisco Systems (Cisco), AT&T (AT&T), IBM Corporation (IBM), Microsoft Corporation (Microsoft), Siemens AG (Siemens), Verizon (Verizon), Sierra Wireless (Sierra Wireless), Telefónica S.A. (Telefónica), China Mobile Limited (China Mobile), China Unicom (Hong Kong) Limited (China Unicom), Vodafone (Vodafone), Advantech Co., Ltd. (Advantech), ASOCS (ASOCS), T-Mobile USA, INC (T-Mobile), TELUS (TELUS), Honeywell International Inc. (Honeywell), Intel Corporation (Intel), Bosch.IO GmbH (Bosch.IO), Deutsche Telekom AG (Deutsche Telekom), Telit (Telit), Thales Group (Thales), IDEMIA (IDEMIA), KT Corporation (KT), ABB (ABB), and NTT Data Corporation (NTT Data).
- Published: February 2021
- Price: $ 4950
- TOC Available:
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HUD Helmet Market by Connectivity, Component, Display, Outer Shell Material, Technology, End-User (Racing Professional, Personal Use), Function (Navigation, Communication, Performance Monitoring), Power Supply, and Region - Global Forecast to 2030
The HUD helmet market is expected to grow from USD 1,047 million by 2030, at a CAGR of 30.0% during the forecast period.The HUD helmet ecosystem is dominated by a few global HUD helmet solution providers and comprises several regional players. Some of the key providers include NUVIZ, Inc. (US), DigiLens Inc., (US), BMW Motorrad (Germany), SKULLY Technologies, JARVISH (Taiwan), and SHOEI CO. LTD. (Japan).
- Published: December 2019
- Price: $ 4950
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Biocomposites Market by Fiber Type (Wood Fiber and Non-wood Fiber), Polymer Type (Synthetic and Natural), Product (Hybrid and Green), End-use Industries (Building & Construction, Transportation, and Consumer Goods) and Region - Global Forecast to 2026
The global biocomposites market is expected to grow from USD 24.4 billion in 2021 to USD 51.2 billion by 2026, at a compound annual growth rate (CAGR) of 16.0% during the forecast period.The key players UPM (Finland), Trex Company (US), Fiberon LLC (US), FlexForm Technologies (US), Universal Forest Products, Inc. (US), Nanjing Jufeng Advanced Materials Co., Ltd (China), Meshlin Composites ZRT (Hungary), Tecnaro GmbH (Germany)
- Published: February 2022
- Price: $ 4950
- TOC Available:
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High Performance Composites Market by Resin Type (Thermoset, Thermoplastic), Fiber Type (Carbon Fiber, S-Glass, Aramid Fiber) Application (Aerospace & Defense, Automotive, Pressure Vessel, Wind Turbine, Medical), Region - Global Forecast to 2022
The high performance composites market was valued at USD 23.50 Billion in 2016 and is projected to reach USD 33.33 Billion by 2022, at a CAGR of 6.0% from 2017 to 2022. Key companies profiled in this research report on the high performance composites market include Toray Industries Inc. (Japan), Hexcel Corporation (US), Solvay S.A. (Belgium), SGL Group-The Carbon Company (Germany), Koninklijke TenCate NV (Netherlands), TPI Composites (US), Owens Corning Corporation (US), Teijin Limited (Japan), and BASF SE (Germany).
- Published: July 2017
- Price: $ 4950
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Dental 3D Printing Market by Equipment (3D Scanner, Printer), Technology (Stereolithography, LCD, FDM, SLS), Materials (Plastics, Metal), Application (Prosthodontics, Orthodontic, Implantology), End User (Dental Labs, Hospitals, Clinics) & Region - Global Forecast to 2029
The global dental 3D printing market, valued at US$2.7B in 2022, is forecasted to grow at a 19.0% CAGR, reaching US$2.9B by 2023 and US$8.1B by 2029. The new research study consists of an industry trend analysis of the market. The new research study consists of industry trends, pricing analysis, patent analysis, conference and webinar materials, key stakeholders, and buying behaviour in the market.
- Published: February 2024
- Price: $ 4950
- TOC Available:
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IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2029
The IoT technology market is expected to grow from USD 945.6 billion in 2024 to USD 1,377.8 billion by 2029, at a compound annual growth rate (CAGR) of 7.8% during the forecast period.The key players Intel Corporation (US), Qualcomm (US), Texas Instruments Incorporated (US), Cisco Systems, Inc. (US), Hewlett Packard Enterprise (US), IBM (US), STMicroelectronics (Switzerland), Microsoft, PTC Inc. (US), and Amazon Web Services (US).
- Published: April 2024
- Price: $ 4950
- TOC Available:
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Aircraft High Lift Systems Market by Type (Active, Passive) Device (Trailing Edge, Leading Edge), Application (Commercial, Military, Business Aviation), End User (OEM, MRO, Aftermarket), and Region - Global Forecast to 2022
Aircraft high lift systems now are considered as one of the crucial systems in the aircraft operations such as aircraft take-off and landing. The main purpose of these systems is to achieve high lift coefficient during the aforementioned aircraft operations. Aircraft high lift system are more crucial in military aircrafts, which operates under extreme conditions and require high maneuverability and higher lift coefficients.
- Published: January 2025
- Price: $ 4950
- TOC Available:
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Composable Applications Market by Offering (Platform And Services), Vertical (BFSI, Retail & eCommerce, Government, Healthcare & Life Sciences, Manufacturing, IT & ITeS, Energy & Utilities), & Region (North America, Europe, APAC, RoW) – Global Forecast to 2028
MarketsandMarkets forecasts the composable applications market size is projected to reach USD 11.8 billion by 2028 at a CAGR of 17.5% during the forecast period. Key players in the composable applications market include Salesforce (US), Dell Boomi (US), MuleSoft (US), Informatica (US), Software AG (Germany), TIBCO Software (US), Mendix (US), OutSystems (US).
- Published: April 2023
- Price: $ 4950
- TOC Available:
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Heat Curing Adhesive Market by Type (Epoxy Resin, Phenol-formaldehyde Resins, Polyurethane), by Application (Automotive Industry, Metal Fabrication and Aerospace Industry), and by Region - Trends & Forecasts to 2019
Heat curing adhesives require high temperatures for a specified period of time to achieve cure. Because they are heat cured, cured adhesives generally provide the highest strength, heat resistance and chemical resistance. Although adhesion to plastic substrates is generally good, they can only be used to bond plastics that have softening points sufficiently above the cure temperature of the adhesive. These adhesives are supplied as liquid, paste, and film.
- Published: January 2025
- Price: $ 4950
- TOC Available:
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