Here are relevant reports on : power-management-ic-market

• Semiconductor Market for Robots Size, Share by Component (Compute, Sensors, Memory, Power Management ICs), Robot Type (Industrial Robots, Professional Service Robots, Personal & Household Service Robots, Drones), Vertical - Global Forecast to 2030

  The semiconductor market for robots is expected to grow from USD 11.23 billion in 2025 to USD 41.24 billion by 2030, at a compound annual growth rate (CAGR) of 29.7% during the forecast period. The Key Players Texas Instruments Incorporated (US), Infineon Technologies AG (Germany), NXP Semiconductors (Netherlands), STMicroelectronics (Switzerland), Sony Group Corporation (Japan), NVIDIA Corporation (US), Intel Corporation (US), Advanced Micro Devices, Inc. (US), Hesai Group (China), and Bosch Sensortec GmbH (Germany).

  • Published: August 2025
  • Price: $ 4950
  • TOC Available:

• Power Line Communication Market by Offering (Hardware, Software, and Services), Frequency (Narrowband, and Broadband), Application (Energy Management and Smart Grid, and Indoor Networking), Vertical, and Geography - Global Forecast to 2023

  The power line communication market is valued at USD 5.5 billion in 2017 and is expected to reach USD 9.5 billion by 2023, at a CAGR of 9.5% during the forecast period. The need for cost effective installations, growing deployment of smart grids, and high penetration of broadband power line communication devices in the indoor networking application is likely to propel the growth of the market. Some of the major companies operating in the said market are Siemens (Germany), NETGEAR (US), ABB (Switzerland), AMETEK (US), Schneider Electric (France), General Electric (US), Hubbell Power Systems (US), TP-Link Technologies (China), D-Link (Taiwan), Landis+Gyr (Switzerland), Belkin International (US), devolo (Germany), and Zyxel Communications (Taiwan).

  • Published: December 2017
  • Price: $ 4950
  • TOC Available:

• System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

  The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.

  • Published: November 2017
  • Price: $ 4950
  • TOC Available:

• Energy Harvesting System Market by Light Energy Harvesting, Vibration Energy Harvesting, RF Energy Harvesting, Thermal Energy Harvesting, Transducers, Power Management Integrated Circuits, Building & Home Automation - Global Forecast to 2030

  The energy harvesting system market is expected to grow from USD 0.61 billion in 2025 to USD 0.94 billion by 2030, at a compound annual growth rate (CAGR) of 9.1% during the forecast period.The key players STMicroelectronics (Switzerland), Microchip Technology Inc. (US), Texas Instruments Incorporated (US), Analog Devices, Inc. (US), Infineon Technologies AG (Germany), Renesas Electronics Corporation (Japan), EnOcean GmbH (Germany), ABB (Switzerland), Honeywell International Inc. (US), Qorvo, Inc. (US).

  • Published: March 2025
  • Price: $ 4950
  • TOC Available:

• Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Technique (RHBD, RHBP), Product Type (COTS, Custom), Application and Region - Global Forecast to 2030

  The global radiation hardened electronics market is expected to grow from USD 1.77 billion in 2025 to USD 2.30 billion by 2030, at a compound annual growth rate (CAGR) of 5.4% during the forecast period. The Key Players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US).

  • Published: September 2025
  • Price: $ 4950
  • TOC Available:

• Active Network Management Market by Component (Software and Services), Service (Professional and Managed Services), Organization Size (SMEs and Large Enterprises), Application Area (Power, Energy & Utilities), and Region - Global Forecast to 2023

  The global ANM market size is expected grow from USD 682 million in 2018 to USD 1,411 million by 2023, at a Compound Annual Growth Rate (CAGR) of 15.6% during the forecast period. The growth in renewable energy commercialization and increasing demand for uninterruptable transmission of electricity among users will drive the market. Major technology vendors in the ANM market include General Electric (US), ABB (Switzerland), Siemens (Germany), Schneider Electric SE (France), Itron (US), Landis+Gyr (Switzerland), Cisco (US), IBM (US), Oracle (US), Indra Sistemas (Spain), Chemtrols (India), Camlin (Ireland), Smarter Grid Solutions (UK), ZIV (France), and Argand Solutions (UK).

  • Published: April 2019
  • Price: $ 4950
  • TOC Available:

• Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022

  The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.

  • Published: April 2016
  • Price: $ 4950
  • TOC Available:

• Automotive Switch Market by Type (Knob, Lever, Button, Touchpad & Others), Switch Application (HVAC, Indicator, Electronic, Engine Management, Power Windows, Ignition, Multi-purpose & Others), Vehicle Type and Region - Global Forecast to 2026

  The Automotive Switch Market is expected to grow from USD 6.2 billion in 2021 to USD 7.5 billion by 2026, at a CAGR of 3.8% during the forecast period. The automotive switches market is dominated by global players and comprises several regional players as well. The key players in the automotive switches market are Robert Bosch GmbH (Germany), Continental AG (Germany), ZF Friedrichshafen AG(Germany), Alps Alpine Co., Ltd. (Japan), Panasonic Corporation (Japan).

  • Published: March 2021
  • Price: $ 4950
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• Industrial Reels Market by Hose Reel, Cable Reel, Static Grounding Reel, Rewind Type (Manual Crank, Electric, Hydraulic, Pneumatic), Power Supply Management, DEF Dispensing, Construction & Infrastructure, Refuelling Stations - Global Forecast to 2030

  The global industrial reels market is expected to grow from USD 0.50 billion in 2025 to USD 0.62 billion by 2030, at a compound annual growth rate (CAGR) of 4.4% during the forecast period. Tha Key Players Hannay Reels Inc. (US), Reelcraft Industries (US), Coxreels (US), Nederman Holding AB (Sweden), Caxotec SA (Switzerland), United Equipment Accessories, Inc. (US), Cejn, Ab (Sweden), Hubbell (US), Winkel GmbH (Germany), SANKYO REELS (Japan), The Ericson Manufacturing Co (US), Conductix-Wampfler GmbH (Germany), Paul Vahle GmbH & Co. KG (Germany), Molex (US), Hartmann & König Stromzuführungs AG (Germany).

  • Published: May 2025
  • Price: $ 4950
  • TOC Available:

• Field Device Management Market by Offering (Hardware and Software), Deployment (Cloud and On-premises), Industry (Oil & Gas, Energy & Power, Chemicals, Pharmaceuticals, Automotive, Manufacturing), Protocol and Geography - Global Forecast to 2024

  The field device management market is projected to grow from USD 1.3 billion in 2019 to USD 1.8 billion by 2024; it is expected to grow at a compound annual growth rate (CAGR) of 6.7%. Siemens AG (Siemens, Germany); Emerson Electric Co. (Emerson, US); ABB Group (ABB, Switzerland); Schneider Electric (Schneider Electric, France); Honeywell International Inc. (Honeywell, US); Rockwell Automation, Inc. (Rockwell, US); Yokogawa Electric Corporation (Yokogawa, Japan); OMRON Corporation (OMRON, Japan); Mitsubishi Electric Corporation (Mitsubishi Electric, Japan); Fanuc Corporation (Fanuc, Japan); Metso Corporation (Metso, Finland); Valmet Oyj (Valmet, Finland); Hamilton Company (Hamilton, US); Phoenix Contact GmbH & Co. KG (Phoenix Contact, Germany); Endress+Hauser AG (Endress+Hauser, Switzerland); Festo AG (Festo, Germany); Omega Engineering (Omega, UK); Hach (Hach, US); Azbil Corporation (Azbil Corporation, Japan); and Weidmüller (Weidmüller, Germany) are among a few major players in the field device management market.

  • Published: May 2019
  • Price: $ 4950
  • TOC Available:

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