Radiation Hardened Electronics Market Size & Share

Updated on : October 23, 2024

Radiation Hardened Electronics Market Size

[252 Pages Report] The radiation-hardened electronics market size is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, growing at a CAGR of 4.8% from 2024 to 2029. The market for radiation-hardened electronics is growing due to factors like constant research and development in the material used in electronics, design of the electronics, and testing methodologies. These continuous efforts by the semiconductor companies are improving the performance, reliability, and affordability of radiation-hardened electronic devices.

Silicon, silicon carbide, gallium nitride, and gallium arsenide are the materials widely used in radiation-hardened electronic devices. Two techniques are used to manufacture radiation-hardened electronic devices: radiation hardening by process and radiation hardening by design. The methods have different prices and are used for various technical solutions. The manufacturing process of radiation hardening by design will be in demand. This technique is used in manufacturing radiation devices in space, satellite, and defense applications.

Radiation Hardened Electronics Market Forecast to 2029

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Radiation-Hardened Electronics Market Trends:

Driver: Increasing intelligence, surveillance, and reconnaissance (ISR) activities.

Intelligence, surveillance, and reconnaissance (ISR) operations are increasing daily in the defense industry to stay one step ahead of enemies and allies. Any ISR operation can be successful if high-quality, reliable, and environmentally acceptable end products are used. Hence, the latest processors, controllers, and electronic equipment are preferred for space and military applications during ISR operations. Electronic equipment must survive in highly challenging environments for an average of 15 years without degrading its performance and power, especially in space operations.

Restraint: Difficulties in creating an authentic testing environment

For the development of radiation-hardened devices, intense testing is required. The applications of radiation-hardened devices are in industries like space and nuclear power plants. Creating a testing environment representing space, a nuclear war, or a defense setup is expensive. Natural environments expose electronics to a complex mix of radiation types, energies, and intensities. To replicate that with accuracy in a testing lab is difficult and often requires multiple sources and techniques.

Opportunity: Increasing demand for commercial-off-the-shelf components in space satellite

As the demand for small and low earth orbit satellites grows, commercial off-the-shelf (COTS) products also increase. For instance, in January 2022, Space X launched a small 105 satellites with a low-cost "Rideshare Mission" to provide modest payloads and affordable access to space. COTS components are beneficial for mission-specific small satellites. COTS solutions have cost-saving features for low-earth orbit satellites, space rovers and robots, launchers, and other applications. In radiation-hardened electronics industry These products have solid architecture and provide peripherals like ETHERNET and CAN.

Challenge: Customized requirements from high-end consumers

One of the significant challenges radiation-hardened electronic device manufacturers face is the specific customization required for applications. Radiation-hardened electronic devices have considerable applications in space and the defense sector. The defense and space missions are very confidential and application-oriented, which is why there is a significant difference between the requirements of one consumer and another. To meet the consumer's requirements, the companies require time, money, and a lot of research and development. Companies also need to change their design technique for each customized need of the end user, such as radiation hardening by design and process. This also results in long development cycles of radiation-hardened components.

Radiation-hardened Electronics Market Map

Radiation-hardened Electronics Market Segmentation

Radiation-Hardened Electronics Market Share

Processors & controllers component will hold significant market share in radiation-hardened electronics market during the forecast period.

Processors and controllers are crucial in synchronizing, directing, and controlling components and ensuring they function accurately. Any failure in processors or controllers can risk the entire space mission. Hence, it is imperative that processors can withstand the space environment and the effects of radiation. Spacecraft system designers adopt radiation-hardened FPGAs to obtain high-speed data communication and improve onboard data processing in extreme space environments.

RHBP is expected to grow at a significant CAGR during the forecast period.

The RHBP technique uses IC fabrication and modifications to harden electronic components. RHBP tackles radiation head-on by creating transistor bodies less sensitive to degrading effects. The method can be widely used where there is not much demand for radiation-hardened components because manufacturers need to modify their IC fab for huge-volume production, which is time-consuming and expensive.

The commercial-off-the-shelf product type segment is expected to dominate the radiation-hardened electronics market from 2024 to 2029.

Radiation-hardened electronics are increasingly being adopted by commercial small satellites and military satellites. The space industry is also continuously booming with NASA deep space missions, mega-constellations of small satellites, etc., demanding microelectronics with high reliability and low-cost benefits. This can be achieved through COTS devices as they can be replaced with pin-out compatible ceramic packages, which offer the same functionality as the original device. This helps to achieve significant cost savings and reduces the risk and development time.

Radiation Hardened Electronics Market Regional Analysis

Radiation hardened electronics market in China is expected to maintain the highest CAGR in Asia Pacific region share during 2024

China has made significant progress in the space industry, has a nearly complete range of satellite launch vehicles, and can accomplish various space missions. These include remote sensing satellites with various resolutions covering various spectrums, satellite navigation systems, communication satellites, robust human spaceflight, and the lunar exploration program. Government investments in space technology have a dual purpose. The government of China has plans to become a power in the aerospace industry by 2030 and wants to become a significant power in space by 2045.

Radiation Hardened Electronics Market Growth by Region

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Top Radiation Hardened Electronics Companies: Key players

Key players in the radiation-hardened electronics companies are

• Microchip Technology Inc.(US),
• BAE Systems (UK),
• Renesas Electronics Corporation (Japan),
• Infineon Technologies AG (Germany),
• STMicroelectronics (Switzerland),
• AMD (US),
• Texas Instruments Incorporated (US),
• Honeywell International Inc. (US),
• Teledyne Technologies Inc. (US), and
• TTM Technologies, Inc. (US).
• SMEs/startups covered in the study are Cobham Limited (UK),
• Analog Devices, Inc (US),
• Data Devices Corporation (US),
• 3D Plus (France),
• Mercury Systems, Inc. (US),
• PCB Piezotronics, Inc (US),
• Vorago Technologies  (US),
• Micropac Industries, Inc (US),
• GSI technology, Inc (US),
• Everspin Technologies Inc (US),
• Semiconductor Components Industries, LLC (US),
• AiTech (US),
• Microelectronics Research Development Corporation (US),
• Space Micro, Inc (US), and
• Triad Semiconductor ( US).

Radiation-Hardened Electronics Market Report Scope:

Radiation Hardened Electronics Market Size  Highlights

This report categorizes the Radiation Hardened Electronics Market size based on Component, Manufacturing Technique, Product Type, Application, and Region.

Recent Developments in Radiation Hardened Electronics Industry

• In January 2024, Infineon Technologies AG unveiled radiation-hardened asynchronous static random-access memory (SRAM) chips for space applications. These chips, with RADSTOP technology, enhance radiation hardness. This also helps in providing high reliability and performance in harsh environments.
• In September 2023, Infineon Technologies collaborated with Chinese firm Infypower in the new energy vehicle charger market to provide 1200 V CoolSiC MOSFET power semiconductors. This partnership aimed to enhance efficiency in electric vehicle charging stations by offering a wide constant power range, high density, minimal interference, and high reliability for Infypower's 30 kW DC charging module.

Critical questions answered by this report:

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