Here are relevant reports on : fuzzy-logic-market

• IoT Chip Market Size, Share by Hardware (Processor, Connectivity IC, Sensor, Memory Device and Logic Device), Power Consumption, End-use Application (Wearable Devices, Consumer Electronics, Building Automation and Retail) and Region - Global Forecast to 2025

  The IoT Chip Market is expected to grow from USD 392.0 billion in 2020 to USD 525.4 billion by 2025, at a CAGR of 6.0% during the forecast period. Key players in the IoT chip market are Intel Corporation (US), Texas Instruments Incorporated (US), Qualcomm Incorporated (US), NXP Semiconductors N.V. (Netherlands), MediaTek Inc. (Taiwan), Marvell Technology Group Ltd. (Bermuda), Microchip Technology Inc. (US), Cypress Semiconductor Corporation (US), Renesas Electronics Corporation (Japan), Huawei Technologies Co., Ltd. (China), NVIDIA Corporation (US), Samsung Electronics (South Korea), Advanced Micro Devices (US), STMicroelectronics N.V. (Switzerland), TE Connectivity Ltd (Switzerland), Nordic Semiconductor (Norway), GainSpan (US), Expressif Systems (China), Dialog Semiconductor (UK), and Silicon Labs (US). These players are increasingly undertaking product launches and developments and acquisitions to develop and introduce new technologies and products in the market.

  • Published: June 2020
  • Price: $ 7150
  • TOC Available:

• Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

  The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).

  • Published: September 2022
  • Price: $ 4950
  • TOC Available:

• Industrial IoT Market Size, Share & Industry Trends Growth Analysis Report by Offering (Hardware (Processors, Connectivity ICs, Sensors, Memory Devices, Logic Devices), Software (PLM, MES, SCADA, OMS), Platforms), Connectivity Technology, Deployment, Vertical and Region - Global Forecast to 2029

  The industrial IoT market is expected to grow from USD 194.4 billion in 2024 to USD 286.3 billion by 2029, at a compound annual growth rate (CAGR) of 8.1% during the forecast period.The key players ABB (Switzerland), General Electric (US), Emerson Electric Co. (US), Intel Corporation (US), Cisco Systems, Inc. (US), SAP SE (Germany), Honeywell International Inc. (US), Siemens (Germany), Huawei Technologies Co., Ltd. (China), Rockwell Automation (US), Arm Limited (UK), PTC (US), Dassault Systèmes (France), IBM (US), Robert Bosch GmbH (Germany), NEC Corporation (Japan), ANSYS, Inc. (US), Worldsensing (Spain), Arundo (Norway), Software AG (Germany).

  • Published: June 2024
  • Price: $ 4950
  • TOC Available:

• Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029

  The global interposer and FOWLP market size is expected to grow from USD 35.6 billion in 2024 to USD 63.5 billion by 2029, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea).

  • Published: January 2024
  • Price: $ 4950
  • TOC Available:

• High-Integrity Pressure Protection System (HIPPS) Market Size, Share, Statistics and Industry Growth Analysis Report by Component (Field Initiator, Logic Solver, Valves, Actuators), Service (Maintenance, TIC), Industry (Oil & Gas, Chemical) and Region (2025-2030)

  The global High Integrity Pressure Protection System market is anticipated to grow from USD 422.0 million in 2025 to USD 564.2 million by 2030, recording a CAGR of 6.0% during 2025–2030. A few of the key players in the HIPPS market are Emerson Electric Co. (US), Yokogawa Electric Corp. (Japan), HIMA (Germany), Rockwell Automation Inc. (US), Schneider Electric (France), Honeywell International (US), ABB (Switzerland), Siemens (Germany), Schlumberger (US), and Baker Hughes (US) are among the major players in the HIPPS market.

  • Published: January 2022
  • Price: $ 4950
  • TOC Available:

• IoT Technology Market Size, Share & Trends by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2030

  The IoT technology market is expected to grow from USD 959.30 billion in 2025 to USD 1,148.62 billion by 2030, at a compound annual growth rate (CAGR) of 3.7% during the forecast period. The Key Players Intel Corporation (US), Qualcomm (US), Texas Instruments Incorporated (US), Cisco Systems, Inc. (US), Hewlett Packard Enterprise (US), IBM (US), STMicroelectronics (Switzerland), Microsoft, PTC Inc. (US), and Amazon Web Services (US).

  • Published: October 2025
  • Price: $ 4950
  • TOC Available:

• Aircraft High Lift Systems Market by Type (Active, Passive) Device (Trailing Edge, Leading Edge), Application (Commercial, Military, Business Aviation), End User (OEM, MRO, Aftermarket), and Region - Global Forecast to 2022

  Aircraft high lift systems now are considered as one of the crucial systems in the aircraft operations such as aircraft take-off and landing. The main purpose of these systems is to achieve high lift coefficient during the aforementioned aircraft operations. Aircraft high lift system are more crucial in military aircrafts, which operates under extreme conditions and require high maneuverability and higher lift coefficients.

  • Published: March 2026
  • Price: $ 4950
  • TOC Available:

• Composable Applications Market by Offering (Platform And Services), Vertical (BFSI, Retail & eCommerce, Government, Healthcare & Life Sciences, Manufacturing, IT & ITeS, Energy & Utilities), & Region (North America, Europe, APAC, RoW) – Global Forecast to 2028

  The composable applications market size is projected to reach USD 11.8 billion by 2028 at a CAGR of 17.5% during the forecast period. Key players in the composable applications market include Salesforce (US), Dell Boomi (US), MuleSoft (US), Informatica (US), Software AG (Germany), TIBCO Software (US), Mendix (US), OutSystems (US).

  • Published: April 2023
  • Price: $ 4950
  • TOC Available:

• Middle East and Africa Dental Equipment Market by Product (Therapeutic (Dental Chairs,Dental Units, CAD/CAM, Dental Lasers, Nd:YAG Lasers, Carbon dioxide lasers), Diagnostic (Dental imaging, CBCT)), End User (Dental Hospitals & Dental Clinics)- Forecast 2031

  The Middle East and Africa dental equipment market, valued at US$0.25 billion in 2025, stood at US$0.27 billion in 2026 and is projected to advance at a resilient CAGR of 6.8% from 2026 to 2031, culminating in a forecasted valuation of US$0.40 billion by the end of the period.

  • Published: January 2026
  • Price: $ 4950
  • TOC Available:

• Heat Curing Adhesive Market by Type (Epoxy Resin, Phenol-formaldehyde Resins, Polyurethane), by Application (Automotive Industry, Metal Fabrication and Aerospace Industry), and by Region - Trends & Forecasts to 2019

  Heat curing adhesives require high temperatures for a specified period of time to achieve cure. Because they are heat cured, cured adhesives generally provide the highest strength, heat resistance and chemical resistance. Although adhesion to plastic substrates is generally good, they can only be used to bond plastics that have softening points sufficiently above the cure temperature of the adhesive. These adhesives are supplied as liquid, paste, and film.

  • Published: March 2026
  • Price: $ 4950
  • TOC Available:

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