Heat Curing Adhesive Market

Heat curing adhesives require high temperatures for a specified period of time to achieve cure. Because they are heat cured, cured adhesives generally provide the highest strength, heat resistance and chemical resistance. Although adhesion to plastic substrates is generally good, they can only be used to bond plastics that have softening points sufficiently above the cure temperature of the adhesive. These adhesives are supplied as liquid, paste, and film.

Heat curing adhesives are classified as Epoxy Resin, Phenol-formaldehyde Resins, and Polyurethane. Epoxy resin is the most widely used raw material for formulating heat curing adhesives. Cured adhesives are hard and rigid but tough with excellent chemical and heat resistance.

The Heat curing adhesives market is largely driven by stringent regulatory requirements. The Heat curing adhesives manufacturers are trying to comply with local, state, country, and international volatile organic compound standards. In doing so, many adhesive suppliers have shifted the focus of their products from solvent-based adhesives to water-borne adhesives in the last few years. Whereas focus on growth and consolidation, innovative product development to meet need for varied bonding performance and increasing consumer awareness are the factors driving the growth of this market.

Heat curing adhesives are used across various applications. Heat curing adhesives are used in applications, such as Glass Industry, Automotive Industry, Metal Fabrication and Aerospace Industry.

The Heat curing adhesives has grown significantly during the past few years and is projected to display higher growth rates in the next five years. The growing automotive and aerospace industry, has led to the growth of the Heat curing adhesives during the forecast period 2014-2019.

The report covers the Heat curing adhesives market in the key regions, namely Asia-Pacific, North America, Europe, and RoW.

The report aims to study the market of Heat curing adhesives market for 2014, and project the expected demand for the period 2014–2019. It provides a comprehensive review of the main market drivers, restraints, opportunities, winning imperatives, challenges, and key issues in the market. The Heat curing adhesives market is further segmented, estimated, and forecasted on the basis of type and application. Various secondary sources, such as encyclopedia, directories, and databases have been used to identify and collect information useful for an extensive research on this market. The primary sources, experts from related industries and suppliers, have been interviewed to obtain and verify critical information as well as to assess the future prospects of the heat curing adhesives industry.

Competitive scenario of the top players in this market is discussed in detail. We have also profiled the leading players of this industry with their recent developments and other strategic industry activities. These include Master Bond (U.S.), DOW (U.S.), Dymax Corp. (U.S.), UHU GmbH & Co KG (Germany) among others.

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On the basis of type: This market is segmented on the basis of type of Heat curing adhesives market: Epoxy Resin, Phenol-formaldehyde Resins, and Polyurethane. Each product type is further described in detail in the report, from both the value and volume perspective for each product type.

On the basis of application: Automotive Industry, Metal Fabrication and Aerospace Industry. Each application is further described in detail in the report, from the value and volume perspective for each application.

On the basis of region: Asia-Pacific, North America, Europe, and Rest of the World, U.S., China, and Canada.