Here are relevant reports on : slot-die-coater-market
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Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
- Published: November 2019
- Price: $ 4950
- TOC Available:
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CAM Software Market by Application (Machining & Production (CNC Machining, Sheet Metal Fabrication), Product Design & Prototyping (Additive/3D Printing, Tool & Die Manufacturing), Quality Control & Inspection), 2D, and 3D - Global Forecast to 2030
The CAM Software Market size is projected to reach USD 5.69 billion by 2030 at a compounded annual growth rate (CAGR) of 9.0% during the forecast period. Some of the computer-aided manufacturing vendors include Autodesk (US), Siemens (Germany), Hexagon (Sweden), Dassault Systemes (France), Hypertherm (US), PTC (US), SolidCAM (US), TopSolid (France), CAMWorks (US) and MasterCAM (US).
- Published: November 2024
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
- TOC Available:
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Mold Release Agents Market by Type (Water-based, Solvent-based), Application (Die-casting, Rubber Molding, Plastic Molding, Concrete, PU Molding, Wood Composite & Panel Pressing, Composite Molding, Others), & Region - Global Forecast to 2029
The mold release agents market is expected to grow from USD 2.2 billion in 2024 to USD 2.9 billion by 2029, at a CAGR of 6.1% during the forecast period. The key players profiled in the report include Freudenberg Group (Germany), Daikin Industries, Ltd. (Japan), Henkel AG & Co. KGaA (Germany), LANXESS AG (Germany), Shin-Etsu Chemical Co. Ltd. (Japan), Dow Inc. (US), Michelman, Inc. (US), Marbocote Ltd (UK), McGee Industries, Inc. (US), Miller-Stephenson, Inc. (US).
- Published: May 2024
- Price: $ 4950
- TOC Available:
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Aluminum Casting Market by Process (Die Casting, Permanent Mold Casting, Sand Casting), End-use Sector (Transportation, Industrial, Building & Construction), and Region (APAC, Europe, North America, South America, MEA) - Global Forecast to 2026
The aluminum casting market is projected to reach USD 100.5 billion by 2026. It is expected to grow at a CAGR of 7.4% during the forecast period.The key companies profiled in this report on the aluminum casting market include Alcoa Corporation (US), Ryobi Limited (Japan), Aluminum Corporation of China Limited (China), Rio Tinto (UK), United Company RUSAL (Russia) are key players in aluminum casting market.
- Published: October 2021
- Price: $ 4950
- TOC Available:
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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Sputter Coater Market by Substrate Type (Metal, Glass, Semiconductor), Target Type (Metal, Compound), End-Use Industry (Automotive, Electronics & Semiconductor, Institutes), and Region (North America, EU, APAC, South America, MEA) - Global Forecast to 2022
The sputter coater market is projected to grow from USD 595.8 Million in 2017 to USD 804.2 Million by 2022, at a CAGR of 6.2% between 2017 and 2022. The growth of the sputter coater market can be attributed to the growth of the electronics & semiconductor industry. The rising use of sputter coaters in electronics & semiconductor and medical applications is expected to drive the market during the forecast period. Key companies profiled in the sputter coater market research report are ULVAC (Japan), Quorum Technologies (UK), Bühler (Switzerland), Cressington Scientific Instruments (UK), Hitachi High-Technologies Corporation (Japan), Oxford Instruments (UK), Semicore Equipment (US), PLASSYS Bestek (France), PVD Products (US), and Denton Vacuum (US).
- Published: March 2018
- Price: $ 4950
- TOC Available:
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Continuous Manufacturing Market By Product (Integrated system, Semi-continuous (Granulator, Coater, Blender), Control), Application (API, End Product (Solid Dosage)), End User (R&D Department (CRO), Pharmaceutical Companies, CMO).
The global continuous manufacturing market is projected to grow at a CAGR of 13.3%. Major players in this market include GEA Group AG (Germany), Thermo Fisher Scientific Inc. (U.S.), Bosch Packaging Technology (Germany), Coperion GmbH (Germany), and Glatt GmbH (Germany). Other players include KORSCH AG (Germany), Munson Machinery Company, Inc. (U.S.), L.B. Bohle Maschinen + Verfahren Gmbh (Germany), Gebrüder Lödige Maschinenbau GmbH (Germany), Baker Perkins Ltd. (U.K.), Scott Equipment Company (U.S.), and Sturtevant, Inc. (U.S.).
- Published: April 2017
- Price: $ 4950
- TOC Available:
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Snack Pellet Equipment Market Product Type (Potato-Based, Corn-Based, Rice-Based, Tapioca-Based, Multigrain-Based), Form (2D, Tridimensional, Die-Faced), Equipment Type (Extrusion, Mixing, Cutting, Drying, Frying, Seasoning), and Region - Global Forecast to 2025
The snack pellet equipment market is estimated to account for nearly USD 1.0 billion in 2019 and is projected to reach a value of nearly USD 1.4 billion by 2025, recording a CAGR of 5.2%. The snack pellet segment is driven by the increasing need for convenience foods due to the busy lifestyles of consumers. Thus, the increasing consumer preference for processed foods contributes to the growing demand for snack pellets as they require less time and efforts to prepare. This, in turn, has contributed to the growth of the snack pellet equipment market. Easy availability is also one such factor, which significantly impacts the consumption and demand for snack pellets.Clextral (France), GEA Group (Germany), Buhler AG (Switzerland), N.P. & Company, Inc. (Japan), Kiremko B.V. (Netherlands), JAS Enterprises (India), Grace Food Processing & Packaging Machinery (India), Tsung Hsing Food Machinery Co., Ltd. (Taiwan), AC Horn Manufacturing (US), Jinan Dayi Extrusion Machinery Co., Ltd (China), Mutchall Engineering Pvt. Ltd (India), and Radhe Equipments India (India).
- Published: April 2019
- Price: $ 4950
- TOC Available:
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Snack Pellets Market by Type (Potato, Corn, Rice, Tapioca, Multigrain), Form (Laminated, Tridimensional, Die-face, Gelatinized), Technique (Twin-screw extruder, Single-screw extruder), Flavor (Plain, Flavored, Nutritional), and Region – Global Forecast to 2023
The snack pellets market is estimated to account for about USD 2.0 billion in 2018 and is projected to reach a value of about USD 2.5 billion by 2023, at a CAGR of 5.3%. The growth of the snack pellets market is driven by the rising demand for prepared and convenience food products. In addition to this, the growing focus on facility expansion, marketing schemes, and information exchange programs for creating awareness to enhance the consumption of snack pellets has contributed to the growth of the market.include Limagrain Céréales Ingrédients (France), Liven S.A. (Spain), Grupo Michel (Mexico), Leng d'Or S.A. (Spain), Pellsnack-Products GmbH (Germany), J. R. Short Milling (US), Pasta Foods Ltd (UK), Noble Agro Food Products Ltd (India), Bach Snacks s.a.l. (Lebanon), Mafin Spa (Italy), Le Caselle S.p.A. (Italy), and Van Marcke Foods (the Netherlands).
- Published: November 2018
- Price: $ 4950
- TOC Available:
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