Semiconductor & IC Packaging Materials Market

Report Code CH 2348
Published in Mar, 2024, By MarketsandMarkets™
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029

Overview

The semiconductor materials market & IC packaging materials market is valued at USD 43.9 billion in 2024 and is projected to reach USD 70.9 billion by 2029, growing at 10.1% cagr from 2024 to 2029. The market growth is driven by increasing demand from consumer electronics industry, growing miniaturization and densification in the electronic sector and adoption of emerging technologies like 5G and autonomous vehicles.

Attractive Opportunities in the Semiconductor Materials Market

ASIA PACIFIC

Market growth in the Asia Pacific can be attributed to growing demand of consumer electronics in the region.

Asia Pacific has a large and growing semiconductor industry, which is a major driver of demand for IC packaging materials in the region.

Different government initiatives for sustainable development along with the increasing demand for various industries for the semiconductor & IC packaging materials market

The Asia Pacific semiconductor & IC packaging materials market is expected to be worth USD 43.4 billion by 2029, growing at CAGR of 9.9% during the forecast period.

Integration with advanced technologies & need for customization in the electronic industry to create opportunities for the semiconductor & IC packaging materials market.

Global Semiconductor Materials Market Dynamics

DRIVER: Increasing demand from consumer electronics market

The semiconductor and IC packaging material industry is propelled forward by the rising demand from the consumer electronics sector, including smartphones, tablets, laptops, and smartwatches, which heavily rely on semiconductor chips and integrated circuits (ICs) for their functionalities. As consumers seek more compact, faster, and feature-rich electronic products, there's a surge in the need for advanced semiconductor components and packaging materials. This demand surge is driven by factors such as miniaturization and integration of functions, heightened performance expectations, the growth of IoT and connected devices, advancements in display and sensor technologies, and the expanding global market for consumer electronics. These drivers collectively fuel innovation, technological progress, and market expansion within the semiconductor and IC packaging material industry, positioning it as a pivotal player in the evolving landscape of consumer electronics.Growing miniaturization and densification in the electronic sector.The growing trend of miniaturization and densification in the electronics sector is a significant driver for the semiconductor and IC packaging materials market. As electronic devices become smaller and more compact, manufacturers face challenges in integrating complex functionalities into limited space. This trend is particularly evident in consumer electronics like smartphones, wearables, and IoT devices, where consumers demand sleek designs without compromising performance. To address these challenges, semiconductor manufacturers are developing advanced chips with higher integration levels, packing more functionalities into smaller components. This trend drives the need for innovative packaging materials that can accommodate these complex chip designs while ensuring reliability, performance, and thermal management. IC packaging materials play a crucial role in enabling miniaturization by providing electrical insulation, mechanical support, thermal dissipation, and signal integrity within the compact space of semiconductor packages. Materials such as organic substrates, leadframes, encapsulation resins, and thermal interface materials are designed to meet the stringent requirements of miniaturized electronics, offering solutions for compact yet efficient packaging solutions. Furthermore, densification in the electronics sector, where more components are packed into smaller areas, increases the demand for advanced packaging materials capable of handling higher pin densities, complex interconnections, and stringent reliability standards. Overall, the trend of miniaturization and densification drives continuous innovation and growth in the semiconductor and IC packaging materials market to meet the evolving needs of the electronics industry.Adoption of emerging technologies like 5G and autonomous vehicles.The adoption of emerging technologies such as 5G and autonomous vehicles is a significant driver for the semiconductor and IC packaging materials market. 5G technology requires high-performance semiconductor chips and advanced packaging materials to support ultra-fast data processing, low-latency communication, and increased connectivity. This drives demand for materials with superior thermal management, signal integrity, and electrical insulation properties. Similarly, autonomous vehicles rely heavily on semiconductor components and ICs for functions like sensors, data processing, and connectivity. Advanced packaging materials are essential to ensure the reliability, durability, and performance of these semiconductor components in harsh automotive environments. As the adoption of 5G and autonomous vehicles continues to grow, the demand for specialized semiconductor and IC packaging materials will increase, driving innovation and growth in the market.

RESTRAINT: IP concerns in the semiconductor industry during outsourcing & testing process

IP concerns in the semiconductor industry during outsourcing and testing processes are a major restraint for the semiconductor and IC packaging materials market. When semiconductor companies outsource manufacturing or testing processes to third-party vendors, there is a risk of intellectual property (IP) theft or leakage. This risk can arise from sharing sensitive design information, manufacturing processes, or proprietary technologies with external partners. Such concerns can hinder collaboration and innovation in the semiconductor industry, leading to reluctance in adopting advanced packaging materials that may involve sharing confidential IP with vendors. Additionally, stringent regulations and legal complexities surrounding IP protection further exacerbate these concerns, impacting the willingness of semiconductor companies to engage in outsourcing and testing activities. As a result, IP concerns act as a significant barrier, limiting market growth and innovation in semiconductor and IC packaging materials.Technological change and obsolescenceTechnological change and obsolescence pose significant restraints for the semiconductor and IC packaging market. Rapid technological advancements lead to frequent upgrades and changes in semiconductor designs, functionalities, and packaging requirements. This dynamic environment increases the risk of product obsolescence, where existing packaging solutions may become outdated or incompatible with newer semiconductor technologies. Moreover, the pace of technological change often outpaces the development of corresponding packaging materials, creating challenges in meeting evolving performance, miniaturization, and functionality demands. Semiconductor companies face the dilemma of investing in costly packaging solutions that may quickly become obsolete or adopting interim solutions that may not fully align with future technology trends. Additionally, managing the transition from older packaging technologies to newer ones requires significant time, resources, and investment, further complicating the market landscape. These factors collectively contribute to technological change and obsolescence acting as restraints for the semiconductor and IC packaging market, impacting market growth and innovation.

 

OPPORTUNITY: Integration with advanced technologies

Integration with advanced technologies presents a significant opportunity for the semiconductor and IC packaging materials market. As industries adopt cutting-edge technologies like artificial intelligence (AI), machine learning (ML), 5G connectivity, Internet of Things (IoT), and autonomous systems, the demand for high-performance semiconductor components and advanced packaging materials increases. These technologies require sophisticated packaging solutions to meet stringent performance, reliability, and thermal management requirements. For example, AI and ML applications demand chips with high computing power and efficient heat dissipation, driving the need for innovative packaging materials that can handle these demands. Similarly, the rollout of 5G networks and the proliferation of IoT devices require semiconductor packages capable of supporting high-speed data transmission, low-latency communication, and connectivity across diverse devices. Advanced packaging materials play a crucial role in enabling these capabilities, creating opportunities for companies specializing in semiconductor and IC packaging materials to innovate and capture a growing market segment.

CHALLENGE: The high cost of advanced materials.

The high cost of advanced materials presents a significant challenge for the semiconductor and IC packaging materials market. Developing and manufacturing cutting-edge materials with enhanced performance, reliability, and functionality often involves substantial research and development (R&D) investments, as well as specialized production processes. These factors contribute to higher production costs, which can be passed on to semiconductor companies and end-users, making advanced packaging materials less cost-effective compared to traditional alternatives. Furthermore, the semiconductor industry operates in a highly competitive and cost-sensitive environment, where companies are constantly seeking ways to reduce production costs and improve profit margins. The high initial investment required for adopting advanced materials may deter some companies, particularly smaller players, from embracing these technologies, leading to slower adoption rates and limited market penetration. Balancing the benefits of advanced materials with cost considerations remains a key challenge for the semiconductor and IC packaging materials market.

Global Semiconductor Materials Market Ecosystem Analysis

A market ecosystem for semiconductor & IC packaging materials refers to the interconnected network of various entities, factors, and dynamics that collectively influence the production, distribution, and consumption of semiconductor & IC packaging materials in the market. This ecosystem involves a range of participants, both internal and external, and includes various components that interact with each other to shape the overall functioning of the market. The key players in the market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.

 

"Organic substrate is the largest sub-segment amongst the type segment in the semiconductor & IC packaging materials market in 2024, in terms of value."

The dominance of organic substrates in the semiconductor and IC packaging materials market stems from several key advantages. These substrates, typified by printed circuit boards (PCBs), offer a cost-effective solution crucial for mass production, aligning with the industry's push for economies of scale. Their excellent electrical insulation properties prevent shorts and maintain signal integrity, while their versatility allows for complex designs and component integration, catering to diverse semiconductor applications. Additionally, their lightweight nature aids in system miniaturization and device portability. Furthermore, their compatibility with standard PCB fabrication processes ensures faster production cycles and reduced time-to-market. Advancements like high-speed laminate materials and low-loss dielectrics have bolstered their performance in signal transmission and thermal management, making organic substrates the preferred choice in modern semiconductor packaging, underscored by their cost-effectiveness, insulation, design flexibility, lightweight build, ease of manufacturing, and continual technological enhancements.

“Small outline package (SOP) accounted for the largest by packaging technology share of the semiconductor & IC packaging materials market in 2024” in terms of value.

Small Outline Package (SOP) technology dominates the semiconductor and IC packaging materials market due to its numerous advantages. SOPs are prized for their compactness and low profile, making them perfect for space-constrained applications like mobile devices, wearables, and IoT gadgets. This compact design not only saves material but also reduces package weight, aligning well with industries focused on lightweight and portable electronics. Moreover, SOPs feature a small lead pitch, allowing for higher pin density and seamless integration of semiconductor components, enhancing functionality within a smaller space. Their compatibility with surface mount technology (SMT) enables automated assembly processes, boosting production efficiency and lowering manufacturing costs. This SMT compatibility also improves thermal management by facilitating direct mounting on PCBs, leading to better heat dissipation and device reliability. SOP technology's versatility is evident in various package configurations like SOP-8, SOP-16, and SOP-28, catering to diverse semiconductor applications. Furthermore, SOPs deliver excellent electrical performance with low parasitic capacitance and inductance, crucial for high-speed digital and analog operations. They also offer robust protection against environmental elements such as moisture and mechanical stress, ensuring semiconductor devices' durability and reliability. In essence, SOP technology's compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and electrical performance collectively establish it as the top choice in the semiconductor and IC packaging materials market.“Consumer electronics accounted for the largest end-use industry for the semiconductor & IC packaging materials market, in terms of value in 2024”The dominance of consumer electronics in the semiconductor and IC packaging materials market is driven by several key factors. Firstly, the industry's widespread use of semiconductor devices and ICs in products like smartphones, tablets, laptops, gaming consoles, smart TVs, and wearables fuels the demand for advanced packaging solutions that meet performance, miniaturization, and functionality requirements. Secondly, the rapid innovation in consumer electronics demands packaging materials that support cutting-edge technologies such as high-speed data processing, AI, AR, and IoT connectivity. Semiconductor packaging materials are essential for providing electrical insulation, thermal management, signal integrity, and mechanical protection to these components. Additionally, the industry's focus on cost-effective solutions, fast time-to-market, and efficient assembly processes drives the adoption of materials like organic substrates, leadframes, encapsulation resins, and advanced die attach materials. The global adoption of consumer electronics drives large-scale production volumes and economies of scale, leading to cost reductions and packaging technology advancements to meet diverse consumer preferences for sleek, lightweight, energy-efficient devices.

ASIA PACIFIC region holds the largest share of the Semiconductor Materials Market.

Asia Pacific stands out as the foremost market for semiconductor and IC packaging materials, driven by various factors that underscore its industry dominance. The region hosts major electronics manufacturing hubs like China, Japan, South Korea, Taiwan, and Singapore, boasting robust semiconductor ecosystems with a comprehensive presence of foundries, packaging facilities, equipment suppliers, and research institutions. This integration creates a highly competitive market environment, fostering continuous innovation and technological advancement, particularly evident in countries like South Korea and Japan renowned for their leadership in semiconductor research and manufacturing. The relentless pursuit of technological excellence propels the demand for high-performance packaging materials capable of meeting the exacting standards of advanced semiconductor devices. Asia Pacific's thriving consumer electronics market further propels this demand, fueled by rising disposable incomes, urbanization, and digitalization trends. This market encompasses a wide array of products such as smartphones, tablets, laptops, smart home devices, wearables, and automotive electronics, all heavily reliant on semiconductor and IC packaging materials for their functionality and performance. The region's strategic position as a global manufacturing hub provides additional advantages, including cost-effectiveness, efficient supply chains, and access to skilled labor. Major semiconductor manufacturers, assembly, and testing facilities, as well as equipment suppliers, bolster Asia Pacific's status as a pivotal market for semiconductor packaging materials. Government initiatives, investment incentives, and favorable business environments further stimulate industry growth and attract foreign investments, contributing significantly to the expansion of the semiconductor and IC packaging materials market in Asia Pacific. Overall, Asia Pacific's leadership in semiconductor manufacturing, technological innovation, growing consumer electronics demand, manufacturing efficiencies, and supportive business climates collectively position it as the largest and most dynamic market for semiconductor and IC packaging materials worldwide.

 
 

Recent Developments of Semiconductor Materials Market industry

  • In March 2024, Kyocera Corporation (Japan), under the leadership of President Hideo Tanimoto, has revealed plans to integrate its existing Shiga Yohkaichi Plant located in Hebimizo-cho, Higashiomi, Shiga, and Shiga Gamo Plant situated in Kawai-cho, Higashiomi, Shiga. This integration aims to bolster operational efficiency, and consequently, the combined entity will be rebranded as the "Shiga Higashiomi Plant." Effective from April 1, 2024, the plant will commence operations under its new name, with no alterations to its physical location. In November 2023, Amkor Technology (US) a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.
  • In June 2023, Henkel AG & Co. AGaA (Germany) has emphasized the significance of India as a key market, highlighting the company's ongoing commitment to invest in laboratory infrastructure and enhance capacity, particularly within the electronics sector. Additionally, Knobel recently inaugurated the Inspiration Centre Dusseldorf (ICD), a project that represents an investment of 130 million euros (USD 141.2 million), demonstrating Henkel's dedication to fostering innovation and growth. In February 2023, LG Chem Ltd. (South Korea) entered into an offtake agreement with Piedmont Lithium, Inc. (US) for 200,000 metric tons of SC6. Starting in the third quarter of 2023, Piedmont will supply 50,000 metric tons annually of SC6 from a Canadian mine, over a period of four years. LG Chem anticipates to extracts around 30,000 metric tons of Lithium hydroxide from this supply.

Key Market Players

KEY PLAYERS IN THE Semiconductor Materials Market INCLUDE

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Scope of the Report

Report Attribute Details
Years considered for the study 2020-2029
Base Year 2023
Forecast period 2024–2029
Units considered Value (USD Billion/Million)
Segments Type, Packaging technology, End-use industry and Region
Regions Asia Pacific, North America, Europe, Middle East & Africa, and South America
Companies LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan)

 

Key Questions Addressed by the Report

What is the expected growth rate of the semiconductor & IC packaging materials market?
This study's forecast period for the semiconductor & IC packaging materials market is 2024-2029. The market is expected to grow at a CAGR of 10.1% in terms of value, during the forecast period.
Who are the major key players in the semiconductor & IC packaging materials market?
LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc. are the leading manufacturers and service provider of semiconductor & IC packaging materials market.
What are the emerging trends in the Semiconductor & IC packaging materials market?
Emerging trends in the semiconductor and IC packaging materials market include the adoption of advanced materials for 5G and IoT applications, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) technologies. There's also a focus on eco-friendly packaging solutions to address sustainability concerns. Additionally, the industry is witnessing increased demand for high-density interconnects (HDI) and flip-chip packaging for enhanced performance and miniaturization. Furthermore, the integration of artificial intelligence (AI) and machine learning (ML) algorithms in packaging processes is gaining traction to improve efficiency and yield rates.
What are the drivers and opportunities for the semiconductor & IC packaging materials market?
The market growth is driven by increasing demand from consumer electronics industry, growing miniaturization and densification in the electronic sector and adoption of emerging technologies like 5G and autonomous vehicles. The opportunity being integration with advanced technologies and need for customization and specialization in the electronic industry.
What are the restraining factors in the semiconductor & IC packaging materials market?
IP concerns in the semiconductor industry during outsourcing & testing process along with Technological change and obsolescence

 

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Table of Contents

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TITLE
PAGE NO
INTRODUCTION
23
RESEARCH METHODOLOGY
28
EXECUTIVE SUMMARY
37
PREMIUM INSIGHTS
41
MARKET OVERVIEW
44
  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    DRIVERS
    - Increasing demand from consumer electronics market
    - Growing miniaturization and densification in electronics sector
    - Adoption of emerging technologies like 5G and autonomous vehicles
    RESTRAINTS
    - IP concerns in semiconductor industry during outsourcing and testing processes
    - Technological change and obsolescence
    OPPORTUNITIES
    - Integration with advanced technologies
    - Need for customization and specialization in electronics industry
    CHALLENGES
    - High cost of advanced materials
    - Stringent regulations and sustainability factor
  • 5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
    REVENUE SHIFT AND NEW REVENUE POCKETS FOR SEMICONDUCTOR & IC PACKAGING MATERIAL MANUFACTURERS
  • 5.4 VALUE CHAIN ANALYSIS
    RAW MATERIAL SUPPLIERS
    MANUFACTURING
    DISTRIBUTION AND LOGISTICS
    END USERS
  • 5.5 INVESTMENT AND FUNDING
  • 5.6 PRICING ANALYSIS
    AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION
    AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION
    AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION
    AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION
  • 5.7 ECOSYSTEM MAP
  • 5.8 TECHNOLOGY ANALYSIS
  • 5.9 PATENT ANALYSIS
    METHODOLOGY
    PATENTS GRANTED WORLDWIDE, 2014–2023
    PATENT PUBLICATION TRENDS
    INSIGHTS
    LEGAL STATUS OF PATENTS
    JURISDICTION ANALYSIS
    TOP COMPANIES/APPLICANTS
    LIST OF MAJOR PATENTS
  • 5.10 TRADE ANALYSIS
    IMPORT SCENARIO
    EXPORT SCENARIO
  • 5.11 KEY CONFERENCES & EVENTS, 2024–2025
  • 5.12 REGULATORY LANDSCAPE
    REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    REGULATIONS RELATED TO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • 5.13 PORTER’S FIVE FORCES ANALYSIS
    THREAT OF SUBSTITUTES
    THREAT OF NEW ENTRANTS
    BARGAINING POWER OF SUPPLIERS
    BARGAINING POWER OF BUYERS
    INTENSITY OF COMPETITIVE RIVALRY
  • 5.14 KEY STAKEHOLDERS AND BUYING CRITERIA
    KEY STAKEHOLDERS IN BUYING PROCESS
    BUYING CRITERIA
  • 5.15 MACROECONOMIC INDICATORS
    GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES
  • 5.16 CASE STUDIES
    AMKOR’S CONTRIBUTION TO ADVANCING AUTOMOTIVE SEMICONDUCTOR SOLUTIONS
    BOLSTERING SEMICONDUCTOR PACKAGING IN US: IMPERATIVE OF NATIONAL ADVANCED PACKAGING MANUFACTURING PROGRAM
    ADVANCING WEARABLE SENSOR TECHNOLOGY: ROLE OF MASTER BOND EP17HTDA-1 DIE ATTACH ADHESIVE IN INTEGRATING ADVANCED SENSOR COMPONENTS
SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE
82
  • 6.1 INTRODUCTION
  • 6.2 ORGANIC SUBSTRATES
    COMPLEX NEEDS OF MODERN ELECTRONIC SEGMENT TO DRIVE GROWTH
  • 6.3 BONDING WIRES
    VITAL FUNCTIONALITY AND ADVANCEMENTS IN BONDING WIRES TO DRIVE MARKET
  • 6.4 LEADFRAMES
    INCREASE IN NEED FOR THERMALLY EFFICIENT MATERIALS FOR SEMICONDUCTORS TO DRIVE DEMAND
  • 6.5 ENCAPSULATION RESINS
    SUPERIOR ELECTRICAL INSULATION, CHEMICAL RESISTANCE, AND MECHANICAL STRENGTH TO DRIVE DEMAND
  • 6.6 DIE ATTACH MATERIALS
    VERSATILITY IN VARIOUS DEVICES FOR MULTIPLE USES TO DRIVE DEMAND
  • 6.7 CERAMIC PACKAGES
    INCREASED USE OF MINIATURIZATION IN ELECTRONICS INDUSTRY TO DRIVE DEMAND
  • 6.8 THERMAL INTERFACE MATERIALS
    INCREASED COMPLEXITY IN ELECTRONIC PRODUCTS TO DRIVE DEMAND
  • 6.9 SOLDER BALLS
    DEMAND FOR COMPACT, EFFICIENT, AND HIGH-PERFORMING DEVICES TO DRIVE MARKET
  • 6.10 OTHER TYPES
SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY
90
  • 7.1 INTRODUCTION
  • 7.2 SMALL OUTLINE PACKAGE (SOP)
    COMPACT, LOW-PROFILE HIGH-PERFORMANCE PACKAGING SOLUTION FOR WIDE RANGE OF ELECTRONIC APPLICATIONS
  • 7.3 GRID ARRAY (GA)
    REDUCTION IN SIGNAL PROPAGATION DELAYS, IMPROVED SIGNAL INTEGRITY, AND ENHANCED SYSTEM PERFORMANCE TO DRIVE MARKET
  • 7.4 QUAD FLAT NO-LEADS (QFN)
    COMPACTNESS, THERMAL EFFICIENCY, ELECTRICAL PERFORMANCE & RELIABILITY MAKE IT PREFERRED CHOICE FOR HIGH DENSITY ELECTRONIC APPLICATIONS
  • 7.5 DUAL FLAT NO-LEADS (DFN)
    COMPACT, COST-EFFECTIVE, AND THERMALLY EFFICIENT SOLUTIONS FOR SPACE-CONSTRAINED ELECTRONIC APPLICATIONS
  • 7.6 QUAD FLAT PACKAGES (QFP)
    HIGH PIN COUNT, IMPROVED THERMAL PERFORMANCE, AND SUITABILITY FOR AUTOMATED ASSEMBLY MAKE IT PREFERRED CHOICE
  • 7.7 DUAL IN-LINE (DIP)
    ROBUSTNESS, SIMPLICITY, AND EASE OF APPLICATION TO DRIVE DEMAND
  • 7.8 OTHER TECHNOLOGIES
    CHIP SCALE PACKAGE (CSP)
    WAFER LEVEL PACKAGING (WLP)
    SYSTEM IN PACKAGE (SIP)
SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY
98
  • 8.1 INTRODUCTION
  • 8.2 CONSUMER ELECTRONICS
    INCREASE IN DEMAND FOR ADVANCED PACKAGING SOLUTIONS TO DRIVE MARKET
  • 8.3 AUTOMOTIVE
    RISE IN DEMAND FOR EVS TO DRIVE MARKET FOR SEMICONDUCTOR & IC PACKAGING MATERIALS
  • 8.4 HEALTHCARE
    DEMAND FOR BIOCOMPATIBILITY, PRECISION, AND RELIABILITY TO DRIVE MARKET
  • 8.5 IT & TELECOMMUNICATION
    SEMICONDUCTOR & IC PACKAGING MATERIALS TO PLAY VITAL ROLE IN MEETING DEMANDS FOR FASTER AND MORE EFFICIENT IT & TELECOMMUNICATIONS SYSTEMS
  • 8.6 AEROSPACE & DEFENSE
    DEMAND FOR LIGHTWEIGHT AND HIGH-PERFORMANCE PACKAGING SOLUTIONS TO DRIVE MARKET
  • 8.7 OTHER END-USE INDUSTRIES
SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION
104
  • 9.1 INTRODUCTION
  • 9.2 ASIA PACIFIC
    RECESSION IMPACT
    CHINA
    - Push toward electric vehicles and government support for domestic semiconductor development to drive market
    JAPAN
    - Focus on high-end technology to drive market
    INDIA
    - Growing automotive and consumer electronics industry coupled with extensive government initiatives to drive market
    SOUTH KOREA
    - Technological prowess and thriving consumer electronics industry to drive market
    TAIWAN
    - Efficient manufacturing capabilities, government support, and focus on technology and innovation to drive demand
    REST OF ASIA PACIFIC
  • 9.3 NORTH AMERICA
    RECESSION IMPACT
    US
    - Growth of automotive electronics and government initiatives to drive demand
    CANADA
    - Focus on high-reliability solutions to drive market
    MEXICO
    - Thriving consumer electronics and automotive manufacturing sectors to drive demand
  • 9.4 EUROPE
    RECESSION IMPACT
    GERMANY
    - Growth of automotive, pharmaceutical, and industrial automation sectors to drive demand
    ITALY
    - Established manufacturing expertise along with government incentives to drive market
    FRANCE
    - Growth in aerospace & defense sector to drive market
    UK
    - Key focus on niche and growing end-use industries to drive demand
    SPAIN
    - Manufacturing sector, along with government’s focus on research & development, to drive demand
    REST OF EUROPE
  • 9.5 MIDDLE EAST & AFRICA
    RECESSION IMPACT
    UAE
    - Commitment to strategic diversification and government initiatives to drive demand
    REST OF GCC COUNTRIES
    ISRAEL
    - Prominent high-tech communication sector coupled with thriving startup ecosystem to drive demand
    SOUTH AFRICA
    - Automotive electronics sector to drive demand
    REST OF MIDDLE EAST & AFRICA
  • 9.6 SOUTH AMERICA
    RECESSION IMPACT
    ARGENTINA
    - Government incentives and policies to attract foreign investment to drive demand
    BRAZIL
    - Thriving electronics sector along with government initiatives attracting foreign investments to support market growth
    REST OF SOUTH AMERICA
COMPETITIVE LANDSCAPE
156
  • 10.1 INTRODUCTION
    OVERVIEW OF STRATEGIES ADOPTED BY KEY SEMICONDUCTOR & IC PACKAGING MANUFACTURERS
  • 10.2 MARKET SHARE ANALYSIS
    RANKING OF KEY MARKET PLAYERS, 2022
    MARKET SHARE OF KEY PLAYERS
    BRAND/PRODUCT COMPARATIVE ANALYSIS
    - Jiangsu ChangJian Technology Co., Ltd.
    - Henkel AG & Co. KGaA
    - Amkor Technology
    - ASE
    - Siliconware Precision Industries Co., Ltd. (SPIL)
  • 10.3 REVENUE ANALYSIS
  • 10.4 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
    STARS
    EMERGING LEADERS
    PERVASIVE PLAYERS
    PARTICIPANTS
    COMPANY FOOTPRINT: KEY PLAYERS, 2023
  • 10.5 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
    PROGRESSIVE COMPANIES
    RESPONSIVE COMPANIES
    DYNAMIC COMPANIES
    STARTING BLOCKS
    COMPETITIVE BENCHMARKING
    - Detailed list of key start-ups/SMES
    - Competitive benchmarking of key start-ups/SMEs
    VALUATION AND FINANCIAL METRICS OF KEY SEMICONDUCTOR & IC PACKAGING VENDORS
  • 10.6 COMPETITIVE SCENARIO AND TRENDS
    PRODUCT LAUNCHES
    DEALS
    EXPANSIONS
COMPANY PROFILES
180
  • 11.1 KEY PLAYERS
    LG CHEM.
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    HENKEL AG & CO. KGAA
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    KYOCERA CORPORATION
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    ASE
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    SILICONWARE PRECISION INDUSTRIES CO., LTD.
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    AMKOR TECHNOLOGY
    - Business overview
    - Products offered
    - Recent developments
    - MnM view
    TEXAS INSTRUMENTS
    - Business overview
    - Products offered
    - Recent development
    - MnM view
    IBIDEN CO., LTD.
    - Business overview
    - Products offered
    - MnM view
    POWERTECH TECHNOLOGY INC.
    - Business overview
    - Products offered
    - Recent development
    - MnM view
  • 11.2 OTHER PLAYERS
    CHIPMOS TECHNOLOGIES INC.
    TONG HSING ELECTRONIC INDUSTRIES LTD.
    NEPES CORPORATION LIMITED
    SHINKO ELECTRIC INDUSTRIES CO., LTD.
    DAEDUCK ELECTRONICS CO., LTD.
    MACDERMID PERFORMANCE SOLUTIONS
    RENESAS ELECTRONICS CORPORATION
    SAMSUNG ELECTRO-MECHANICS
    UNIMICRON TECHNOLOGY CORPORATION
    CHIPBOND TECHNOLOGY CORPORATION
    TANAKA HOLDINGS CO., LTD.
    NAN YA PLASTICS CORPORATION
    HITACHI HIGH-TECH CORPORATION
    SUMITOMO CHEMICAL COMPANY LIMITED
    VERISILICON
APPENDIX
245
  • 12.1 DISCUSSION GUIDE
  • 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
  • 12.3 CUSTOMIZATION OPTIONS
  • 12.4 RELATED REPORTS
  • 12.5 AUTHOR DETAILS
LIST OF TABLES
 
  • TABLE 1 AVERAGE SELLING PRICE OF CERAMIC PACKAGES, BY REGION, 2020–2029 (USD/PIECE)
  • TABLE 2 AVERAGE SELLING PRICE OF ENCAPSULATION RESINS, BY REGION, 2020–2029 (USD/KG)
  • TABLE 3 AVERAGE SELLING PRICE OF LEADFRAMES, BY REGION, 2020–2029 (USD/PIECE)
  • TABLE 4 AVERAGE SELLING PRICE OF SOLDER BALLS, BY REGION, 2020–2029 (USD/BALL)
  • TABLE 5 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: ECOSYSTEM
  • TABLE 6 TECHNOLOGIES OFFERED IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • TABLE 7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: TOTAL NUMBER OF PATENTS
  • TABLE 8 LIST OF MAJOR PATENT OWNERS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS
  • TABLE 9 MAJOR PATENTS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS
  • TABLE 10 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF CONFERENCES AND EVENTS
  • TABLE 11 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 12 EUROPE: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 13 ASIA PACIFIC: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 14 MIDDLE EAST & AFRICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 15 SOUTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 16 LIST OF REGULATIONS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • TABLE 17 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PORTER'S FIVE FORCES ANALYSIS
  • TABLE 18 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS
  • TABLE 19 KEY BUYING CRITERIA FOR APPLICATIONS
  • TABLE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 22 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 24 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 25 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 26 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 27 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 28 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 29 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 30 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 31 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 32 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 33 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 34 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 36 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 37 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 38 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 39 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 40 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 41 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 42 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 43 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 44 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 45 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 46 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 47 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 48 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 49 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION)
  • TABLE 50 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 51 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 52 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 53 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 54 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 55 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 56 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 57 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 58 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 59 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 60 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 61 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 62 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 63 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 64 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 65 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 66 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 67 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 68 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 69 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 70 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 71 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 72 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 73 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 74 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 75 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 76 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 77 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 78 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 79 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 80 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 81 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 82 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 83 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 84 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 85 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 86 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 87 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 88 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 89 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 90 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 91 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 92 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 93 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 94 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 95 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 96 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 97 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 98 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 99 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 100 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 101 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION)
  • TABLE 102 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 103 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION)
  • TABLE 104 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION)
  • TABLE 105 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION)
  • TABLE 106 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION)
  • TABLE 107 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 108 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 109 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 110 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 111 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 112 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 113 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION)
  • TABLE 114 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION)
  • TABLE 115 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEGREE OF COMPETITION
  • TABLE 116 COMPANY TYPE FOOTPRINT (10 COMPANIES)
  • TABLE 117 COMPANY END-USE INDUSTRY FOOTPRINT (10 COMPANIES)
  • TABLE 118 COMPANY PACKAGING TECHNOLOGY FOOTPRINT (10 COMPANIES)
  • TABLE 119 COMPANY REGION FOOTPRINT (10 COMPANIES)
  • TABLE 120 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF KEY START-UPS/SMES
  • TABLE 121 START-UPS/SMES TYPE FOOTPRINT (15 COMPANIES)
  • TABLE 122 START-UPS/SMES END-USE INDUSTRY FOOTPRINT (15 COMPANIES)
  • TABLE 123 START-UPS/SMES PACKAGING TECHNOLOGY FOOTPRINT (15 COMPANIES)
  • TABLE 124 START-UPS/SMES REGION FOOTPRINT (15 COMPANIES)
  • TABLE 125 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PRODUCT LAUNCHES, JANUARY 2019–FEBRUARY 2024
  • TABLE 126 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEALS, JANUARY 2019–FEBRUARY 2024
  • TABLE 127 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: EXPANSIONS, JANUARY 2019–FEBRUARY 2024
  • TABLE 128 LG CHEM.: COMPANY OVERVIEW
  • TABLE 129 LG CHEM.: PRODUCT OFFERINGS
  • TABLE 130 LG CHEM.: DEALS, 2020–2024
  • TABLE 131 LG CHEM.: OTHERS, 2020–2024
  • TABLE 132 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW
  • TABLE 133 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT OFFERINGS
  • TABLE 134 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES, 2020–2024
  • TABLE 135 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: OTHER DEVELOPMENTS, 2020–2024
  • TABLE 136 HENKEL AG & CO. KGAA: COMPANY OVERVIEW
  • TABLE 137 HENKEL AG & CO. KGAA: PRODUCT OFFERINGS
  • TABLE 138 HENKEL AG & CO. KGAA: PRODUCT LAUNCHES, 2020–2024
  • TABLE 139 HENKEL AG & CO. KGAA: DEALS, 2020–2024
  • TABLE 140 HENKEL AG & CO. KGAA: OTHERS, 2020–2024
  • TABLE 141 KYOCERA CORPORATION: COMPANY OVERVIEW
  • TABLE 142 KYOCERA CORPORATION: PRODUCT OFFERINGS
  • TABLE 143 KYOCERA CORPORATION: PRODUCT LAUNCHES, 2020–2024
  • TABLE 144 KYOCERA CORPORATION: DEALS, 2020–2024
  • TABLE 145 KYOCERA CORPORATION: OTHER DEVELOPMENTS, 2020–2024
  • TABLE 146 ASE: COMPANY OVERVIEW
  • TABLE 147 ASE: PRODUCT OFFERINGS
  • TABLE 148 ASE: PRODUCT LAUNCHES, 2020–2024
  • TABLE 149 ASE: OTHER DEVELOPMENTS, 2020–2024
  • TABLE 150 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY OVERVIEW
  • TABLE 151 SILICONWARE PRECISION INDUSTRIES CO., LTD.: PRODUCT OFFERINGS
  • TABLE 152 SILICONWARE PRECISION INDUSTRIES CO., LTD.: DEALS, 2020–2024
  • TABLE 153 SILICONWARE PRECISION INDUSTRIES CO., LTD.: OTHER DEVELOPMENTS, 2020–2024
  • TABLE 154 AMKOR TECHNOLOGY: COMPANY OVERVIEW
  • TABLE 155 AMKOR TECHNOLOGY: PRODUCT OFFERINGS
  • TABLE 156 AMKOR TECHNOLOGY: OTHERS, 2020–2024
  • TABLE 157 TEXAS INSTRUMENTS: COMPANY OVERVIEW
  • TABLE 158 TEXAS INSTRUMENTS: PRODUCT OFFERINGS
  • TABLE 159 TEXAS INSTRUMENTS: PRODUCT LAUNCHES, 2020–2024
  • TABLE 160 TEXAS INSTRUMENTS: OTHERS, 2020-2024
  • TABLE 161 IBIDEN CO., LTD.: COMPANY OVERVIEW
  • TABLE 162 IBIDEN CO., LTD.: PRODUCT OFFERINGS
  • TABLE 163 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
  • TABLE 164 POWERTECH TECHNOLOGY INC.: PRODUCT OFFERINGS
  • TABLE 165 POWERTECH TECHNOLOGY INC.: DEALS, 2020–2024
  • TABLE 166 CHIPMOS TECHNOLOGIES INC.: COMPANY OVERVIEW
  • TABLE 167 TONG HSING ELECTRONIC INDUSTRIES LTD.: COMPANY OVERVIEW
  • TABLE 168 NEPES CORPORATION LIMITED: COMPANY OVERVIEW
  • TABLE 169 SHINKO ELECTRIC INDUSTRIES CO., LTD.: COMPANY OVERVIEW
  • TABLE 170 DAEDUCK ELECTRONICS CO., LTD.: COMPANY OVERVIEW
  • TABLE 171 MACDERMID PERFORMANCE SOLUTIONS: COMPANY OVERVIEW
  • TABLE 172 RENESAS ELECTRONICS CORPORATION: COMPANY OVERVIEW
  • TABLE 173 SAMSUNG ELECTRO-MECHANICS: COMPANY OVERVIEW
  • TABLE 174 UNIMICRON TECHNOLOGY CORPORATION: COMPANY OVERVIEW
  • TABLE 175 CHIPBOND TECHNOLOGY CORPORATION: COMPANY OVERVIEW
  • TABLE 176 TANAKA HOLDINGS CO., LTD.: COMPANY OVERVIEW
  • TABLE 177 NAN YA PLASTICS CORPORATION: COMPANY OVERVIEW
  • TABLE 178 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW
  • TABLE 179 SUMITOMO CHEMICAL COMPANY LIMITED: COMPANY OVERVIEW
  • TABLE 180 VERISILICON: COMPANY OVERVIEW
LIST OF FIGURES
 
  • FIGURE 1 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION
  • FIGURE 2 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: RESEARCH DESIGN
  • FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: REVENUE OF MARKET PLAYERS
  • FIGURE 4 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DATA TRIANGULATION
  • FIGURE 5 ORGANIC SUBSTRATE TYPE SEGMENT TO DOMINATE MARKET BETWEEN 2024 AND 2029
  • FIGURE 6 CONSUMER ELECTRONICS END-USE INDUSTRY TO LEAD MARKET BETWEEN 2024 AND 2029
  • FIGURE 7 SOP PACKAGING TECHNOLOGY TO LEAD MARKET BETWEEN 2024 AND 2029
  • FIGURE 8 ASIA PACIFIC TO DOMINATE MARKET DURING FORECAST PERIOD
  • FIGURE 9 GROWING DEMAND FROM AUTOMOTIVE AND IT & TELECOMMUNICATION SECTORS TO DRIVE MARKET
  • FIGURE 10 ORGANIC SUBSTRATES TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 11 CONSUMER ELECTRONICS TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 12 SOP TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 13 INDIA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 14 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • FIGURE 15 REVENUE SHIFT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • FIGURE 16 OVERVIEW OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET VALUE CHAIN
  • FIGURE 17 INVESTMENT AND FUNDING SCENARIO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • FIGURE 18 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION
  • FIGURE 19 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION
  • FIGURE 20 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION
  • FIGURE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION
  • FIGURE 22 NUMBER OF PATENTS GRANTED (2014−2023)
  • FIGURE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: LEGAL STATUS OF PATENTS
  • FIGURE 24 PATENTS ANALYSIS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS, BY JURISDICTION, 2014−2023
  • FIGURE 25 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENTS IN LAST 10 YEARS
  • FIGURE 26 IMPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND)
  • FIGURE 27 EXPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND)
  • FIGURE 28 PORTER’S FIVE FORCES ANALYSIS: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET
  • FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS
  • FIGURE 30 KEY BUYING CRITERIA FOR APPLICATIONS
  • FIGURE 31 ORGANIC SUBSTRATE TO BE LARGEST SEGMENT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DURING FORECAST PERIOD
  • FIGURE 32 SOP SEGMENT TO LEAD MARKET DURING FORECAST PERIOD
  • FIGURE 33 CONSUMER ELECTRONICS TO DOMINATE MARKET DURING FORECAST PERIOD (USD MILLION)
  • FIGURE 34 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT
  • FIGURE 36 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT
  • FIGURE 37 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT
  • FIGURE 38 RANKING OF TOP FIVE PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022
  • FIGURE 39 BRAND/PRODUCT COMPARATIVE ANALYSIS, BY SEGMENTS
  • FIGURE 40 SHARE OF KEY PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022
  • FIGURE 41 REVENUE ANALYSIS OF TOP 5 PLAYERS, 2020–2024
  • FIGURE 42 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: COMPANY EVALUATION MATRIX, 2023
  • FIGURE 43 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: START-UPS/SMES EVALUATION MATRIX, 2023
  • FIGURE 44 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: OVERALL FOOTPRINT
  • FIGURE 45 EV/EBITDA OF KEY VENDORS
  • FIGURE 46 YEAR-TO-DATE (YTD) PRICE TOTAL RETURN
  • FIGURE 47 LG CHEM.: COMPANY SNAPSHOT
  • FIGURE 48 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 49 HENKEL AG & CO. KGAA: COMPANY SNAPSHOT
  • FIGURE 50 KYOCERA CORPORATION: COMPANY SNAPSHOT
  • FIGURE 51 ASE: COMPANY SNAPSHOT
  • FIGURE 52 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 53 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 54 TEXAS INSTRUMENTS: COMPANY SNAPSHOT
  • FIGURE 55 IBIDEN CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 56 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT

The study involved four major activities in estimating the market size of the Semiconductor & IC packaging materials market. Exhaustive secondary research was done to collect information on the market, the peer market, and the parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, the market breakdown and data triangulation procedures were used to estimate the market size of the segments and subsegments.

Secondary Research

In the secondary research process, various secondary sources have been referred to for identifying and collecting information for this study. These secondary sources include annual reports, press releases, investor presentations of companies, white papers, certified publications, trade directories, articles from recognized authors, the gold standard and silver standard websites, and databases.

Secondary research has been used to obtain key information about the value chain of the industry, the monetary chain of the market, the total pool of key players, market classification, and segmentation according to industry trends to the bottom-most level and regional markets. It was also used to obtain information about the key developments from a market-oriented perspective.

Primary Research

The semiconductor & IC packaging materials market comprises several stakeholders in the value chain, which include raw material suppliers, research & development, manufacturers, distribution and logistics, and end users. Various primary sources from the supply and demand sides of the semiconductor & IC packaging materials market have been interviewed to obtain qualitative and quantitative information. The primary interviewees from the demand side include key opinion leaders in end-use sectors. The primary sources from the supply side include manufacturers, associations, and institutions involved in the semiconductor & IC packaging materials industry.

Primary interviews were conducted to gather insights such as market statistics, data on revenue collected from the products and services, market breakdowns, market size estimations, market forecasting, and data triangulation. Primary research also helped in understanding the various trends related to packaging technology, type, end-use industry and region. Stakeholders from the demand side, such as CIOs, CTOs, and CSOs, were interviewed to understand the buyer’s perspective on the suppliers, products, fabricators, and their current usage of semiconductor & IC packaging materials and the outlook of their business, which will affect the overall market.

The breakdown of profiles of the primary interviewees is illustrated in the figure below:

Semiconductor & IC packaging materials Market Size, and Share

Note: Tier 1, Tier 2, and Tier 3 companies are classified based on their market revenue in 2022, available in the public domain, product portfolios, and geographical presence.

Other designations include consultants and sales, marketing, and procurement managers.

To know about the assumptions considered for the study, download the pdf brochure

Company name

Designation

LG Chem Ltd. (South Korea)

Individual Industry Expert

Henkel AG & Co. KGaA (Germany)

Sales Manager

Kyocera Corporation (Japan)

Manager

ASE (Taiwan)

Marketing Manager

Powertech Technology Inc. (Taiwan)

Senior Scientist

Market Size Estimation

The top-down and bottom-up approaches have been used to estimate and validate the size of the Semiconductor & IC packaging materials market.

  • The key players in the industry have been identified through extensive secondary research.
  • The industry's supply chain has been determined through primary and secondary research.
  • All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.
  • All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to obtain the final quantitative and qualitative data.
  • The research includes the study of reports, reviews, and newsletters of the key market players, along with extensive interviews for opinions with leaders such as directors and marketing executives.

Semiconductor & Ic Packaging Materials Market: Bottum-Up Approach

Semiconductor & IC packaging materials Market Size, and Share

Note: All the shares are based on the global market size.

Source: Secondary Research, Interviews with Experts, and MarketsandMarkets Analysis

To know about the assumptions considered for the study, Request for Free Sample Report

Semiconductor & Ic Packaging Materials Market: Top-Down Approach

Semiconductor & IC packaging materials Market Size, and Share

Data Triangulation

After arriving at the total market size from the estimation process explained above, the overall market has been split into several segments and sub-segments. To complete the overall market engineering process and arrive at the exact statistics for all the segments and sub-segments, the data triangulation and market breakdown procedures have been employed, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply sides. Along with this, the market size has been validated by using both the top-down and bottom-up approaches and primary interviews. Hence, for every data segment, there have been three sources—top-down approach, bottom-up approach, and expert interviews. The data was assumed correct when the values arrived from the three sources matched.

Market Definition

The semiconductor and IC packaging materials market refers to the industry segment focused on producing materials essential for packaging and protecting semiconductor devices and integrated circuits (ICs). These materials include organic substrates, bonding wires, leadframes, encapsulation resins, thermal insulation materials, and solder balls. The market caters to various end-use industries such as consumer electronics, automotive, aerospace, healthcare, and telecommunications. Key factors driving this market include technological advancements, demand for compact and lightweight packaging solutions, rising consumer electronics adoption, and the growth of emerging technologies like AI, IoT, and 5G.

Key Stakeholders

  • Semiconductor & IC packaging materials manufacturers
  • Semiconductor & IC packaging materials traders, distributors, and suppliers
  • End-use industry participants of different segments of the semiconductor & IC packaging materials market
  • Government and research organizations
  • Associations and industrial bodies
  • Research and consulting firms.
  • Research & development (R&D) institutions.

Report Objectives

  • To define, describe, and forecast the size of the semiconductor & IC packaging materials market, in terms of value.
  • To provide detailed information regarding the major factors (drivers, opportunities, restraints, and challenges) influencing the growth of the market
  • To estimate and forecast the market size based on type, packaging technology, end-use industry and region.
  • To forecast the size of the market with respect to major regions, namely, Europe, North America, Asia Pacific, Middle East & Africa, and South America, along with their key countries.
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and their contribution to the overall market.
  • To analyze opportunities in the market for stakeholders and provide a competitive landscape of market leaders.
  • To track and analyze recent developments such as expansions, new product launches, partnerships & agreements, and acquisitions in the market.
  • To strategically profile key market players and comprehensively analyze their core competencies.

Available Customizations

Along with the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:

Regional Analysis

  • Further breakdown of a region with respect to a particular country or additional application

Company Information

  • Detailed analysis and profiles of additional market players

Previous Versions of this Report

Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019

Report Code CH 2348
Published in Apr, 2014, By MarketsandMarkets™
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