Semiconductor Manufacturing Equipment Market Size

Report Code SE 5344
Published in Oct, 2024, By MarketsandMarkets™
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

Updated on : Oct 22, 2024

Semiconductor Manufacturing Equipment Market Size, Share & Growth

The semiconductor manufacturing equipment market size is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024, growing at a CAGR of 7.3% during the forecast period of 2024 to 2029.

The rising advancements in packaging technologies, growing government support for the domestic semiconductor industry, and expansion of semiconductor fabrication facilities are some of the major factors driving the market growth globally. Moreover, the increasing shift towards electric vehicles and government initiatives towards developing semiconductor centers are expected to create opportunities for growth in the market.

Attractive Opportunities in the Semiconductor Manufacturing Equipment Market

ASIA PACIFIC

Presence of leading semiconductor manufacturing equipment providers in countries like China, South Korea, Taiwan, and Japan is a major factor driving the market in Asia Pacific.

The surging demand for advanced and highly efficient chips in the consumer electronics and automotive industries is expected to drive the growth market in the region.

Growing adoption of advanced packaging technologies in the consumer electronic and automotive sectors will provide opportunities for market players.

Product launches, partnerships, collaborations, agreements, and expansions are likely to offer lucrative opportunities for market players in the next five years.

Continuous technological advancements related to semiconductor manufacturing equipment are expected to drive the market growth.

Impact of AI/Gen AI on Semiconductor Manufacturing Equipment Market

AI and Gen Al are poised to significantly transform the semiconductor manufacturing equipment market. The integration of Al with semiconductor manufacturing equipment provides many complex capabilities, such as enhancement in the design and simulation processes, which would result in innovative and more precise designs of devices. AI-driven process optimization enhances the operational efficiency of product yields in semiconductor manufacturing while ensuring cost-effectiveness and efficiency. Predictive maintenance powered by Al cuts down the unanticipated equipment downtime and cost of maintaining it by predicting probable problems before they occur. Another important aspect is how Al and Gen Al dramatically improve control of quality and defects, thereby ensuring that semiconductor products have high standards of reliability and performance. The integration of Al technologies accelerates innovation and enhances the manufacturing process while boosting efficiency and reducing costs in the landscape of the market.

semiconductor manufacturing equipment market

Semiconductor Manufacturing Equipment Market Trends & Dynamics

Driver: Expansion of semiconductor fabrication facilities

The semiconductor manufacturing equipment market is growing at a robust rate, which is majorly driven by the growth of fabrication facilities for semiconductors worldwide. The rapid growth in demand for semiconductors in end-use segments, such as consumer electronics, automotive, artificial intelligence, and 5G technologies, is contributing to the market's growth. Moreover, the industry shift toward smaller nanometer nodes and the use of Al and loT technologies that require even more complex and efficient manufacturing equipment further support the market growth. The growing demand for compact but highly efficient electronic devices, such as 5G mobile phones, is a major factor driving companies to invest in cutting-edge fabs.

Governments are trying to localize manufacturing capabilities and bring down their dependence on foreign supply chains. This push is expected to drive the semiconductor manufacturing equipment market. The expansion of semiconductor fabrication facilities supported by large-scale investments both at the private and government levels is critical for the growth of the market. These developments not only accelerate the adoption of advanced manufacturing technologies but also underscore the industry's commitment to meeting the growing global demand for semiconductors.

Restraint: Complexity of manufacturing processes

Fabrication requires clean rooms and clean equipment as microscopic dust can greatly slow down the fabrication process and result in heavy losses. High costs of delays, order cancellations, and loss of customers resulting from impurities, mechanical integrity issues, and electronic failures in chips can entail expensive damage. Semiconductor manufacturing involves complex fabrication that necessitates the use of very sophisticated equipment and novel technologies to reach lower nodes and advanced topologies such as 5nm and below. Several processes are involved in the manufacturing of semiconductors, namely, lithography, etching, deposition, as well as testing. In all these processes, complex and expensive equipment are required. The growing need for node dimension reduction and increased chip density led to significant challenges in maintaining yield rates and production efficiency yield rates and production efficiency. These advanced processes entail increased operational costs, longer development schedules, and higher chances for error, which restrain the market expansion.

With the increasing popularity of semiconductor technology in AI and 5G, manufacturers are facing continuous pressure to innovate and integrate these innovations into their production systems. The demand for more efficient chips with faster and improved performance capabilities necessitates sophisticated semiconductor manufacturing equipment. The technical complexity cost associated with the development and adoption of cutting-edge tools, such as EUV lithography and testing equipment, is a major concern for manufacturers.

 

Opportunity: Advancements in packaging technologies

With the advancement of semiconductor technologies, SiP, FOWLP, and 3D stacking are becoming necessary to enable mass production. Packaging involves putting together many semiconductor chips in one package that reduces the size of a device while increasing its performance. Advanced packaging techniques have many improvements in terms of signal integrity and reduced thermal management, especially in high-performance applications. The introduction of 5G in telecommunications is a good example that showcases the need for advanced packaging in semiconductors. Better packaging is required for high-performance semiconductors as modern electronic devices are designed to support higher data rates and lower latency.

The growth of the automobile industry, especially the increase in electric vehicles and self-driving automobiles, also fuels the demand for advanced packaging. Consumers desire highly reliable semiconductor products to provide superior performance and longer endurance. A few major companies have started to invest in automotive-grade packaging solutions for more reliable operation and increased safety of ADAS and electric vehicle powertrains. The development of advanced packaging technologies will offer excellent growth opportunities to equipment suppliers. Advanced packaging process-related innovations by equipment makers can help them fulfill the increasingly diversified demands in the market.

Challenge: Rapid pace of technological advancements

Semiconductor equipment manufacturers face major challenges as new technologies and techniques are emerging at an ever-increasing rate. They need to continually innovate and upgrade their products to meet the changing demands of chip makers. The requirement for equipment handling a smaller feature size and a larger transistor density is another major challenge. Given the increasing dimensionality at smaller nanoscale nodes, manufacturing processes tend to increase in complexity. This increases the need for highly advanced tools for lithography, etching, and deposition. Moreover, there is a surging demand for advanced materials and process equipment that are capable of processing customized chips in AI and 5G.

Customization and flexibility require high utilization of resources. The high obsolescence rates due to technological advancement necessitate frequently updating manufacturing facilities, resulting in huge capital investment. Equipment manufacturers focus on the development of more flexible and open upgradeable platforms to address these challenges. Manufacturers also invest in strong simulation and modeling tools to accelerate technical progress. Semiconductor manufacturing equipment vendors need to keep up with the rapid global technological advancements and significant investment in technology to remain competitive in the market.

Semiconductor Manufacturing Equipment Market Ecosystem

The major players operating in the semiconductor manufacturing equipment market with a significant global presence include Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US). These companies are engaged in the development of semiconductor manufacturing equipment to meet global demand for different equipment types and semiconductor technologies.

Top Companies in semiconductor manufacturing equipment market
 

3D ICs segment to register highest CAGR during forecast period

3D ICs mark some significant advances in semiconductor technology with respect to the vertical stacking of active components in multiple layers. These are much better in terms of performance, wirelength, critical path delay, and power consumption than 2D ICs. Through-silicon vias (TSVs) are used in 3D ICs, where these layers of ICs are connected by TSVs, which provide a high bandwidth for low latency data transfer while optimally using the available space. They also address the challenge of energy efficiency by avoiding much more horizontal wiring while integrating heterogeneous functionalities into a compact form factor. Power delivery and thermal management still prove to be challenging in the manufacturing of 3D ICs. Special equipment for 3D ICs are wafer bonding tools, TSV drilling and filling systems, and advanced packaging machinery. These equipment are used in detailing the complexity in fabrication and thermal challenges. Enhanced performance and energy efficiency, reduced wirelength and power consumption, and the ability to integrate diverse functionalities in a compact form factor, driven by advanced TSV technology, are some of the major factors driving the 3D ICs market growth.

Logic segment to account for largest share of semiconductor manufacturing equipment market during forecast period

The market for the logic segment is driven by the high demand from high-performance computing applications, especially in data centers, cloud computing, and artificial intelligence. These applications require extremely complex devices, such as application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs), to perform compute-intensive tasks. The growth of smart devices, including mobile phones, wearable devices, and IoT-embedded devices, also fuels the market in the logic segment. Each of these smart devices requires advanced logic semiconductors, which are the core of microcontrollers and processors embedded in these smart devices.

Additionally, the increasing miniaturization in the manufacture of semiconductors, in which multiple processes are being used to create a smaller design of chips, continues to advance the market growth. Miniaturization makes it possible to increase both performance and efficiencies (power consumption), which is an increasingly important consideration in modern consumer electronics and edge computing. Improved production processes, such as advanced deposition and etching technologies, also improve manufacturing efficiency and allow economical mass production of ever more complex logic devices. As various industries increasingly adopt AI, Machine Learning, and automation, there is increasing demand for higher logic semiconductors that support high-speed data processing, along with handling real-time decision-making processes.

Asia Pacific to Account for Largest Market Share During Forecast Period

The Asia Pacific region is estimated to dominate the semiconductor manufacturing equipment market due to the presence of leading semiconductor manufacturing equipment providers in major countries such as China, Japan, Taiwan, and South Korea. The region has advanced production capabilities and a substantial consumer electronics sector. Government initiatives, technological advancement, and huge investments from both local and international players contribute to the growth of the market. The increased demand for semiconductors in consumer electronics, automotive, and telecommunications drives the market growth in the region. Innovation and infrastructure development are also strengthening the competitive position of the region in the global market.

Asia Pacific is also the fastest-growing market for semiconductor manufacturing equipment. This high growth is attributed to technological advancements in artificial intelligence, Internet of Things, and 5G technologies. The strong consumer electronics manufacturing sector and the rising demand for electronic devices and electric vehicles fuel the demand for reliable and high-performance semiconductor manufacturing equipment. The growing emphasis on technological self-sufficiency, especially in China and South Korea, expands the local R&D and investment capabilities and strengthens the development of the semiconductor manufacturing equipment market.

HIGHEST CAGR MARKET IN 2023
CHINA FASTEST-GROWING MARKET IN THE REGION
semiconductor manufacturing equipment market

Recent Developments of Semiconductor Manufacturing Equipment Market

  • In July 2024, Tokyo Electron Limited launched the Acrevia, a gas cluster beam (GCB) system. It enhances ultra-fine pattern dimensions and forms using post-EUV lithography patterning. It uses Location Specific Processing (LSP) to enhance within-wafer uniformity, optimize essential dimensions, and provide low-damage processing. Moreover, Acrevia lowers stochastic litho flaws and line edge roughness, increasing yield and decreasing EUV patterning expenses.
  • In March 2024, Hitachi High-Tech Corporation launched the LS9300AD system. It is designed to inspect the flaws and particulates on non-patterned wafer surfaces. In addition to traditional dark-field laser scattering detection, the LS9300AD has enhanced DIC (Differential Interference Contrast) inspection capabilities for identifying shallow, low-aspect microscopic flaws. This device provides high-sensitivity and high-throughput detection capabilities to lower inspection costs and increase yield for semiconductor makers.
  • In September 2023, Plasma-Therm acquired Thin Film Equipment S.r.l. (TFE), a provider of sputtering equipment for semiconductor manufacturing and research. TFE is recognized for its expertise in physical vapor deposition (PVD) technology. This acquisition will help Plasma-Therm enhance its technological capabilities and expand its product portfolio.
  • In April 2023, Hitachi High-Tech Corporation, a subsidiary of Hitachi, Ltd., announced plans to expand its production facility. The company planned to construct the facility in the Kasado Area of Kudamatsu City, Yamaguchi Prefecture. Production is expected to commence in 2025. This expansion is for the semiconductor manufacturing equipment production facility.
  • In January 2023, SCREEN Holdings Co., Ltd. announced the completion of its new factory, S3-4 (S-Cube 4), in Hikone, Japan. It is a specialized facility dedicated to the manufacturing of semiconductor production equipment. The facility will produce single-wafer cleaning equipment and other related products and has a total floor area of approximately 9,625 square meters.

Key Market Players

Top Companies Semiconductor Manufacturing Equipment Market - Key Market Players

These players have adopted various organic and inorganic growth strategies, such as product launches & developments, partnerships, collaborations, acquisitions, agreements, and expansions, to strengthen their position in the semiconductor manufacturing equipment market.

Scope of the Semiconductor Manufacturing Equipment Market Report

Report Attribute Details
Market size available for years 2020–2029
Forecast units Value (USD Million)
Segments Covered By Front-end Equipment, Back-end Equipment, Product Type, Dimension, Supply Chain Participants, and Region
Geographies covered Americas, Asia Pacific, and Europe, Middle East & Africa (EMEA)

Key Questions Addressed by the Report

What is the current size of the global semiconductor manufacturing equipment market?
The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3%.
Who are the winners in the global semiconductor manufacturing equipment market?
Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US) are the winners in the market.
Which region is expected to hold the largest market share?
It is expected that Asia Pacific will hold the largest share of the semiconductor manufacturing equipment market due to the presence of a large number of semiconductor manufacturing equipment providers in China, Japan, Taiwan, and South Korea. Moreover, the rising demand for advanced semiconductor technologies in the consumer electronics and automotive sectors further boosts the demand for semiconductor manufacturing equipment in the region.
What are the major drivers and opportunities related to the semiconductor manufacturing equipment market?
Rising demand for advanced packaging technologies, growing government support for the domestic semiconductor industry, and expansion of the semiconductor fabrication facilities are some of the major factors contributing to the market growth.
What are the major strategies adopted by market players?
The key players have adopted product launches, collaborations, acquisitions, agreements, expansions, and partnerships to strengthen their position in the semiconductor manufacturing equipment market.
What is the impact of Gen AI/AI on the semiconductor manufacturing equipment market on a scale of 1-10 (1 - least impacted, 10 - most impactful)?
The Impacts are as follows:

Process Optimization

9

Quality Control and Defect Detection

8

Predictive Maintenance

7

Design and Simulation

8

 

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Table of Contents

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TITLE
PAGE NO
INTRODUCTION
28
RESEARCH METHODOLOGY
33
EXECUTIVE SUMMARY
44
PREMIUM INSIGHTS
49
MARKET OVERVIEW
53
  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    DRIVERS
    - Expansion of semiconductor fabrication facilities
    - Surge in automotive semiconductor market
    - Increasing demand for advanced and efficient chips
    RESTRAINTS
    - High capital investment requirements
    - Complexity of manufacturing processes
    OPPORTUNITIES
    - Expansion of advanced packaging technologies
    - Government support for domestic semiconductor industry
    CHALLENGES
    - Rapid pace of technological advancements
    - Environmental and regulatory compliance in manufacturing
  • 5.3 VALUE CHAIN ANALYSIS
  • 5.4 ECOSYSTEM ANALYSIS
  • 5.5 INVESTMENT AND FUNDING SCENARIO
  • 5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • 5.7 TECHNOLOGY ANALYSIS
    KEY TECHNOLOGIES
    - Wafer Bonding
    COMPLEMENTARY TECHNOLOGIES
    - Flip Chip
    ADJACENT TECHNOLOGIES
    - 3D Stacking
  • 5.8 PRICING ANALYSIS
    AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS
    AVERAGE SELLING PRICE, BY REGION
  • 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
    KEY STAKEHOLDERS IN BUYING PROCESS
    BUYING CRITERIA
  • 5.10 PORTER'S FIVE FORCES ANALYSIS
    THREAT OF NEW ENTRANTS
    THREAT OF SUBSTITUTES
    BARGAINING POWER OF SUPPLIERS
    BARGAINING POWER OF BUYERS
    INTENSITY OF COMPETITIVE RIVALRY
  • 5.11 CASE STUDY ANALYSIS
    ENHANCING LED MANUFACTURING THROUGH ELMO'S ADVANCED MOTION CONTROL SOLUTIONS
    SYNOVA SA ADDRESSES CHALLENGES AND SOLUTIONS IN ADVANCED DIE SINGULATION AND WAFER DICING WITH LMJ TECHNOLOGY
    OPTIMIZING PHOTORESISTS FOR ADVANCED LITHOGRAPHY TECHNIQUES
  • 5.12 TRADE ANALYSIS
    IMPORT SCENARIO (HS CODE 848620)
    EXPORT SCENARIO (HS CODE 848620)
  • 5.13 PATENT ANALYSIS
  • 5.14 REGULATORY LANDSCAPE
    STANDARDS
    - 47 CFR 15
    - NAICS code 334413
    - 29 CFR 1910
    - SEMI E6, E76, F5, F14, S6, S1, S10, S12, S13, S14, S18, and S22
    - IEC 60204-33:2009
  • 5.15 KEY CONFERENCES AND EVENTS, 2024–2025
  • 5.16 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • 5.17 CONNECTORS USED IN MANUFACTURING FACILITIES OF MARKET PLAYERS
    METRIC CIRCULAR
    CPC, RECTANGULAR
    D-SUB
    OVERMOLDED ASSEMBLIES
    CABLE HARNESS
    OTHER DEVICES
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT
90
  • 6.1 INTRODUCTION
  • 6.2 LITHOGRAPHY
    PHOTOLITHOGRAPHY
    - Deep ultraviolet (DUV) lithography
    - Extreme ultraviolet (EUV) lithography
    ELECTRON BEAM LITHOGRAPHY
    ION BEAM LITHOGRAPHY
    NANOIMPRINT LITHOGRAPHY
    OTHERS
  • 6.3 WAFER SURFACE CONDITIONING
    ETCHING
    - Advancements in dry etching technologies to drive market growth
    CHEMICAL MECHANICAL PLANARIZATION (CMP)
    - Demand for high-performance devices driving market growth
  • 6.4 WAFER CLEANING
    DEMAND FOR HIGH-PERFORMANCE AND RELIABLE SEMICONDUCTOR DEVICES TO FUEL MARKET GROWTH
  • 6.5 DEPOSITION
    ADVANCEMENTS IN DEPOSITION PROCESSES TO DRIVE MARKET GROWTH
  • 6.6 OTHER FRONT-END EQUIPMENT
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT
100
  • 7.1 INTRODUCTION
  • 7.2 ASSEMBLY & PACKAGING
    ADVANCEMENTS IN PACKAGING TECHNOLOGIES TO DRIVE MARKET GROWTH
  • 7.3 DICING
    INCREASING NEED FOR HIGH-PRECESSION SEMICONDUCTOR DEVICES TO SPUR MARKET DEMAND
  • 7.4 METROLOGY
    NEED FOR PRECISION MEASUREMENT AND ADVANCED DETECTION TO FUEL MARKET GROWTH
  • 7.5 BONDING
    RISING DEMAND FOR ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGY TO DRIVE MARKET GROWTH
  • 7.6 WAFER TESTING/IC TESTING
    ADVANCEMENTS IN TESTING TECHNOLOGIES BOOSTING SEMICONDUCTOR RELIABILITY AND MARKET GROWTH
FAB FACILITY EQUIPMENT USED IN SEMICONDUCTOR MANUFACTURING EQUIPMENT
106
  • 8.1 INTRODUCTION
  • 8.2 AUTOMATION
  • 8.3 CHEMICAL
  • 8.4 GAS CONTROL
  • 8.5 OTHER FAB FACILITY EQUIPMENT
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE
108
  • 9.1 INTRODUCTION
  • 9.2 MEMORY
    RISING DEMAND FOR HIGH-CAPACITY STORAGE AND ADVANCED PACKAGING TO ACCELERATE MARKET GROWTH
  • 9.3 LOGIC
    DEMAND FOR HIGH-PERFORMANCE COMPUTING TO DRIVE MARKET GROWTH
  • 9.4 MPU
    ADVANCEMENTS IN CLOUD COMPUTING AND EDGE COMPUTING TECHNOLOGIES TO DRIVE MARKET GROWTH
  • 9.5 DISCRETE
    RISING DEMAND FOR DISCRETE DEVICES IN AUTOMOTIVE AND ENERGY SECTORS TO DRIVE MARKET GROWTH
  • 9.6 ANALOG
    RISING ADOPTION OF IOT DEVICES TO FUEL MARKET GROWTH
  • 9.7 OTHERS
    SENSORS
    - Increased adoption of interconnected devices to drive market growth
    OPTOELECTRONIC COMPONENTS
    - Adoption of advanced display technologies to fuel market growth
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION
119
  • 10.1 INTRODUCTION
  • 10.2 2D ICS
    HIGH-DENSITY INTEGRATION IN CONSUMER ELECTRONICS TO FOSTER MARKET GROWTH
  • 10.3 2.5D ICS
    NEED FOR COST-EFFECTIVE, HIGH-PERFORMANCE SOLUTIONS TO SPUR MARKET DEMAND
  • 10.4 3D ICS
    NEED FOR INTEGRATING DIVERSE FUNCTIONALITIES IN COMPACT FORM FACTOR TO FUEL MARKET GROWTH
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
125
  • 11.1 INTRODUCTION
  • 11.2 FOUNDRIES
    RISING DEMAND FOR ADVANCED SEMICONDUCTORS AND COST-EFFECTIVE MANUFACTURING TO DRIVE FOUNDRY GROWTH
  • 11.3 IDM FIRMS
    VERTICAL INTEGRATION AND ADVANCED MANUFACTURING CAPABILITIES TO DRIVE MARKET GROWTH
  • 11.4 OSAT COMPANIES
    ADVANCEMENTS IN PACKAGING TECHNOLOGIES AND OUTSOURCING TO FUEL MARKET GROWTH
SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION
130
  • 12.1 INTRODUCTION
  • 12.2 AMERICAS
    MACROECONOMIC OUTLOOK FOR NORTH AMERICA
    US
    - Government initiatives and adoption of advanced technologies to accelerate market growth
    CANADA
    - Strategic innovation and collaboration to create growth opportunities
    REST OF AMERICAS
    - Technological advancements in emerging economies to boost market growth
  • 12.3 EUROPE, MIDDLE EAST & AFRICA (EMEA)
    MACROECONOMIC OUTLOOK FOR EMEA
    GERMANY
    - Advanced technological infrastructure and Industry 4.0 to support market growth
    UK
    - Strategic innovation and investment to propel market growth
    IRELAND
    - Presence of fabrication facilities to contribute to market growth
    FRANCE
    - Strong R&D focus and government initiatives to contribute to market growth
    ITALY
    - Rising demand in automotive, consumer electronics, and industrial sectors to drive market
    NETHERLANDS
    - Strategic R&D investments to propel market growth
    REST OF EMEA
  • 12.4 ASIA PACIFIC
    MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
    CHINA
    - Advanced manufacturing capabilities and supportive environment for innovation to accelerate market growth
    JAPAN
    - Demand for advanced semiconductor manufacturing technologies in automotive sector to augment market growth
    SOUTH KOREA
    - Strong manufacturing capabilities of major companies to create opportunities
    TAIWAN
    - Investments in advanced manufacturing technologies to fuel market growth
    REST OF ASIA PACIFIC
COMPETITIVE LANDSCAPE
167
  • 13.1 OVERVIEW
  • 13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020–2024
  • 13.3 MARKET SHARE ANALYSIS, 2023
  • 13.4 REVENUE ANALYSIS, 2019–2023
  • 13.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
    STARS
    EMERGING LEADERS
    PERVASIVE PLAYERS
    PARTICIPANTS
    COMPANY FOOTPRINT: KEY PLAYERS, 2023
    - Company footprint
    - Front-end equipment footprint
    - Back-end equipment footprint
    - Product type footprint
    - Dimension footprint
    - Supply chain participant footprint
    - Region footprint
  • 13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
    PROGRESSIVE COMPANIES
    RESPONSIVE COMPANIES
    DYNAMIC COMPANIES
    STARTING BLOCKS
    COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
    - List of startups/SMEs
    - Competitive benchmarking of startups/SMEs
  • 13.8 BRAND/PRODUCT COMPARISON
  • 13.9 COMPETITIVE SCENARIO AND TRENDS
    PRODUCT LAUNCHES
    DEALS
    EXPANSIONS
  • 13.10 FACILITY OVERVIEW OF TOP 5 PAYERS
COMPANY PROFILES
210
  • 14.1 INTRODUCTION
  • 14.2 KEY PLAYERS
    APPLIED MATERIALS, INC.
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    ASML
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    TOKYO ELECTRON LIMITED
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    LAM RESEARCH CORPORATION
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    KLA CORPORATION
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    SCREEN HOLDINGS CO., LTD.
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    TERADYNE, INC.
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    ADVANTEST CORPORATION
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    HITACHI HIGH-TECH CORPORATION
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    PLASMA-THERM
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
  • 14.3 OTHER PLAYERS
    ASM INTERNATIONAL N.V.
    EV GROUP (EVG)
    ONTO INNOVATION
    NORDSON CORPORATION
    ADT
    BENEQ
    CVD EQUIPMENT CORPORATION
    EUGENE TECHNOLOGY CO. LTD.
    NIKON CORPORATION
    SEMICONDUCTOR EQUIPMENT CORP.
    SENTECH INSTRUMENTS GMBH
    CANON INC.
    KOKUSAI ELECTRIC CORPORATION
    SEMES
    FORMFACTOR
APPENDIX
296
  • 15.1 INSIGHTS FROM INDUSTRY EXPERTS
  • 15.2 DISCUSSION GUIDE
  • 15.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
  • 15.4 CUSTOMIZATION OPTIONS
  • 15.5 RELATED REPORTS
  • 15.6 AUTHOR DETAILS
LIST OF TABLES
 
  • TABLE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH ASSUMPTIONS
  • TABLE 2 MARKET: RISK ASSESSMENT
  • TABLE 3 MARKET: ROLE OF COMPANIES IN ECOSYSTEM
  • TABLE 4 AVERAGE SELLING PRICE OF LITHOGRAPHY EQUIPMENT OFFERED BY KEY PLAYERS, 2020–2023 (USD MILLION)
  • TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY SUPPLY CHAIN PARTICIPANT (%)
  • TABLE 6 KEY BUYING CRITERIA, BY SUPPLY CHAIN PARTICIPANT
  • TABLE 7 IMPACT OF PORTER'S FIVE FORCES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • TABLE 8 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019–2023 (USD MILLION)
  • TABLE 9 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019–2023 (USD MILLION)
  • TABLE 10 LIST OF MAJOR PATENT, 2021−2023
  • TABLE 11 AMERICAS: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 12 EMEA: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 13 ASIA PACIFIC: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 14 KEY CONFERENCES AND EVENTS, 2024–2025
  • TABLE 15 FRONT-END EQUIPMENT: MARKET, 2020–2023 (USD MILLION)
  • TABLE 16 FRONT-END EQUIPMENT: MARKET, 2024–2029 (USD MILLION)
  • TABLE 17 MARKET, BY FRONT-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 18 MARKET, BY FRONT-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 19 FRONT-END EQUIPMENT: MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 20 FRONT-END EQUIPMENT: MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 21 FRONT-END EQUIPMENT: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 22 FRONT-END EQUIPMENT: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 23 LITHOGRAPHY: MARKET, 2020–2023 (UNITS)
  • TABLE 24 LITHOGRAPHY: MARKET, 2024–2029 (UNITS)
  • TABLE 25 LITHOGRAPHY: MARKET, BY COUNTRY, 2020–2023 (UNITS)
  • TABLE 26 LITHOGRAPHY: MARKET, BY COUNTRY, 2024–2029 (UNITS)
  • TABLE 27 LITHOGRAPHY: MARKET, BY REGION, 2020–2023 (UNITS)
  • TABLE 28 LITHOGRAPHY: MARKET, BY REGION, 2024–2029 (UNITS)
  • TABLE 29 WAFER SURFACE CONDITIONING: MARKET, 2020–2023 (USD MILLION)
  • TABLE 30 WAFER SURFACE CONDITIONING: MARKET, 2024–2029 (USD MILLION)
  • TABLE 31 BACK-END EQUIPMENT: MARKET, 2020–2023 (USD MILLION)
  • TABLE 32 BACK-END EQUIPMENT: MARKET, 2024–2029 (USD MILLION)
  • TABLE 33 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 34 MARKET, BY BACK-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 35 BACK-END EQUIPMENT: MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 36 BACK-END EQUIPMENT: MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 37 BACK-END EQUIPMENT: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 38 BACK-END EQUIPMENT: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 39 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 40 MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 41 MEMORY: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 42 MEMORY: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 43 MEMORY: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 44 MEMORY: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 45 LOGIC: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 46 LOGIC: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 47 LOGIC: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 48 LOGIC: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 49 MPU: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 50 MPU: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 51 MPU: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 52 MPU: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 53 DISCRETE: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 54 DISCRETE: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 55 DISCRETE: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 56 DISCRETE: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 57 ANALOG: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 58 ANALOG: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 59 ANALOG: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 60 ANALOG: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 61 OTHERS: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 62 OTHERS: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 63 OTHERS: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 64 OTHERS: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 65 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020–2023 (USD MILLION)
  • TABLE 66 MARKET, BY DIMENSION, 2024–2029 (USD MILLION)
  • TABLE 67 2D ICS: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 68 2D ICS: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 69 2.5D ICS: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 70 2.5D ICS: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 71 3D ICS: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 72 3D ICS: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 73 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020–2023 (USD MILLION)
  • TABLE 74 MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024–2029 (USD MILLION)
  • TABLE 75 FOUNDRIES: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 76 FOUNDRIES: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 77 IDM FIRMS: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 78 IDM FIRMS: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 79 OSAT COMPANIES: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 80 OSAT COMPANIES: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 81 MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 82 MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 83 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 84 AMERICAS: MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 85 AMERICAS: MARKET, BY EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 86 AMERICAS: MARKET, BY EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 87 AMERICAS: MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 88 AMERICAS: MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 89 AMERICAS: MARKET, BY DIMENSION, 2020–2023 (USD MILLION)
  • TABLE 90 AMERICAS: MARKET, BY DIMENSION, 2024–2029 (USD MILLION)
  • TABLE 91 AMERICAS: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020–2023 (USD MILLION)
  • TABLE 92 AMERICAS: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024–2029 (USD MILLION)
  • TABLE 93 AMERICAS: MARKET, BY FRONT-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 94 AMERICAS: MARKET, BY FRONT-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 95 AMERICAS: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 96 AMERICAS: FRONT-END MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 97 AMERICAS: FRONT-END MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 98 AMERICAS: FRONT-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 99 AMERICAS: MARKET, BY BACK-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 100 AMERICAS: MARKET, BY BACK-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 101 AMERICAS: BACK-END MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 102 AMERICAS: BACK-END MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 103 AMERICAS: BACK-END MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 104 AMERICAS: BACK-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 105 US: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 106 US: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 107 CANADA: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 108 CANADA: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 109 REST OF AMERICAS: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 110 REST OF AMERICAS: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 111 EMEA: MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 112 EMEA: MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 113 EMEA: MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 114 EMEA: MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 115 EMEA: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 116 EMEA: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 117 EMEA: MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 118 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 119 EMEA: MARKET, BY DIMENSION, 2020–2023 (USD MILLION)
  • TABLE 120 EMEA: MARKET, BY DIMENSION, 2024–2029 (USD MILLION)
  • TABLE 121 EMEA: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020–2023 (USD MILLION)
  • TABLE 122 EMEA: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024–2029 (USD MILLION)
  • TABLE 123 EMEA: MARKET, BY FRONT-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 124 EMEA: MARKET, BY FRONT-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 125 EMEA: FRONT-END MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 126 EMEA: FRONT-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 127 EMEA: MARKET, BY BACK-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 128 EMEA: MARKET, BY BACK-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 129 EMEA: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 130 EMEA: BACK-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 131 ASIA PACIFIC: MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 132 ASIA PACIFIC: MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 133 ASIA PACIFIC: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 134 ASIA PACIFIC: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 135 ASIA PACIFIC: MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 136 ASIA PACIFIC: MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 137 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020–2023 (USD MILLION)
  • TABLE 138 ASIA PACIFIC: MARKET, BY DIMENSION, 2024–2029 (USD MILLION)
  • TABLE 139 ASIA PACIFIC: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020–2023 (USD MILLION)
  • TABLE 140 ASIA PACIFIC: MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024–2029 (USD MILLION)
  • TABLE 141 ASIA PACIFIC: MARKET, BY FRONT-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 142 ASIA PACIFIC: MARKET, BY FRONT-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 143 ASIA PACIFIC: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 144 ASIA PACIFIC: FRONT-END MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 145 ASIA PACIFIC: FRONT-END MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 146 ASIA PACIFIC: FRONT-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 147 ASIA PACIFIC: MARKET, BY BACK-END EQUIPMENT, 2020–2023 (USD MILLION)
  • TABLE 148 ASIA PACIFIC: MARKET, BY BACK-END EQUIPMENT, 2024–2029 (USD MILLION)
  • TABLE 149 ASIA PACIFIC: BACK-END MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 150 ASIA PACIFIC: BACK-END MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 151 ASIA PACIFIC: BACK-END MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 152 ASIA PACIFIC: BACK-END MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 153 CHINA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 154 CHINA: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 155 JAPAN: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 156 JAPAN: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 157 SOUTH KOREA: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 158 SOUTH KOREA: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 159 TAIWAN: MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 160 TAIWAN: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 161 REST OF ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020–2023 (USD MILLION)
  • TABLE 162 REST OF ASIA PACIFIC: MARKET, BY EQUIPMENT TYPE, 2024–2029 (USD MILLION)
  • TABLE 163 MARKET: KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020–2024
  • TABLE 164 MARKET: MARKET SHARE ANALYSIS OF TOP FIVE PLAYERS, 2023
  • TABLE 165 MARKET: FRONT-END EQUIPMENT FOOTPRINT
  • TABLE 166 MARKET: BACK-END EQUIPMENT FOOTPRINT
  • TABLE 167 MARKET: PRODUCT TYPE FOOTPRINT
  • TABLE 168 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DIMENSION FOOTPRINT
  • TABLE 169 MARKET: SUPPLY CHAIN PARTICIPANT FOOTPRINT
  • TABLE 170 MARKET: REGION FOOTPRINT
  • TABLE 171 MARKET: LIST OF STARTUPS/SMES
  • TABLE 172 MARKET: COMPETITIVE BENCHMARKING OF STARTUPS/SMES
  • TABLE 173 MARKET: PRODUCT LAUNCHES, FEBRUARY 2020–JULY 2024
  • TABLE 174 MARKET: DEALS, JANUARY 2020– SEPTEMBER 2023
  • TABLE 175 MARKET: EXPANSIONS, FEBRUARY 2020–APRIL 2023
  • TABLE 176 MARKET: FACITLITY OVERVIEW OF TOP 5 PLAYERS
  • TABLE 177 APPLIED MATERIALS, INC.: COMPANY OVERVIEW
  • TABLE 178 APPLIED MATERIALS, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 179 APPLIED MATERIALS, INC.: PRODUCT/SERVICE LAUNCHES
  • TABLE 180 APPLIED MATERIALS, INC.: DEALS
  • TABLE 181 APPLIED MATERIALS, INC.: EXPANSIONS
  • TABLE 182 ASML: COMPANY OVERVIEW
  • TABLE 183 ASML: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 184 ASML: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 185 ASML: DEALS
  • TABLE 186 ASML: EXPANSIONS
  • TABLE 187 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW
  • TABLE 188 TOKYO ELECTRON LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 189 TOKYO ELECTRON LIMITED: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 190 TOKYO ELECTRON LIMITED: DEALS
  • TABLE 191 TOKYO ELECTRON LIMITED: EXPANSIONS
  • TABLE 192 LAM RESEARCH CORPORATION: COMPANY OVERVIEW
  • TABLE 193 LAM RESEARCH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 194 LAM RESEARCH CORPORATION: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 195 LAM RESEARCH CORPORATION: DEALS
  • TABLE 196 LAM RESEARCH CORPORATION: EXPANSIONS
  • TABLE 197 KLA CORPORATION: COMPANY OVERVIEW
  • TABLE 198 KLA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 199 KLA CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 200 KLA CORPORATION: EXPANSIONS
  • TABLE 201 SCREEN HOLDINGS CO., LTD.: COMPANY OVERVIEW
  • TABLE 202 SCREEN HOLDINGS CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 203 SCREEN HOLDINGS CO., LTD.: PRODUCT/SERVICE LAUNCHES
  • TABLE 204 SCREEN HOLDINGS CO., LTD.: DEALS
  • TABLE 205 SCREEN HOLDINGS CO., LTD.: EXPANSIONS
  • TABLE 206 TERADYNE, INC.: COMPANY OVERVIEW
  • TABLE 207 TERADYNE, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 208 TERADYNE, INC.: PRODUCT/SERVICE LAUNCHES
  • TABLE 209 TERADYNE, INC.: DEALS
  • TABLE 210 ADVANTEST CORPORATION: COMPANY OVERVIEW
  • TABLE 211 ADVANTEST CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 212 ADVANTEST CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 213 ADVANTEST CORPORATION: DEALS
  • TABLE 214 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW
  • TABLE 215 HITACHI HIGH-TECH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 216 HITACHI HIGH-TECH CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 217 HITACHI HIGH-TECH CORPORATION: DEALS
  • TABLE 218 HITACHI HIGH-TECH CORPORATION: EXPANSIONS
  • TABLE 219 PLASMA-THERM: COMPANY OVERVIEW
  • TABLE 220 PLASMA-THERM: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 221 PLASMA-THERM: PRODUCT/SERVICE LAUNCHES
  • TABLE 222 PLASMA-THERM: DEALS
  • TABLE 223 PLASMA-THERM: EXPANSIONS
  • TABLE 224 ASM INTERNATIONAL N.V.: COMPANY OVERVIEW
  • TABLE 225 EV GROUP (EVG): COMPANY OVERVIEW
  • TABLE 226 ONTO INNOVATION: COMPANY OVERVIEW
  • TABLE 227 NORDSON CORPORATIONS: COMPANY OVERVIEW
  • TABLE 228 ADT: COMPANY OVERVIEW
  • TABLE 229 BENEQ: COMPANY OVERVIEW
  • TABLE 230 CVD EQUIPMENT CORPORATION: COMPANY OVERVIEW
  • TABLE 231 EUGENE TECHNOLOGY CO. LTD.: COMPANY OVERVIEW
  • TABLE 232 NIKON CORPORATION: COMPANY OVERVIEW
  • TABLE 233 SEMICONDUCTOR EQUIPMENT CORP.: COMPANY OVERVIEW
  • TABLE 234 SENTECH INSTRUMENTS GMBH: COMPANY OVERVIEW
  • TABLE 235 CANON INC.: COMPANY OVERVIEW
  • TABLE 236 KOKUSAI ELECTRIC CORPORATION: COMPANY OVERVIEW
  • TABLE 237 SEMES: COMPANY OVERVIEW
  • TABLE 238 FORMFACTOR: COMPANY OVERVIEW
LIST OF FIGURES
 
  • FIGURE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SEGMENTATION
  • FIGURE 2 RESEARCH DESIGN
  • FIGURE 3 MARKET: BOTTOM-UP APPROACH
  • FIGURE 4 MARKET: TOP-DOWN APPROACH
  • FIGURE 5 MARKET SIZE ESTIMATION: DEMAND-SIDE ANALYSIS
  • FIGURE 6 MARKET SIZE ESTIMATION: SUPPLY-SIDE ANALYSIS
  • FIGURE 7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DATA TRIANGULATION
  • FIGURE 8 MARKET SNAPSHOT
  • FIGURE 9 LITHOGRAPHY SEGMENT TO SECURE LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 10 METROLOGY SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 11 MEMORY SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 12 3D ICS SEGMENT TO WITNESS HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 13 IDM FIRMS TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 14 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 15 EXPANSION OF SEMICONDUCTOR MANUFACTURING FACILITIES TO DRIVE MARKET
  • FIGURE 16 DEPOSITION TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 17 BONDING SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 18 LOGIC SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 19 2D ICS TO BE DOMINANT SEGMENT DURING FORECAST PERIOD
  • FIGURE 20 IDM FIRMS PROJECTED TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 21 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 22 CHINA TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 23 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
  • FIGURE 24 IMPACT ANALYSIS OF DRIVERS ON SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 25 IMPACT ANALYSIS OF RESTRAINTS ON SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 26 IMPACT ANALYSIS OF OPPORTUNITIES ON SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 27 IMPACT ANALYSIS OF CHALLENGES ON SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 28 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: VALUE CHAIN ANALYSIS
  • FIGURE 29 MARKET: ECOSYSTEM ANALYSIS
  • FIGURE 30 INVESTMENT AND FUNDING SCENARIO, 2019–2024
  • FIGURE 31 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • FIGURE 32 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS, 2023
  • FIGURE 33 AVERAGE SELLING PRICE OF LITHOGRAPHY EQUIPMENT, BY REGION, 2020–2023
  • FIGURE 34 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY SUPPLY CHAIN PARTICIPANT
  • FIGURE 35 KEY BUYING CRITERIA, BY SUPPLY CHAIN PARTICIPANT
  • FIGURE 36 MARKET: PORTER'S FIVE FORCES ANALYSIS
  • FIGURE 37 IMPACT OF PORTER'S FIVE FORCES
  • FIGURE 38 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019–2023
  • FIGURE 39 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019–2023
  • FIGURE 40 PATENTS APPLIED AND GRANTED ANALYSIS, 2013−2023
  • FIGURE 41 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 42 CONNECTORS USED IN SEMICONDUCTOR MANUFACTURING FACILITIES
  • FIGURE 43 LITHOGRAPHY TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 44 METROLOGY SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 45 MEMORY SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 46 2D ICS SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 47 ASIA PACIFIC TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 48 ASIA PACIFIC TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 49 AMERICAS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 50 IDM FIRMS TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 51 ASIA PACIFIC TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 52 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT
  • FIGURE 53 EMEA: MARKET SNAPSHOT
  • FIGURE 54 ASIA PACIFIC: MARKET SNAPSHOT
  • FIGURE 55 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: MARKET SHARE ANALYSIS, 2023
  • FIGURE 56 MARKET: REVENUE ANALYSIS OF KEY PLAYERS, 2019–2023
  • FIGURE 57 MARKET: COMPANY VALUATION, 2024 (USD BILLION)
  • FIGURE 58 MARKET: FINANCIAL METRICS
  • FIGURE 59 MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2023
  • FIGURE 60 MARKET: COMPANY FOOTPRINT
  • FIGURE 61 MARKET: COMPANY EVALUATION MATRIX (STARTUPS/SMES), 2023
  • FIGURE 62 MARKET: BRAND/PRODUCT COMPARISON
  • FIGURE 63 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
  • FIGURE 64 ASML: COMPANY SNAPSHOT
  • FIGURE 65 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
  • FIGURE 66 LAM RESEARCH CORPORATION: COMPANY SNAPSHOT
  • FIGURE 67 KLA CORPORATION: COMPANY SNAPSHOT
  • FIGURE 68 SCREEN HOLDINGS CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 69 TERADYNE, INC.: COMPANY SNAPSHOT
  • FIGURE 70 ADVANTEST CORPORATION: COMPANY SNAPSHOT
  • FIGURE 71 HITACHI HIGH-TECH CORPORATION: COMPANY SNAPSHOT

 

The research study involved 4 major activities in estimating the size of the semiconductor manufacturing equipment market. Exhaustive secondary research has been done to collect important information about the market and peer markets. The validation of these findings, assumptions, and sizing with the help of primary research with industry experts across the value chain has been the next step. Both top-down and bottom-up approaches have been used to estimate the market size. Post which the market breakdown and data triangulation have been adopted to estimate the market sizes of segments and sub-segments.

Secondary Research

In the secondary research process, various secondary sources have been referred to for identifying and collecting information required for this study. The secondary sources include annual reports, press releases, investor presentations of companies, white papers, and articles from recognized authors. Secondary research has been mainly done to obtain key information about the market’s value chain, the pool of key market players, market segmentation according to industry trends, regional outlook, and developments from both market and technology perspectives.

In the semiconductor manufacturing equipment market report, the global market size has been estimated using both the top-down and bottom-up approaches, along with several other dependent submarkets. The major players in the market were identified using extensive secondary research, and their presence in the market was determined using secondary and primary research. All the percentage shares splits, and breakdowns have been determined using secondary sources and verified through primary sources.

Primary Research

Extensive primary research has been conducted after understanding the semiconductor manufacturing equipment market scenario through secondary research. Several primary interviews have been conducted with key opinion leaders from both demand- and supply-side vendors across 3 major regions—Americas, Asia Pacific, and Europe, Middle East & Africa (EMEA). Approximately 25% of the primary interviews have been conducted with the demand-side vendors and 75% with the supply-side vendors. Primary data has been collected mainly through telephonic interviews, which consist of 80% of the total primary interviews; questionnaires and emails have also been used to collect the data.

After successful interaction with industry experts, brief sessions were conducted with highly experienced independent consultants to reinforce the findings of our primary research. This, along with the in-house subject matter experts’ opinions, has led us to the findings as described in the report.

semiconductor manufacturing equipment market Size, and Share

About the assumptions considered for the study, To know download the pdf brochure

Market Size Estimation

In the market engineering process, both top-down and bottom-up approaches, along with data triangulation methods, have been used to estimate and validate the size of the semiconductor manufacturing equipment and other dependent submarkets. The research methodology used to estimate the market sizes includes the following:

  • Identifying top-line investments and spending in the ecosystem and considering segment-level splits and major market developments
  • Identifying different stakeholders in the semiconductor manufacturing equipment market that influence the entire market, along with participants across the supply chain
  • Analyzing major manufacturers and service providers in the semiconductor manufacturing equipment market and studying their solutions and service portfolios
  • Analyzing trends related to the adoption of semiconductor manufacturing equipment
  • Tracking recent and upcoming market developments, including investments, R&D activities, product launches, expansions, agreements, collaborations, acquisitions, and partnerships, as well as forecasting the market size based on these developments and other critical parameters
  • Carrying out multiple discussions with key opinion leaders to identify the adoption trends of semiconductor manufacturing equipment
  • Segmenting the overall market into various other market segments
  • Validating the estimates at every level through discussions with key opinion leaders, such as chief executives (CXOs), directors, and operation managers, and finally with the domain experts at MarketsandMarkets

Semiconductor Manufacturing Equipment Market : Top-Down and Bottom-Up Approach

semiconductor manufacturing equipment market Top Down and Bottom Up Approach

Data Triangulation

After arriving at the overall market size by the market size estimation process explained in the earlier section, the overall semiconductor manufacturing equipment market has been divided into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics for all segments, the data triangulation and market breakdown procedures have been used, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply side perspectives. Along with data triangulation and market breakdown, the market has been validated by top-down and bottom-up approaches.

Market Definition

The term semiconductor manufacturing equipment denotes the supply of equipment and devices for the production, test, and assembly, or packaging of semiconductor devices, which can include materials necessary to manufacture the equipment. This equipment can be used in cleanrooms in a fab for wafer fabrication and testing, throughout the process of fabricating semiconductors, including photolithography, etching, deposition, chemical mechanical planarization (CMP), and metrology, and is an important factor of production within the semiconductor industry. Semiconductor manufacturing equipment is utilized to manufacture integrated circuits (ICs) and therefore have important uses in several critical industries, including consumer electronics, automotive, telecommunications, data centers, and industrial applications.

As the demand for smart devices continues to grow, demand continues to grow for semiconductor chips. As a result, manufacturers are under pressure to increase production volumes and reduce waiting times, while maintaining quality and reliability. Semiconductor manufacturing equipment is the most important production factor, thereby meeting increased demand for very advanced manufacturing capabilities of advanced chips, such as 3D ICs and nanometer process, while also the ability to manage high-volume manufacturing, maintain printed patterns accuracy for complex chip architecture and designs, and assure quality in production. Semiconductor manufacturing equipment promotes innovation and helps to meet the growing global demand for semiconductors by facilitating efficient manufacturing and testing operations.

Key Stakeholders

  • Raw Material Supplier
  • Component and Subsystem Suppliers
  • OEMs
  • Semiconductor Equipment Manufacturer
  • Technology Solution Providers
  • IDMs and Foundries
  • Chip Designers
  • Software Developers
  • Third-party Service Providers
  • Distributors and Resellers
  • Service Providers
  • Regulatory Bodies
  • Research and Development Institutes
  • End Users

Report Objectives

  • To define, describe, and forecast the size of the semiconductor manufacturing equipment market, by front-end equipment, back-end equipment, product type, dimension, supply chain participant, and region, in terms of value
  • To define and describe the semiconductor manufacturing equipment market based on fab facility equipment
  • To forecast the market for lithography equipment, in terms of volume, at the global and regional levels
  • To forecast the size of various segments with respect to three regions, namely, the Americas, Asia Pacific, and Europe, Middle East & Africa
  • To identify and analyze key drivers, restraints, opportunities, and challenges influencing the growth of the semiconductor manufacturing equipment market
  • To study the value chain and related industry segments of the semiconductor manufacturing equipment market
  • To strategically analyze the micromarkets1 with respect to individual growth trends, prospects, and contributions to the overall market
  • To analyze trends and disruptions impacting customers’ businesses’ pricing trends, patents and innovations, trade data, regulatory landscape, Porter’s five forces, case studies, key stakeholders and buying criteria, technology trends, market ecosystem, key conferences and events, impact of AI/Gen AI, and connectors used in manufacturing facilities related to the semiconductor manufacturing equipment market
  • To analyze opportunities for various stakeholders by identifying the high-growth segments of the market
  • To strategically profile the key players and comprehensively analyze their market position in terms of revenue, market share, and core competencies2, along with detailing the competitive landscape for the market leaders
  • To analyze competitive developments such as product launches, acquisitions, partnerships, collaborations, agreements, expansions, and research & development (R&D) activities carried out by players in the semiconductor manufacturing equipment market

Available Customizations

With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

Country-wise Information:

  • Country-wise breakdown for Americas, Asia Pacific, and Europe, Middle East & Africa (EMEA)

Company Information:

  • Detailed analysis and profiling of additional market players (up to five)

 

Previous Versions of this Report

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

Report Code SE 5344
Published in Oct, 2024, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market by Front-end Equipment, Back-end Equipment, Fab Facility Equipment (Automation , Chemical Control, Gas Control), Product Type, Dimension, Supply Chain Participant and Region - Global Forecast to 2028

Report Code SE 5344
Published in May, 2023, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market by Front-end Equipment, Back-end Equipment, Fab Facility Equipment (Automation , Chemical Control, Gas Control), Product Type, Dimension, Supply Chain Participant and Region - Global Forecast to 2028

Report Code SE 5344
Published in May, 2023, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market with COVID-19 Impact Analysis by Front-end Equipment, Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2027

Report Code SE 5344
Published in Jan, 2022, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market with COVID-19 Impact Analysis by Front-end Equipment, Back-end Equipment, FAB Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025

Report Code SE 5344
Published in Jul, 2020, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023

Report Code SE 5344
Published in Dec, 2019, By MarketsandMarkets™

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023

Report Code SE 5344
Published in Jun, 2017, By MarketsandMarkets™

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