PCB Encapsulation Market

Report Code CH 9203
Published in Oct, 2024, By MarketsandMarkets™
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PCB Encapsulation Market by Resin Type (Epoxy, Acrylic), Curing Type (UV-Cure, Heat Cure, Room Temperature Cure), Application (Consumer Electronics, Automotive Electronics, Medical Devices), Product Type - Global Forecast to 2029

Overview

The PCB encapsulation market is projected to reach USD 5.59 billion by 2029, at a CAGR of 8.8% from USD 3.67 billion in 2024. The growth of the PCB protection market is driven by the following key factors including increasing electronic device complexity and miniaturization create major driving forces. The smaller and more densely packed the electronic components, the greater the need for effective protection against environmental influences by way of moisture, dust, and chemicals. This demand becomes very strong in consumer electronics, automotive electronics, and industrial applications where reliability and durability are at a premium.

Attractive Opportunities in the PCB Encapsulation Market

Asia Pacific

Market growth in the Asia Pacific can be attributed to rapid urbanization and industrialization in the region.

Rapid urbanization and industrialization in countries such as China and India drive substantial demand for construction and infrastructure development. Furthermore, the booming construction industry drives the market.

The growing demand for reliable and durable electronics in sectors like automotive, aerospace, and consumer electronics is driving the need for to ensure long-term performance and reliability.

The Asia Pacific PCB Encapsulation. market is expected to be worth USD 2.36 billion by 2029, growing at CAGR of 9.1% during the forecast period.

Increasing adoption of IoT and wearable devices presents an opportunity for PCB protection adhesives due to the need for miniaturization and enhanced protection

Global PCB Encapsulation Market Dynamics

DRIVER: Shift in Semiconductor Market Share

It is expected that the dynamically changing semiconductor market will further stay the forte and act as the major growth driver for the PCB encapsulation market. The constantly evolving semiconductor industry is also hike the demand for advanced, reliable, and resilient electronic components. This has been driven by the rapid adoption of leading-edge technologies such as 5G, artificial intelligence, and autonomous vehicles—all of which require advanced semiconductors. High-end applications call for strong PCBs; higher processing speeds, raising data transfer rates, increased functionality—these drive demand for adequate protection of the PCBs.

As is the case in the miniaturization of the semiconductor industry trend, electronic components are becoming smaller and more densely populated on PCBs. Thus, the stakes for PCB encapsulation also become higher due to the miniature nature, whereby they now have to show better performance to safeguard such fragile components from environmental influences like moisture, dust, and temperature swings. Accordingly, highly reliable adhesives will be required to ensure the life and durability of the improved semiconductor devices.

Another geography-based factor at play is the geographical shift of semiconductor manufacturing. For instance, as regions like Asia-Pacific are becoming prominent places for semiconductor manufacturing, demand for PCB protection solutions also increases in these regions. Adhesive manufacturers in these regions need consistent adhesives to assure that the quality and performance of the products they are offering remain high, thus further fueling market growth.

RESTRAINT: High Cost of Advanced Adhesive Materials

Advanced adhesive materials come at a high price, which often puts a significant restraint on the growth of the PCB encapsulation market. These advanced materials have greatly improved performance features, which include better thermal conductivity, environmental resistance, and mechanical stability. They are normally more costly than conventional adhesives, thereby posing a cost challenge, especially to small and medium-scale manufacturers.

Most of the time, high-quality standards go with the continuous pressure of reducing production costs on manufacturers. In such a scenario, it may prove tough to strike a balance with the high cost of advanced adhesives, forcing manufacturers to opt for protection solutions that are relatively cheaper but not very efficient. Coupled with high performance, electronic devices have increasingly demanded long life and reliability; durability may thus become a casualty of the compromise.

Moreover, conversion to better adhesive materials can entail quite considerable investments. This not only includes the price of the materials themselves but also possible adaptations of current production processes and equipment. Moreover, manufacturers may need to invest in new dispensing and curing systems or further train employees working with such advanced adhesives—this adds to a cost squeeze.

Another factor that could limit growth in the market is the price sensitivity of end consumers. Increased production cost could naturally imply higher prices for final products. Such an outlook may not be taken favorably in extremely competitive markets. Thus, manufacturers may be little interested in using the advanced adhesive materials if they perceive that the rise in cost could not be balanced by gaining value or an increase in market share. Moreover, the continuous research and development to enhance the performance of these adhesives are an added cost to advanced adhesives. That is, in order to meet the changing requirements of the electronics industries, innovation is required continuously; hence, their R&D costs add up to the final price of the materials.

 

OPPORTUNITY: Advancements in the Automotive And Aerspace Sectors

The aerospace and automotive sectors are ripe with tremendous potential for the PCB encapsulation market. It is forecasted that advanced electronic content will be swiftly adopted by both industries toward improvements in performance, safety, and functionality. For aerospace, there is an increased requirement for long-lasting, high-reliability PCBs to deliver requirements such as avionics, navigation systems, and in-flight entertainment. Components have to withstand extremely stringent conditions caused by high altitudes, temperature fluctuations, and vibrations, whose reliability will require adhesives superior to conventional ones for PCB protection. The move of the automotive industry toward EVs, autonomous driving, and connected car technologies requires robust protection in their PCBs. The electronics in vehicles are exposed to extreme environments, with a large amount of heat, moisture, and chemicals. Advanced adhesives are required that provide excellent thermal management, mechanical stability, and environmental resistance.

CHALLENGES: Stringent Regulatory Requirement

Among the major challenges in the PCB encapsulation market, one is related to stringent regulatory requirements. Most of the regulations are oriented toward the use of green or eco-friendly materials and the restriction of hazardous content such as lead, volatile organic compounds, and so on, which increases production cost. Adhesives must comply with, among others, RoHS and REACH regulations in Europe and similar standards elsewhere across the world.

Conformity to these regulations normally entails lengthy testing and certification procedures, which are not only expensive but also time-consuming. Under these circumstances, firms may have to invest more in research and development for the production of new kinds of adhesives to meet such standards and at the same time ensure good performance. This slows innovation down and increases the net cost of adhesive products. The other complication factor in itself would be to keep pace with changing regulations in different regions for global operations. Manufacturing companies face varied requirements in various markets, all of which may further complicate strategies in product development and distribution. If the regulatory burden is too high, especially for small or resource-constrained companies, this could actually hamper investments and slow down market growth.

Global PCB Encapsulation Market Ecosystem Analysis

A market ecosystem for PCB encapsulation refers to the interconnected network of various entities, factors, and dynamics that collectively influence the production, distribution, and consumption of PCB encapsulation in the market. This ecosystem involves a range of participants, both internal and external, and includes various components that interact with each other to shape the overall functioning of the market. The key players in the market are are Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), Parker-Hannifin Corporation (US), Dow (US), DuPont (US), Nagase ChemteX Corporation (Japan), Huntsman International LLC (US), Wacker Chemie AG (Germany), Shin-Etsu Chemical Co. Ltd., (Japan) Panacol-Elosol GmbH (Germany) etc.

Source: Secondary Research, Interviews with Experts, and MarketsandMarkets Analysis

 

Acrylic is the second largest resin type amongst the type segment after epoxy in the PCB encapsulation market in 2024, in terms of value.

Acrylic adhesives continue to be the second-largest share in the PCB encapsulation market. The reasons are as follows: excellent adhesion properties on a wide variety of substrates, such as metals, plastics, and ceramics. The versatility of acrylics is very important in modern electronics where different materials are often used together in diverse and complex assemblies.

Acrylic adhesives are of equal prominence in respect of their strong resistance to the environment. They demonstrate better water, chemical, and UV resistance compared to other adhesives, which enables the overall improved lifespan and reliability of electronic parts under even the most hostile conditions. This makes them especially useful in applications where electronics are exposed to difficult environments, like automotive, aerospace, or outdoor consumer electronics. This means that acrylic adhesives have flexibility and durability, making them quite popular. They can easily absorb mechanical stresses and thermal cycling, therefore considered very vital in the integrity of the PCBs in devices that are usually subjected to frequent changes in temperature and physical stress. It reduces, therefore, the risks of adhesive failure, hence improving performance and durability of electronic devices. Moreover, in general, compared to other types, acrylic adhesives have faster curing times, making them a great way to enhance manufacturing efficiency without giving up on performance. Their ease of application and easy curing also translate to savings in production, thus being quite economically very attractive for any manufacturer. The strong adhesion, resistance to environmental elements, flexibility, durability, and cost make acrylic adhesives quite popular in the PCB encapsulation market and definitely consolidate their position as the second biggest segment.

Dam & fill accounted for the second largest segment of product type in the PCB encapsulation market in 2024” in terms of value.

Although the dam and fill method is the second-largest product type segment in the PCB encapsulation market, it has its advantages and versatile features. In this process, a dam made around the area to be protected with a high-viscosity material is filled with a lower-viscosity material. This brings along a number of key benefits which drive its wide-scale adoption.

First and foremost, the dam and fill process provide very good protection of sensitive electronic components on a PCB. The presence of the dam helps in containing the material from spreading out and gives an assurance of precise adhesion to where required. This kind of precision is important in protecting the component from the environment that might contain moisture, dust, and chemicals which have a negative impact on electronic devices.

This makes it quite suitable for many other applications, as the dam and fill process is pretty flexible. Different shapes and sizes of components work with it, making it fit for complex PCB designs associated with advanced electronics. This should help bring a lot of versatility into this method for use across various products, starting from consumer electronics to industrial and right down to automotive applications.

The dam and fill process also improve the mechanical stability of a PCB. It provides structural support to the components; encapsulated components can bear the imposed thermal cycling and mechanical stresses, important for devices at different temperatures and under physical impacts, which compromise the failing of components. This way, the dam and fill process brings about the best of the manufacturing processes. With it, most of the materials that are normally used have very fast curing times, thereby enabling fast cycles of production. This therefore makes it possible for manufacturers to produce volumes at high standards.

Medical device application will be the second largest segment of the growing for the PCB encapsulation market, in terms of value in 2024

The medical device sector is the second-largest in the PCB encapsulation market, and it arose from multiple critical factors. Medical devices, importantly, require PCBs that can function reliably in high-stakes settings; as such, protection from environmental factors such as moisture, chemicals, and temperature fluctuations becomes very paramount. Very small modern medical devices with intricate electronics also drive the demand for adhesives that provide protection without losing functionality. In addition, stringent regulatory requirements from within the medical field itself—think of ISO 13485 and the FDA, for example—are continuously raising demand for high-quality adhesives to meet these specifications. In particular, with the fast pace of development in medical technology, especially wearable health monitors, implantable devices, and diagnostic tools of extremely high sophistication, demand for effective PCB protection solutions has never been so strong. Another important aspect is patient safety, and adhesives improving durability and reliability of medical devices are of essence in this context. All these factors put together underline the fact that the medical devices segment has been and continues to be a large and growing share in the PCB encapsulation market.

Asia Pacific will be the largest growing market for PCB encapsulation in 2024, in terms of value.

The Asia-Pacific region is the leader in the global PCB encapsulation market due to a few key reasons. The region is at the forefront as a manufacturing base for consumer electronics, automotive, telecommunication, and industrial applications, with significant usage of PCBs. Countries such as China, South Korea, Japan, and Taiwan mainly have manufacturing bases for electronic devices such as smartphones, tablets, computers, and automotive electronics, thus driving demand for PCB encapsulation solutions for increasing their durability and performance. In those countries, the growth of adoption of advanced technologies such as 5G, IoT, and AI further calls for an encapsulation of PCB to protect sensitive electronic components against the harsh environmental conditions related to moisture, dust, and thermal fluctuations. Another key growth factor that assisted the rise of encapsulation in PCBs has been the continuing growth of the automotive industry, particularly in China and Japan. As encapsulation guarantees high reliability and long operational life of critical electronic systems in electric vehicles, its demand increases with the increasing automotive industry. The Asia-Pacific region is quite attractive for PCB manufacturers and encapsulation solution providers due to the availability of low-cost raw materials, low manufacturing costs, and an established supply chain already existing for electronics products. In addition to this, governments are pushing and have pursued the "Made in China 2025" program and the "Make in India" initiative of India to support the development of local electronics manufacturing.

Rapid industrialization, urbanization, and growing disposable income in the Asia-Pacific region further fuel demand for electronic gadgets, automotive electronics, and smart devices, which in turn has a continued drive for PCB encapsulation solutions. It, therefore, makes Asia Pacific the largest as well as the fastest-growing market for PCB encapsulation, and growth in demand in various end-use sectors is expected over the next years.

HIGHEST CAGR MARKET IN 2023
2024 FASTEST GROWING MARKET IN THE REGION

Recent Developments of PCB Encapsulation Market

  • In march 2024, Henkel has announced the commercialization of Loctite Stycast CC 8555, a conformal coating designed to protect electronics in extreme environments. This new addition to Henkel's conformal coating portfolio offers protection for printed circuit boards (PCBs) and sensitive components in demanding, high-power applications such as motor drives, programmable logic controllers (PLCs), electric vehicle (EV) charging infrastructure, AC/DC power supplies, and other high-voltage electronics.
  • In November 2023, Henkel has unveiled new light cure adhesives designed for medical-grade wearable devices. These adhesives, available in two variants—Loctite WT 3001 and Loctite WT 3003—have undergone rigorous testing in accordance with ISO 10993 standards. This ensures they meet stringent criteria for safety and performance, providing reliable solutions for users of medical wearable devices.
  • In march 2024, Germany's Henkel and Kraton have partnered to advance sustainability in adhesives. Henkel, a global leader in adhesives, sealants, and functional coatings, and Kraton Corporation, a leading global producer of sustainable biobased products derived from pine wood pulping, have announced a multi-year supply partnership.
  • In May 2023, Henkel has opened a new 70,000ft² Adhesive Technologies center in Bridgewater, US. This facility will serve as an interactive hub for Henkel’s strategic partners and customers in the region, showcasing the company’s comprehensive portfolio of sealants, adhesives, functional coatings, and specialty materials.
  • In July 2023, H.B. Fuller Company has completed the acquisition of Adhezion Biomedical, a privately owned U.S. company specializing in medical adhesives. Adhezion Biomedical serves customers in over 40 countries and holds more than 35 global certifications, along with 105 patents.
  • In July 2023, H.B. Fuller Company has completed the acquisition of Apollo, the leading independent producer of liquid adhesives, coatings, and primers in the United Kingdom, serving the roofing, industrial, and construction sector.

Key Market Players

KEY PLAYERS IN THE PCB ENCAPSULATION MARKET INCLUDE

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Scope of the Report

Report Metric Details
Market size available for years 2020-2029
Base Year Considered 2023
Forecast period 2024-2029
Forecast units Value (USD Billion/Million)
Segments covered Resin type, curing type, product type, applications and region.
Geographies covered Asia Pacific, North America, Europe, Rest of the world

 

Key Questions Addressed by the Report

What is the expected growth rate of the PCB encapsulation market?
This study's forecast period for the PCB encapsulation is 2024-2029. The market is expected to grow at a CAGR of 8.8% in terms of value, during the forecast period.
Who are the major key players in the PCB encapsulation market?
Henkel AG & Co. KGaA (Germany), H.B. Fuller Company (US), Parker-Hannifin Corporation (US), Dow (US), DuPont (US), Nagase ChemteX Corporation (Japan), Huntsman International LLC (US), Wacker Chemie AG (Germany), Shin-Etsu Chemical Co. Ltd., (Japan) Panacol-Elosol GmbH (Germany) etc. are the leading manufacturers and service provider of PCB encapsulation .
What are the emerging trends in the Water and wastewater treatment equipment market?
Performance and improvement in sustainability are therefore realized by the trends in adhesives for PCB protection. The most important trend, however, is the advent of eco-friendly adhesives, reductions in VOCs, and qualification of environments. Newer adhesives should also be targeted to provide better thermal management with materials that can bear higher temperatures, effecting a better dissipation of heat. Also, increasing needs are for adhesives compatible with modern electronics miniaturization and complexity, such as flexible and conformal coatings, to follow the intricate designs of the PCBs. Smart adhesives that respond to environmental change or those that have self-healing properties are being integrated as well. These trends could really be taken to reflect the motivation of the industry in the directions of higher performance, green environment responsibility, and adaptation to change of the electronic technologies.
What are the drivers and opportunities for the PCB encapsulation market?
The drivers and opportunities for PCB encapsulation are driven by rapid electronic development, which requires robust protection for the increasingly complex and miniaturized PCBs. The growing adoption of technologies such as 5G, Internet of Things, and electric vehicles is setting huge demands for high-performance adhesives that ensure reliability under diverse conditions. Another factor that will continue to boost growth is the stringency of environmental regulations, which will spur the development of eco-friendly adhesives conforming to green standards while offering better protection. Other opportunities include the aerospace and medical device industries, which are growing and call for specialized adhesives delivering high performance and reliability. Besides, the continuous innovation of adhesive technologies related to thermal management, flexibility, and smart adhesives further fuels this growth by providing scope for new market developments.
What are the restraining factors in the PCB encapsulation market?
One of the major restraints to the PCB encapsulation market is the high cost of advanced adhesives.

 

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Table of Contents

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TITLE
PAGE NO
INTRODUCTION
27
RESEARCH METHODOLOGY
32
EXECUTIVE SUMMARY
42
PREMIUM INSIGHTS
48
MARKET OVERVIEW
50
  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    DRIVERS
    - Increasing share of semiconductors in automotive, consumer electronics, aerospace, and telecommunications sectors
    - Rising demand for electronic devices
    RESTRAINTS
    - High cost of advanced adhesive materials
    - Manufacturing challenges
    OPPORTUNITIES
    - Advancements in automotive and aerospace sectors
    CHALLENGES
    - Stringent regulatory requirements
  • 5.3 IMPACT OF GENERATIVE AI ON PCB PROTECTION ADHESIVES MARKET
    INTRODUCTION
    CHEMICAL COMPANIES EMBRACING AI ACROSS VARIOUS BUSINESS AREAS
    USE OF GENERATIVE AI IN PCB PROTECTION ADHESIVES MARKET
    IMPACT OF GENERATIVE AI ON PCB PROTECTION ADHESIVES MARKET
INDUSTRY TRENDS
57
  • 6.1 INTRODUCTION
  • 6.2 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
    REVENUE SHIFT AND NEW REVENUE POCKETS FOR PCB PROTECTION ADHESIVE MANUFACTURERS
  • 6.3 VALUE CHAIN ANALYSIS
  • 6.4 PRICING ANALYSIS
    AVERAGE SELLING PRICE TREND, BY REGION
    AVERAGE SELLING PRICE TREND, BY RESIN TYPE
    AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY TOP 3 RESIN TYPES
  • 6.5 ECOSYSTEM ANALYSIS
  • 6.6 TECHNOLOGY ANALYSIS
  • 6.7 PATENT ANALYSIS
    METHODOLOGY
    PATENTS GRANTED WORLDWIDE, 2014–2023
    PATENT PUBLICATION TRENDS
    INSIGHTS
    LEGAL STATUS OF PATENTS
    JURISDICTION ANALYSIS
    TOP COMPANIES/APPLICANTS
    LIST OF MAJOR PATENTS
  • 6.8 TRADE ANALYSIS
    IMPORT SCENARIO
    EXPORT SCENARIO
  • 6.9 KEY CONFERENCES AND EVENTS
  • 6.10 TARIFF AND REGULATORY LANDSCAPE
    TARIFF AND REGULATIONS RELATED TO PCB PROTECTION ADHESIVES
    REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    REGULATIONS RELATED TO PCB PROTECTION ADHESIVES MARKET
  • 6.11 PORTER’S FIVE FORCES ANALYSIS
    BARGAINING POWER OF SUPPLIERS
    THREAT OF NEW ENTRANTS
    THREAT OF SUBSTITUTES
    BARGAINING POWER OF BUYERS
    INTENSITY OF COMPETITIVE RIVALRY
  • 6.12 KEY STAKEHOLDERS AND BUYING CRITERIA
    KEY STAKEHOLDERS IN BUYING PROCESS
    BUYING CRITERIA
  • 6.13 MACROECONOMIC INDICATORS
    GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES
  • 6.14 CASE STUDY ANALYSIS
    INNOVATIVE ADHESIVE SOLUTIONS BY MASTER BOND: IMPACT AND APPLICATIONS IN ADVANCED INDUSTRIES
    ENHANCING PERFORMANCE IN AEROSPACE, DEFENSE, AND ELECTRONIC APPLICATIONS
    ENHANCING LED PERFORMANCE WITH ADVANCED EPOXY RESINS: A CASE STUDY ON MG CHEMICALS’ ENCAPSULATION SOLUTIONS
PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE
85
  • 7.1 INTRODUCTION
  • 7.2 EPOXY
    EXCEPTIONAL MECHANICAL STRENGTH AND CHEMICAL RESISTANCE TO DRIVE MARKET
  • 7.3 SILICONE
    SUPERIOR FLEXIBILITY AND THERMAL STABILITY PROTECTING ELECTRONICS IN HARSH ENVIRONMENTAL CONDITIONS TO DRIVE MARKET
  • 7.4 ACRYLIC
    FAST CURING TIMES AND STRONG ADHESION PROPERTIES TO DRIVE MARKET
  • 7.5 POLYURETHANES
    EXCELLENT TOUGHNESS AND MOISTURE RESISTANCE PROVIDING ROBUST PROTECTION TO DRIVE MARKET
  • 7.6 OTHER RESIN TYPES
    EPOXY-MODIFIED RESINS
    POLYESTER RESINS
    PARYLENE RESINS
PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE
91
  • 8.1 INTRODUCTION
  • 8.2 HEAT CURE
    EXCEPTIONAL MECHANICAL STRENGTH AND EXCELLENT CHEMICAL RESISTANCE TO DRIVE MARKET
  • 8.3 UV CURE
    RAPID CURING AND ROBUST PROTECTIVE PROPERTIES FACILITATING FASTER PRODUCTION CYCLES TO DRIVE MARKET
  • 8.4 ROOM TEMPERATURE CURE
    MINIMIZED PRODUCTION COSTS AND ADHERENCE TO VARIOUS SUBSTRATES TO DRIVE MARKET
  • 8.5 OTHER CURING TYPES
    MOISTURE CURE
    DUAL-CURE
PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE
96
  • 9.1 INTRODUCTION
  • 9.2 GLOB TOP
    DEMAND FOR MINIATURIZED ELECTRONIC DEVICES REQUIRING PRECISE AND RELIABLE ENCAPSULATION SOLUTIONS TO DRIVE MARKET
  • 9.3 DAM & FILL
    NEED FOR ROBUST PROTECTION AGAINST THERMAL AND MECHANICAL STRESSES IN AUTOMOTIVE ELECTRONICS TO DRIVE MARKET
  • 9.4 CONFORMAL COATINGS
    SAFEGUARDING ELECTRONICS FROM HARSH ENVIRONMENTAL CONDITIONS IN AEROSPACE & DEFENSE SECTOR TO DRIVE MARKET
  • 9.5 UNDERFILL
    ENHANCED RELIABILITY AGAINST MECHANICAL SHOCK AND THERMAL CYCLING IN DEVICES TO DRIVE MARKET
  • 9.6 CONNECT BONDING
    EFFICIENT AND RELIABLE ELECTRICAL CONNECTIONS WITH ENHANCED CONDUCTIVITY AND DURABILITY FOR LIGHTWEIGHT AND COMPACT ELECTRONIC DEVICES TO DRIVE MARKET
  • 9.7 OTHER PRODUCT TYPES
    POTTING COMPOUNDS
    THERMAL INTERFACE MATERIALS
    HOT MELT ADHESIVES
PCB PROTECTION ADHESIVES MARKET, BY APPLICATION
103
  • 10.1 INTRODUCTION
  • 10.2 CONSUMER ELECTRONICS
    INCREASING DEMAND FOR COMPACT AND DURABLE ELECTRONIC DEVICES TO DRIVE MARKET
  • 10.3 AUTOMOTIVE ELECTRONICS
    RELIANCE ON SOPHISTICATED ELECTRONIC COMPONENTS TO ENHANCE VEHICLE FUNCTIONALITY, SAFETY, AND USER EXPERIENCE TO DRIVE MARKET
  • 10.4 AEROSPACE & DEFENSE
    STRINGENT RELIABILITY AND PERFORMANCE REQUIREMENTS TO BOOST MARKET
  • 10.5 MEDICAL DEVICES
    ASSURANCE OF CONSISTENT AND ACCURATE PERFORMANCE OF DIAGNOSTIC EQUIPMENT TO DRIVE MARKET
  • 10.6 OTHER APPLICATIONS
    TELECOMMUNICATION EQUIPMENT
    RENEWABLE ENERGY SYSTEMS
    INDUSTRIAL AUTOMATION
PCB PROTECTION ADHESIVES MARKET, BY REGION
110
  • 11.1 INTRODUCTION
  • 11.2 ASIA PACIFIC
    CHINA
    - Surge in production of integrated circuits and growing demand for advanced medical devices and consumer electronics to drive market
    JAPAN
    - Manufacture of high-quality electronics and innovation in integrated circuits to drive market
    INDIA
    - Government support for electronics and medical devices industries to drive market
    SOUTH KOREA
    - Booming automotive, consumer electronics, and integrated circuits industries to drive market
    TAIWAN
    - Leadership in manufacturing integrated circuits to drive market
    VIETNAM
    - Rapid expansion of semiconductor and electronic manufacturing sectors, coupled with rising foreign direct investments to drive market
    MALAYSIA
    - Significant role in global semiconductor production and expansion of electronic manufacturing sector to drive market
    REST OF ASIA PACIFIC
  • 11.3 NORTH AMERICA
    US
    - Demand for reliable and durable electronic devices across various sectors to drive market
    CANADA
    - Strong aerospace, medical device, and electronics sectors to drive market
    MEXICO
    - Expanding automotive and electronics industries to drive market
  • 11.4 EUROPE
    GERMANY
    - Robust automotive production and expansive aerospace and defense sectors to drive market
    ITALY
    - High-tech aerospace & defense industry and significant automotive manufacturing sector to drive market
    FRANCE
    - Robust growth and investments in electronics, medical devices, and aerospace industries to drive market
    UK
    - Growth of defense and medical technology sectors to drive market
    SPAIN
    - Prominent automotive and aerospace industries to drive market
    NETHERLANDS
    - Advanced electronics such as drones and strong focus on innovation to drive market
    REST OF EUROPE
  • 11.5 REST OF THE WORLD
    ISRAEL
    - Substantial investments in semiconductor manufacturing and robust growth of defense sector to drive market
    SOUTH AFRICA
    - Manufacture of semiconductors, diverse electronics, and expanding automotive industry to drive market
    OTHER COUNTRIES
COMPETITIVE LANDSCAPE
179
  • 12.1 INTRODUCTION
  • 12.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
  • 12.3 MARKET SHARE ANALYSIS
    MARKET SHARE OF KEY PLAYERS
  • 12.4 REVENUE ANALYSIS
  • 12.5 BRAND/PRODUCT COMPARATIVE ANALYSIS
  • 12.6 COMPANY EVALUATION MATRIX, KEY PLAYERS, 2023
    STARS
    EMERGING LEADERS
    PERVASIVE PLAYERS
    PARTICIPANTS
    COMPANY FOOTPRINT
  • 12.7 COMPANY EVALUATION MATRIX, STARTUPS/SMES, 2023
    PROGRESSIVE COMPANIES
    RESPONSIVE COMPANIES
    DYNAMIC COMPANIES
    STARTING BLOCKS
    COMPETITIVE BENCHMARKING
    - Detailed list of key startups/SMEs
    VALUATION AND FINANCIAL METRICS OF KEY PCB PROTECTION ADHESIVE VENDORS
  • 12.8 COMPETITIVE SCENARIOS AND TRENDS
    PRODUCT LAUNCHES
    DEALS
    EXPANSIONS
COMPANY PROFILES
210
  • 13.1 KEY PLAYERS
    HENKEL AG & CO. KGAA
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    H.B. FULLER COMPANY
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    DOW
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    PARKER HANNIFIN CORP
    - Business overview
    - Products/Solutions/Services offered
    - MnM view
    DUPONT
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    NAGASE CHEMTEX CORPORATION
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    PANACOL-ELOSOL GMBH
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    SHIN-ETSU CHEMICAL CO., LTD
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    HUNTSMAN INTERNATIONAL LLC.
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
    WACKER CHEMIE AG
    - Business overview
    - Products/Solutions/Services offered
    - Recent developments
    - MnM view
  • 13.2 OTHER PLAYERS
    CHEMTRONICS
    ELECTROLUBE
    ITW PERFORMANCE POLYMERS
    THREEBOND HOLDINGS CO., LTD.
    HERNON MANUFACTURING
    WEICON GMBH & CO. KG
    DYMAX
    CHASE CORPORATION
    MG CHEMICALS
    MASTERBOND
    ROBNOR RESINLAB LTD.
    MOMENTIVE PERFORMANCE MATERIALS
    DELO INDUSTRIAL ADHESIVES LLC
    CEMEDINE CO., LTD.
    CSL SILICONES INC.
APPENDIX
272
  • 14.1 DISCUSSION GUIDE
  • 14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
  • 14.3 CUSTOMIZATION OPTIONS
  • 14.4 RELATED REPORTS
  • 14.5 AUTHOR DETAILS
LIST OF TABLES
 
  • TABLE 1 AVERAGE SELLING PRICE OF PCB PROTECTION ADHESIVES, BY REGION, 2020–2028 (USD/KG)
  • TABLE 2 AVERAGE SELLING PRICE, BY RESIN TYPE, 2020–2023 (USD/KG)
  • TABLE 3 AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY RESIN TYPE (USD/KG)
  • TABLE 4 PCB PROTECTION ADHESIVES MARKET: ECOSYSTEM
  • TABLE 5 KEY TECHNOLOGIES IN PCB PROTECTION ADHESIVES MARKET
  • TABLE 6 COMPLEMENTARY TECHNOLOGIES IN PCB PROTECTION ADHESIVES MARKET
  • TABLE 7 ADJACENT TECHNOLOGIES IN PCB PROTECTION ADHESIVES MARKET
  • TABLE 8 PCB PROTECTION ADHESIVES MARKET: TOTAL NUMBER OF PATENTS
  • TABLE 9 PCB PROTECTION ADHESIVES MARKET: LIST OF MAJOR PATENT OWNERS
  • TABLE 10 PCB PROTECTION ADHESIVES MARKET: LIST OF MAJOR PATENTS, 2018–2024
  • TABLE 11 PCB PROTECTION ADHESIVES MARKET: LIST OF KEY CONFERENCES & EVENTS, 2024–2025
  • TABLE 12 TARIFF RELATED TO PCB PROTECTION ADHESIVES
  • TABLE 13 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 14 EUROPE: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 15 ASIA PACIFIC: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 16 MIDDLE EAST & AFRICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 17 SOUTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 18 LIST OF REGULATIONS FOR PCB PROTECTION ADHESIVES MARKET
  • TABLE 19 PCB PROTECTION ADHESIVES MARKET: PORTER'S FIVE FORCES ANALYSIS
  • TABLE 20 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END-USE INDUSTRIES
  • TABLE 21 KEY BUYING CRITERIA FOR END-USE INDUSTRIES
  • TABLE 22 PROJECTED REAL GDP GROWTH (ANNUAL PERCENTAGE CHANGE) OF KEY COUNTRIES, 2018–2025
  • TABLE 23 PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (USD MILLION)
  • TABLE 24 PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (USD MILLION)
  • TABLE 25 PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (KILOTON)
  • TABLE 26 PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 ( KILOTON)
  • TABLE 27 PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2020–2023 (USD MILLION)
  • TABLE 28 PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2024–2029 (USD MILLION)
  • TABLE 29 PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 30 PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 31 PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 32 PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 33 PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 34 PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 35 PCB PROTECTION ADHESIVES MARKET, BY REGION, 2020–2023 (USD MILLION)
  • TABLE 36 PCB PROTECTION ADHESIVES MARKET, BY REGION, 2024–2029 (USD MILLION)
  • TABLE 37 PCB PROTECTION ADHESIVES MARKET, BY REGION, 2020–2023 (KILOTON)
  • TABLE 38 PCB PROTECTION ADHESIVES MARKET, BY REGION, 2024–2029 (KILOTON)
  • TABLE 39 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 40 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 41 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (KILOTON)
  • TABLE 42 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (KILOTON)
  • TABLE 43 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (USD MILLION)
  • TABLE 44 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (USD MILLION)
  • TABLE 45 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (KILOTON)
  • TABLE 46 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (KILOTON)
  • TABLE 47 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 48 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 49 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2020–2023 (USD MILLION)
  • TABLE 50 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2024–2029 (USD MILLION)
  • TABLE 51 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 52 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 53 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 54 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 55 CHINA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 56 CHINA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 57 CHINA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 58 CHINA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 59 JAPAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 60 JAPAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 61 JAPAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 62 JAPAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 63 INDIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 64 INDIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 65 INDIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 66 INDIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 67 SOUTH KOREA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 68 SOUTH KOREA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 69 SOUTH KOREA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 70 SOUTH KOREA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 71 TAIWAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 72 TAIWAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 73 TAIWAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 74 TAIWAN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 75 VIETNAM: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 76 VIETNAM: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 77 VIETNAM: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 78 VIETNAM: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 79 MALAYSIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 80 MALAYSIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 81 MALAYSIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 82 MALAYSIA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 83 REST OF ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 84 REST OF ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 85 REST OF ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 86 REST OF ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 87 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 88 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 89 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (KILOTON)
  • TABLE 90 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (KILOTON)
  • TABLE 91 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (USD MILLION)
  • TABLE 92 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (USD MILLION)
  • TABLE 93 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (KILOTON)
  • TABLE 94 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (KILOTON)
  • TABLE 95 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 96 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 97 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2020–2023 (USD MILLION)
  • TABLE 98 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2024–2029 (USD MILLION)
  • TABLE 99 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 100 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 101 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 102 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 103 US: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 104 US: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 105 US: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 106 US: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 107 CANADA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 108 CANADA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 109 CANADA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 110 CANADA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 111 MEXICO: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 112 MEXICO: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 113 MEXICO: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 114 MEXICO: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 115 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 116 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 117 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (KILOTON)
  • TABLE 118 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (KILOTON)
  • TABLE 119 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (USD MILLION)
  • TABLE 120 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (USD MILLION)
  • TABLE 121 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (KILOTON)
  • TABLE 122 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (KILOTON)
  • TABLE 123 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 124 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 125 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2020–2023 (USD MILLION)
  • TABLE 126 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2024–2029 (USD MILLION)
  • TABLE 127 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 128 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 129 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 130 EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 131 GERMANY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 132 GERMANY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 133 GERMANY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 134 GERMANY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 135 ITALY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 136 ITALY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 137 ITALY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 138 ITALY: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 139 FRANCE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 140 FRANCE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 141 FRANCE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 142 FRANCE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 143 UK: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 144 UK: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 145 UK: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 146 UK: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 147 SPAIN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 148 SPAIN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 149 SPAIN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 150 SPAIN: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 151 NETHERLANDS: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 152 NETHERLANDS: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 153 NETHERLANDS: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 154 NETHERLANDS: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 155 REST OF EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 156 REST OF EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 157 REST OF EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 158 REST OF EUROPE: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 159 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
  • TABLE 160 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
  • TABLE 161 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2020–2023 (KILOTON)
  • TABLE 162 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY COUNTRY, 2024–2029 (KILOTON)
  • TABLE 163 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (USD MILLION)
  • TABLE 164 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (USD MILLION)
  • TABLE 165 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2020–2023 (KILOTON)
  • TABLE 166 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY RESIN TYPE, 2024–2029 (KILOTON)
  • TABLE 167 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION)
  • TABLE 168 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION)
  • TABLE 169 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2020–2023 (USD MILLION)
  • TABLE 170 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY CURING TYPE, 2024–2029 (USD MILLION)
  • TABLE 171 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 172 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 173 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 174 REST OF THE WORLD: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 175 ISRAEL: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 176 ISRAEL: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 177 ISRAEL: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 178 ISRAEL: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 179 SOUTH AFRICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 180 SOUTH AFRICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 181 SOUTH AFRICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 182 SOUTH AFRICA: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 183 OTHER COUNTRIES: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (USD MILLION)
  • TABLE 184 OTHER COUNTRIES: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (USD MILLION)
  • TABLE 185 OTHER COUNTRIES: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2020–2023 (KILOTON)
  • TABLE 186 OTHER COUNTRIES: PCB PROTECTION ADHESIVES MARKET, BY APPLICATION, 2024–2029 (KILOTON)
  • TABLE 187 OVERVIEW OF STRATEGIES ADOPTED BY KEY PCB PROTECTION ADHESIVE MANUFACTURERS
  • TABLE 188 PCB PROTECTION ADHESIVES MARKET: DEGREE OF COMPETITION
  • TABLE 189 PCB PROTECTION ADHESIVES MARKET: RESIN TYPE FOOTPRINT
  • TABLE 190 PCB PROTECTION ADHESIVES MARKET: CURING TYPE FOOTPRINT
  • TABLE 191 PCB PROTECTION ADHESIVES MARKET: APPLICATION FOOTPRINT
  • TABLE 192 PCB PROTECTION ADHESIVES MARKET: REGION FOOTPRINT
  • TABLE 193 PCB PROTECTION ADHESIVES MARKET: DETAILED LIST OF KEY STARTUPS/SMES
  • TABLE 194 PCB PROTECTION ADHESIVES MARKET: SME PLAYERS, RESIN TYPE FOOTPRINT
  • TABLE 195 PCB PROTECTION ADHESIVES MARKET: SME PLAYERS, CURING TYPE FOOTPRINT
  • TABLE 196 PCB PROTECTION ADHESIVES MARKET: SME PLAYERS, APPLICATION FOOTPRINT
  • TABLE 197 PCB PROTECTION ADHESIVES MARKET: SME PLAYERS, REGION FOOTPRINT
  • TABLE 198 PCB PROTECTION ADHESIVES MARKET: PRODUCT LAUNCHES, JANUARY 2021– JULY 2024
  • TABLE 199 PCB PROTECTION ADHESIVES MARKET: DEALS, JANUARY 2021– JULY 2024
  • TABLE 200 PCB PROTECTION ADHESIVES MARKET: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 201 HENKEL AG & CO. KGAA: COMPANY OVERVIEW
  • TABLE 202 HENKEL AG & CO. KGAA: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 203 HENKEL AG & CO. KGAA: PRODUCT LAUNCHES, JANUARY 2021–JULY 2024
  • TABLE 204 HENKEL AG & CO. KGAA: DEALS, JANUARY 2021–JULY 2024
  • TABLE 205 HENKEL AG & CO. KGAA: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 206 HENKEL AG & CO. KGAA: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 207 H.B. FULLER COMPANY: COMPANY OVERVIEW
  • TABLE 208 H.B. FULLER COMPANY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 209 H.B. FULLER COMPANY: DEALS, JANUARY 2021–JULY 2024
  • TABLE 210 H.B. FULLER COMPANY: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 211 DOW: COMPANY OVERVIEW
  • TABLE 212 DOW: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 213 DOW: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 214 DOW: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 215 PARKER HANNIFIN CORP: COMPANY OVERVIEW
  • TABLE 216 PARKER HANNIFIN CORP: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 217 DUPONT: COMPANY OVERVIEW
  • TABLE 218 DUPONT: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 219 DUPONT: PRODUCT LAUNCHES, JANUARY 2021–JULY 2024
  • TABLE 220 DUPONT: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 221 DUPONT: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 222 NAGASE CHEMTEX CORPORATION: COMPANY OVERVIEW
  • TABLE 223 NAGASE CHEMTEX CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 224 NAGASE CHEMTEX CORPORATION: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 225 PANACOL-ELOSOL GMBH: COMPANY OVERVIEW
  • TABLE 226 PANACOL-ELOSOL GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 227 PANACOL-ELOSOL GMBH: PRODUCT LAUNCHES, JANUARY 2021–JULY 2024
  • TABLE 228 PANACOL-ELOSOL GMBH: DEALS, JANUARY 2021–JULY 2024
  • TABLE 229 PANACOL-ELOSOL GMBH: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 230 PANACOL-ELOSOL GMBH: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 231 SHIN-ETSU CHEMICAL CO., LTD: COMPANY OVERVIEW
  • TABLE 232 SHIN-ETSU CHEMICAL CO., LTD: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 233 SHIN-ETSU CHEMICAL CO., LTD: PRODUCT LAUNCHES, JANUARY 2021–JULY 2024
  • TABLE 234 SHIN-ETSU CHEMICAL CO., LTD: OTHERS, JANUARY 2021–JULY 2024
  • TABLE 235 HUNTSMAN INTERNATIONAL LLC.: COMPANY OVERVIEW
  • TABLE 236 HUNTSMAN INTERNATIONAL LLC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 237 HUNTSMAN INTERNATIONAL LLC.: PRODUCT LAUNCHES, JANUARY 2021–JULY 2024
  • TABLE 238 HUNTSMAN INTERNATIONAL LLC.: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 239 WACKER CHEMIE AG: COMPANY OVERVIEW
  • TABLE 240 WACKER CHEMIE AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 241 WACKER CHEMIE AG: DEALS, JANUARY 2021–JULY 2024
  • TABLE 242 WACKER CHEMIE AG: EXPANSIONS, JANUARY 2021–JULY 2024
  • TABLE 243 CHEMTRONICS: COMPANY OVERVIEW
  • TABLE 244 ELECTROLUBE: COMPANY OVERVIEW
  • TABLE 245 ITW PERFORMANCE POLYMERS: COMPANY OVERVIEW
  • TABLE 246 THREEBOND HOLDINGS CO., LTD.: COMPANY OVERVIEW
  • TABLE 247 HERNON MANUFACTURING: COMPANY OVERVIEW
  • TABLE 248 WEICON GMBH & CO. KG: COMPANY OVERVIEW
  • TABLE 249 DYMAX: COMPANY OVERVIEW
  • TABLE 250 CHASE CORPORATION: COMPANY OVERVIEW
  • TABLE 251 MG CHEMICALS: COMPANY OVERVIEW
  • TABLE 252 MASTERBOND: COMPANY OVERVIEW
  • TABLE 253 ROBNOR RESINLAB LTD.: COMPANY OVERVIEW
  • TABLE 254 MOMENTIVE PERFORMANCE MATERIALS: COMPANY OVERVIEW
  • TABLE 255 DELO INDUSTRIAL ADHESIVES LLC: COMPANY OVERVIEW
  • TABLE 256 CEMEDINE CO., LTD.: COMPANY OVERVIEW
  • TABLE 257 CSL SILICONES INC.: COMPANY OVERVIEW
LIST OF FIGURES
 
  • FIGURE 1 PCB PROTECTION ADHESIVES MARKET SEGMENTATION
  • FIGURE 2 PCB PROTECTION ADHESIVES MARKET: RESEARCH DESIGN
  • FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE APPROACH
  • FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: DEMAND-SIDE APPROACH
  • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 7 PCB PROTECTION ADHESIVES MARKET: DATA TRIANGULATION
  • FIGURE 8 EPOXY RESIN TYPE SEGMENT TO DOMINATE MARKET BETWEEN 2024 AND 2029
  • FIGURE 9 UV CURE CURING TYPE SEGMENT TO LEAD MARKET BETWEEN 2024 AND 2029
  • FIGURE 10 CONFORMAL COATINGS PRODUCT TYPE SEGMENT TO LEAD MARKET BETWEEN 2024 AND 2029
  • FIGURE 11 CONSUMER ELECTRONICS APPLICATION SEGMENT TO LEAD MARKET BETWEEN 2024 AND 2029
  • FIGURE 12 ASIA PACIFIC TO DOMINATE MARKET DURING FORECAST PERIOD
  • FIGURE 13 GROWING DEMAND FROM ELECTRONICS SECTOR TO DRIVE MARKET
  • FIGURE 14 SILICONE RESIN TYPE TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 15 CONSUMER ELECTRONICS TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 16 CHINA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 17 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN PCB PROTECTION ADHESIVES MARKET
  • FIGURE 18 APPLICATION OF AI ACROSS VARIOUS BUSINESS AREAS IN CHEMICAL INDUSTRY
  • FIGURE 19 APPLICATION OF GEN AI IN PCB PROTECTION ADHESIVES MARKET
  • FIGURE 20 REVENUE SHIFT OF PCB PROTECTION ADHESIVES MARKET
  • FIGURE 21 OVERVIEW OF PCB PROTECTION ADHESIVES MARKET VALUE CHAIN
  • FIGURE 22 AVERAGE SELLING PRICE TREND OF PCB PROTECTION ADHESIVES, BY REGION
  • FIGURE 23 PCB PROTECTION ADHESIVES MARKET: AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY RESIN TYPE
  • FIGURE 24 NUMBER OF PATENTS GRANTED, 2014−2023
  • FIGURE 25 PCB PROTECTION ADHESIVES MARKET: LEGAL STATUS OF PATENTS
  • FIGURE 26 PATENT ANALYSIS FOR PCB PROTECTION ADHESIVES, BY JURISDICTION, 2014−2023
  • FIGURE 27 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENTS IN LAST 10 YEARS
  • FIGURE 28 IMPORTS OF PCB PROTECTION ADHESIVES FOR HS CODE 350610, BY COUNTRY, 2020–2023 (USD THOUSAND)
  • FIGURE 29 EXPORTS OF PCB PROTECTION ADHESIVES FOR HS CODE 350610, BY COUNTRY, 2020–2023 (USD THOUSAND)
  • FIGURE 30 PORTER’S FIVE FORCES ANALYSIS
  • FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END-USE INDUSTRIES
  • FIGURE 32 KEY BUYING CRITERIA FOR END-USE INDUSTRIES
  • FIGURE 33 EPOXY SEGMENT TO LEAD MARKET DURING FORECAST PERIOD
  • FIGURE 34 UV CURE TO BE LARGEST CURING TYPE SEGMENT IN PCB PROTECTION ADHESIVES MARKET IN 2029
  • FIGURE 35 CONFORMAL COATINGS SEGMENT TO LEAD MARKET DURING FORECAST PERIOD
  • FIGURE 36 CONSUMER ELECTRONICS TO BE LARGEST APPLICATION SEGMENT OF PCB PROTECTION ADHESIVES MARKET IN 2024
  • FIGURE 37 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 38 ASIA PACIFIC: PCB PROTECTION ADHESIVES MARKET SNAPSHOT
  • FIGURE 39 NORTH AMERICA: PCB PROTECTION ADHESIVES MARKET SNAPSHOT
  • FIGURE 40 EUROPE: PCB PROTECTION ADHESIVES MARKET SNAPSHOT
  • FIGURE 41 PCB PROTECTION ADHESIVES MARKET: SHARE OF KEY PLAYERS
  • FIGURE 42 REVENUE ANALYSIS OF KEY PLAYERS, 2020–2024
  • FIGURE 43 BRAND/PRODUCT COMPARATIVE ANALYSIS, BY SEGMENT
  • FIGURE 44 PCB PROTECTION ADHESIVES MARKET: COMPANY EVALUATION MATRIX, 2023
  • FIGURE 45 PCB PROTECTION ADHESIVES MARKET: OVERALL COMPANY FOOTPRINT
  • FIGURE 46 PCB PROTECTION ADHESIVES MARKET: COMPANY EVALUATION MATRIX, STARTUPS/SMES, 2023
  • FIGURE 47 EV/EBITDA OF KEY VENDORS
  • FIGURE 48 YEAR-TO-DATE (YTD) PRICE TOTAL RETURN
  • FIGURE 49 HENKEL AG & CO. KGAA: COMPANY SNAPSHOT
  • FIGURE 50 H.B. FULLER COMPANY: COMPANY SNAPSHOT
  • FIGURE 51 DOW: COMPANY SNAPSHOT
  • FIGURE 52 PARKER HANNIFIN CORP: COMPANY SNAPSHOT
  • FIGURE 53 DUPONT: COMPANY SNAPSHOT
  • FIGURE 54 NAGASE CHEMTEX CORPORATION: COMPANY SNAPSHOT
  • FIGURE 55 PANACOL-ELOSOL GMBH: COMPANY SNAPSHOT
  • FIGURE 56 SHIN-ETSU CHEMICAL CO., LTD: COMPANY SNAPSHOT
  • FIGURE 57 HUNTSMAN INTERNATIONAL LLC.: COMPANY SNAPSHOT
  • FIGURE 58 WACKER CHEMIE AG: COMPANY SNAPSHOT

The study involved four major activities in estimating the market size of the PCB encapsulation market. Exhaustive secondary research was done to collect information on the market, the peer market, and the parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, the market breakdown and data triangulation procedures were used to estimate the market size of the segments and subsegments.

Secondary Research

In the secondary research process, various secondary sources have been referred to for identifying and collecting information for this study. These secondary sources include annual reports, press releases, investor presentations of companies, white papers, certified publications, trade directories, articles from recognized authors, the gold standard and silver standard websites, and databases.

Secondary research has been used to obtain key information about the value chain of the industry, the monetary chain of the market, the total pool of key players, market classification, and segmentation according to industry trends to the bottom-most level and regional markets. It was also used to obtain information about the key developments from a market-oriented perspective.

Primary Research

The PCB encapsulation market comprises several stakeholders in the value chain, which include PCB adhesives, PCB manufacturers and end users. Various primary sources from the supply and demand sides of the PCB encapsulation market have been interviewed to obtain qualitative and quantitative information. The primary interviewees from the demand side include key opinion leaders in end-use sectors. The primary sources from the supply side include manufacturers, associations, and institutions involved in the Cranes rental industry.

Primary interviews were conducted to gather insights such as market statistics, data on revenue collected from the products and services, market breakdowns, market size estimations, market forecasting, and data triangulation. Primary research also helped in understanding the various trends related to resin type, application, product type, Curing type and region. Stakeholders from the demand side, such as CIOs, CTOs, and CSOs, were interviewed to understand the buyer’s perspective on the suppliers, products, fabricators, and their current usage of PCB adhesives and the outlook of their business, which will affect the overall market.

The breakdown of profiles of the primary interviewees is illustrated in the figure below:

Note: Tier 1, Tier 2, and Tier 3 companies are classified based on their market revenue in 2023, available in the public domain, product portfolios, and geographical presence.

Other designations include consultants and sales, marketing, and procurement managers.

To know about the assumptions considered for the study, download the pdf brochure

COMPANY NAME DESIGNATION
H.B. Fuller Company (US) Sales manager
Henkel AG & Co. KGaA (Germany) Operations Manager
Parker Hannifin Corp (US) Vice President & District Manager
Panacol-Elosol GmbH (Germany) Head – adhesive Business
Wacker Chemie AG (Germany) PCB adhesive Specialist

Market Size Estimation

The top-down and bottom-up approaches have been used to estimate and validate the size of the PCB encapsulation market.

  • The key players in the industry have been identified through extensive secondary research.
  • The industry's supply chain has been determined through primary and secondary research.
  • All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.
  • All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to obtain the final quantitative and qualitative data.
  • The research includes the study of reports, reviews, and newsletters of the key market players, along with extensive interviews for opinions with leaders such as directors and marketing executives.

Data Triangulation

After arriving at the total market size from the estimation process explained above, the overall market has been split into several segments and sub-segments. To complete the overall market engineering process and arrive at the exact statistics for all the segments and sub-segments, the data triangulation and market breakdown procedures have been employed, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply sides. Along with this, the market size has been validated by using both the top-down and bottom-up approaches and primary interviews. Hence, for every data segment, there have been three sources—top-down approach, bottom-up approach, and expert interviews. The data was assumed correct when the values arrived from the three sources matched.

Market Definition

The PCB encapsulation market represents an array of adhesive solutions that are tailored to protect printed circuit boards from environmental and operational stresses, thereby ensuring the reliability and durability of the same. Segmentation can be done based on curing type, resin type, application, product type, and regional presence. Curing types include UV curing, heat curing, and room temperature curing. Each of these has a number of different advantages with respect to processing time and application methods. Basically, there are four main types of resin includes epoxy, silicone, polyurethane, and acrylic. Each resin gives unique properties of protection, which include chemical resistance, thermal stability, and mechanical strength. The application segments here are diversified, and the major sectors that drive demand for PCB encapsulation are consumer electronics, automotive, industrial, aerospace, and medical devices. Major product types in this market are conformal coatings and encapsulation compounds, and underfill materials—all of which have specific protective functions for different applications of PCBs. Geographically, the market has a strong presence across North America, Europe, Asia-Pacific, and other regions. Of these, Asia-Pacific has a lead in the market due to its large-scale electronics manufacturing base. This increasing technological advancement and rise in demand for durable and high-performance electronic devices further drive the growth of the PCB encapsulation market on a global basis.

Stakeholders

  • Adhesives manufacturers
  • Electronic industrial manufacturers
  • Medical device manufacturers
  • Research and development institutes
  • Regulatory bodies
  • Environmental groups
  • End-users

Report Objectives

  • To define, describe, and forecast the size of the PCB encapsulation  market, in terms of value and volume.
  • To provide detailed information regarding the major factors (drivers, opportunities, restraints, and challenges) influencing the growth of the market
  • To estimate and forecast the market size based on product resin type, curing type, product type  application, grade and region.
  • To forecast the size of the market with respect to major regions, namely, Europe, North America, Asia Pacific and rest of the world, along with their key countries.
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and their contribution to the overall market.
  • To analyze opportunities in the market for stakeholders and provide a competitive landscape of market leaders.
  • To track and analyze recent developments such as expansions, new product launches, partnerships & agreements, and acquisitions in the market.
  • To strategically profile key market players and comprehensively analyze their core competencies.

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Growth opportunities and latent adjacency in PCB Encapsulation Market

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