Here are relevant reports on : fuzzy-logic-market

• Industrial IoT Market Size, Share & Industry Trends Growth Analysis Report by Offering (Hardware (Processors, Connectivity ICs, Sensors, Memory Devices, Logic Devices), Software (PLM, MES, SCADA, OMS), Platforms), Connectivity Technology, Deployment, Vertical and Region - Global Forecast to 2029

  The industrial IoT market is expected to grow from USD 194.4 billion in 2024 to USD 286.3 billion by 2029, at a compound annual growth rate (CAGR) of 8.1% during the forecast period.The key players ABB (Switzerland), General Electric (US), Emerson Electric Co. (US), Intel Corporation (US), Cisco Systems, Inc. (US), SAP SE (Germany), Honeywell International Inc. (US), Siemens (Germany), Huawei Technologies Co., Ltd. (China), Rockwell Automation (US), Arm Limited (UK), PTC (US), Dassault Systèmes (France), IBM (US), Robert Bosch GmbH (Germany), NEC Corporation (Japan), ANSYS, Inc. (US), Worldsensing (Spain), Arundo (Norway), Software AG (Germany).

  • Published: June 2024
  • Price: $ 4950
  • TOC Available:

• Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029

  The global interposer and FOWLP market size is expected to grow from USD 35.6 billion in 2024 to USD 63.5 billion by 2029, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea).

  • Published: January 2024
  • Price: $ 4950
  • TOC Available:

• 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

  The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).

  • Published: May 2023
  • Price: $ 4950
  • TOC Available:

• IoT Chip Market Size, Share by Hardware (Processor, Connectivity IC, Sensor, Memory Device and Logic Device), Power Consumption, End-use Application (Wearable Devices, Consumer Electronics, Building Automation and Retail) and Region - Global Forecast to 2025

  The IoT Chip Market is expected to grow from USD 392.0 billion in 2020 to USD 525.4 billion by 2025, at a CAGR of 6.0% during the forecast period. Key players in the IoT chip market are Intel Corporation (US), Texas Instruments Incorporated (US), Qualcomm Incorporated (US), NXP Semiconductors N.V. (Netherlands), MediaTek Inc. (Taiwan), Marvell Technology Group Ltd. (Bermuda), Microchip Technology Inc. (US), Cypress Semiconductor Corporation (US), Renesas Electronics Corporation (Japan), Huawei Technologies Co., Ltd. (China), NVIDIA Corporation (US), Samsung Electronics (South Korea), Advanced Micro Devices (US), STMicroelectronics N.V. (Switzerland), TE Connectivity Ltd (Switzerland), Nordic Semiconductor (Norway), GainSpan (US), Expressif Systems (China), Dialog Semiconductor (UK), and Silicon Labs (US). These players are increasingly undertaking product launches and developments and acquisitions to develop and introduce new technologies and products in the market.

  • Published: June 2020
  • Price: $ 7150
  • TOC Available:

• High-Integrity Pressure Protection System (HIPPS) Market Size, Share, Statistics and Industry Growth Analysis Report by Component (Field Initiator, Logic Solver, Valves, Actuators), Service (Maintenance, TIC), Industry (Oil & Gas, Chemical) and Region (2025-2030)

  The global High Integrity Pressure Protection System market is anticipated to grow from USD 422.0 million in 2025 to USD 564.2 million by 2030, recording a CAGR of 6.0% during 2025–2030. A few of the key players in the HIPPS market are Emerson Electric Co. (US), Yokogawa Electric Corp. (Japan), HIMA (Germany), Rockwell Automation Inc. (US), Schneider Electric (France), Honeywell International (US), ABB (Switzerland), Siemens (Germany), Schlumberger (US), and Baker Hughes (US) are among the major players in the HIPPS market.

  • Published: January 2022
  • Price: $ 4950
  • TOC Available:

• 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028

  The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).

  • Published: September 2023
  • Price: $ 4950
  • TOC Available:

• IoT Node and Gateway Market Size by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029

  The IoT Node and Gateway market is expected to grow from USD 424.6 billion in 2024 to USD 604.7 billion by 2029, at a compound annual growth rate (CAGR) of 7.3% during the forecast period.The key players Intel Corporation (US), Qualcomm Technologies, Inc. (US), Texas Instruments Incorporated (US), STMicroelectronics (Switzerland), Microchip Technology Inc. (US), Huawei Technologies Co., Ltd. (China), NXP Semiconductors N.V. (Netherlands), Cisco Systems, Inc. (US), Hewlett Packard Enterprise Development LP (US), TE Connectivity Ltd (Switzerland), Advantech Co., Ltd. (Taiwan), Dell Technologies (US).

  • Published: May 2024
  • Price: $ 7150
  • TOC Available:

• Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

  The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).

  • Published: September 2022
  • Price: $ 4950
  • TOC Available:

• SCADA Market by Component (Programmable Logic Controller (PLC), Remote Terminal Unit (RTU), Human-Machine Interface (HMI), Communication Systems, I/O Devices, Storage Servers, Supervisory Systems), Offering, End User and Region - Global Forecast to 2029

  The global SCADA market is expected to grow from USD 9.8 billion in 2022 to USD 14.2 billion by 2027, at a compound annual growth rate (CAGR) of 7.8% during the forecast period.The Top Players Rockwell Automation (US), Schneider Electric (France), Emerson Electric (US), Siemens (Germany), and ABB (Switzerland).

  • Published: April 2024
  • Price: $ 4950
  • TOC Available:

• Spin on Carbon Market Size, Share & Industry Trends Analysis Report by Type (Hot-Temperature Spin on Carbon, Normal-temperature Spin on Carbon), Application (Logic Devices, Memory Devices, Power Devices, Photonics, Advanced Packaging), End User and Region - Global Forecast to 2028

  According to MarketsandMarkets, the spin on carbon market is projected to reach USD 747 million by 2028, registering a CAGR of 30.2% during the forecast period. Key players in the spin on carbon market include Samsung SDI Co., Ltd. (South Korea), Merck KGaA (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), YCCHEM Co., Ltd. (South Korea), Brewer Science, Inc. (US), JSR Micro, Inc. (US), KOYJ Co., Ltd. (South Korea), Irresistible Materials Ltd (UK), Nano-C (US), and DNF Co., Ltd. (South Korea) among others.

  • Published: December 2023
  • Price: $ 4950
  • TOC Available:

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