Here are relevant reports on : fuzzy-logic-market
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Cold Chain Market by Type, Temperature Type (Chilled, Frozen, and Deep-frozen), Application (Food & Beverages, Pharmaceuticals), Technology (Blast Freezing, Vapor Compression, Programmable Logic Controller) and Region - Global Forecast to 2029
The global cold chain market size is projected to reach USD 372.0 billion by 2029, displaying a promising Compound Annual Growth Rate (CAGR) of 10.3% during the forecast period. The key players in the market are Americold Logistics, Inc. (US), Lineage, Inc. (US), NICHIREI CORPORATION (Japan), Burris Logistics (US), A.P. Moller - Maersk (Denmark), Tippmann Group (US), Coldman Logistics Pvt.Ltd. (India), and United States Cold Storage (US).
- Published: March 2024
- Price: $ 4950
- TOC Available:
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SCADA Market by Component (Programmable Logic Controllers (PLCs), Remote Terminal Units (RTUs), Human-machine Interfaces (HMIs), Communication Systems, Input/Output (I/O) Devices, Sensors, Actuators, Terminal Blocks, Connectors) - Global Forecast to 2030
The global SCADA market is expected to grow from USD 12.89 billion in 2025 to USD 20.05 billion by 2030, at a compound annual growth rate (CAGR) of 9.2% during the forecast period. The Key Players Rockwell Automation (US), Schneider Electric (France), ABB (Switzerland), Siemens (Germany)and Emerson Electric Co.(US)
- Published: July 2025
- Price: $ 4950
- TOC Available:
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China IoT Market by Hardware (Processor, Memory, Logic, Sensor, & Connectivity), Software (Real-Time Streaming, Network Security, Data Management, Remote Monitoring, & Bandwidth Management), Platform, Service, and Application - Global Forecast to 2022
The China IoT market is expected to have a high growth potential till 2022. The total market is expected to reach USD 121.45 Billion by 2022 from USD 11.00 Billion in 2015, at a CAGR of 41.1% between 2016 and 2022. The major driving factors for the growth of the China IoT market are the growing demand for smartphones and other connecting devices, increasing internet penetration, rising trends of industrial automation, and mainstream adoption of cloud computing.
- Published: July 2016
- Price: $ 4950
- TOC Available:
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North America IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity Ic, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-Use Application, and Country
The North America IoT technology market is estimated to reach USD 314.75 billion by 2030, from USD 279.90 billion in 2025, with a CAGR of 2.4% from 2025 to 2030.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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Logic Analyzer Market by Type (Modular Logic Analyzers, PC-Based Logic Analyzers), Channel Count (2-32, 32-80, >80), Vertical (Electronics & Semiconductor, Automotive & Transportation, Aerospace & Defense), and Geography - Global Forecast to 2024-2036
The global logic analyzer market was valued at USD 416.1 million in 2024 and is estimated to reach USD 1,038.7 million by 2036, at a CAGR of 8.0% between 2025 and 2036.Keysight Technologies (US), Fortive (US), Rohde & Schwarz (Germany), National Instruments (US), Yokogawa Electric (Japan), Teledyne (US), Advantest Corporation (Japan), ARM Limited (UK), GAO Tek (Canada), Rigol Technologies (China), Saleae, Inc (US), Good Will Instrument Co., Ltd. (Taiwan), Zeroplus Technology Co., Ltd (Taiwan), Qingdao Hantek Electronic Co., Ltd. (China), NCI Logic Analyzers (US), Scientech Technologies Pvt. Ltd. (India), OWON Technology (China), IKALOGIC (France), Red Pitaya (Europe), and GSAS Micro Systems Pvt Ltd. (India) are among the major companies operating in the logic analyzer market.
- Published: March 2026
- Price: $ 4950
- TOC Available:
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
The 3D stacking market size is expected to grow from USD 1.2 billion in 2023 to USD 3.1 billion by 2028, at a compound annual growth rate (CAGR) of 20.4% during the forecast period. The key players Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan).
- Published: September 2023
- Price: $ 4950
- TOC Available:
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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Electro Hydraulics Market for Off-Highway Equipment by Type (Excavators, Backhoe Loaders, Wheel Loaders, Agriculture Loaders), Component (Hydraulic Cylinders, Electric Motors, Hydraulic Pumps, Control Valves, Sensors, Electronic Control Unit, Programmable Logic Controller), Type, and Region - Global Forecast to 2032
The electro hydraulics market for off-highway equipment is projected to grow from 92,501 units in 2025 to 234,487 units by 2032 at a CAGR of 14.2%. Europe is projected to account for the largest share of the global electro hydraulics market for off-highway equipment during the forecast period, at ~40%. The growing demand for electro hydraulics in this region is driven by the need for more efficient technologies, higher productivity, and the strong presence of major electro hydraulics technology providers. The dominance of the European market is further enhanced due to the presence of key technology providers, such as Bosch Rexroth (Germany), Power-Packer Europa B.V. (Netherlands), Poclain (France), and Walvoil S.p.A (Italy). The region also has a strong presence of several leading off-highway equipment manufacturers, including AB Volvo (Sweden), Liebherr (Switzerland), J C Bamford Excavators Ltd. (UK), and CNH Industrial N.V. (Italy). These technology providers have developed advanced electro hydraulic systems for many off-highway machines.
- Published: July 2025
- Price: $ 4950
- TOC Available:
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IoT Node and Gateway Market Size by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029
The IoT Node and Gateway market is expected to grow from USD 424.6 billion in 2024 to USD 604.7 billion by 2029, at a compound annual growth rate (CAGR) of 7.3% during the forecast period.The key players Intel Corporation (US), Qualcomm Technologies, Inc. (US), Texas Instruments Incorporated (US), STMicroelectronics (Switzerland), Microchip Technology Inc. (US), Huawei Technologies Co., Ltd. (China), NXP Semiconductors N.V. (Netherlands), Cisco Systems, Inc. (US), Hewlett Packard Enterprise Development LP (US), TE Connectivity Ltd (Switzerland), Advantech Co., Ltd. (Taiwan), Dell Technologies (US).
- Published: May 2024
- Price: $ 7150
- TOC Available:
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Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks), System Type (0.33 NA EUV System (NXE), 0.55 NA EUV System (EXE)), Integrated Device Manufacturers, Foundries, Logic Chips, Memory Chips - Global Forecast to 2032
The extreme ultraviolet (EUV) lithography market is projected to grow from USD 15.84 billion in 2026 to USD 30.36 billion by 2032, at a CAGR of 11.4%. The key Players ASML (Netherlands), as well as key component providers such as KLA Corporation (US), ZEISS Group (Germany), TRUMPF (Germany), AGC Inc. (Japan), Lasertec Corporation (Japan), HOYA Corporation (Japan), Applied Materials, Inc. (US), Ushio Inc. (Japan), NTT Advanced Technology Corporation (Japan), ADVANTEST CORPORATION (Japan), SUSS MicroTec SE (Germany), Rigaku Holdings Corporation (Japan), Tekscend Photomask (Japan), and ADVANTEST CORPORATION (Japan).
- Published: January 2026
- Price: $ 4950
- TOC Available:
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