Spin on Carbon Market Size, Share Analysis Report

Updated on : Oct 22, 2024

Spin on Carbon Market Size & Share

The global spin on carbon market size is projected to grow from USD 199 million in 2023 to USD 747 million by 2028, growing at a CAGR of 30.2% during the forecast period from 2023 to 2029

The rapid technological advancements in semiconductor manufacturing, the complexity of integrated circuits, and the development of advanced packaging solutions are expected to propel the spin on carbon in the semiconductor market in the next five years. However, competitive substitution materials will likely pose challenges for industry players.

The objective of the report is to define, describe, and forecast the spin on carbon industry based on material type, application, end user, and region.

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Spin on Carbon Market Dynamics.

Driver:  Expansion of EUV (Extreme Ultraviolet) Lithography in Memory manufacturing

With the growing adoption of data-driven technologies, artificial intelligence, and various high-performance computing applications, demand is increasing for more powerful and efficient chips. Prominent companies such as Intel Corporation, Advanced Micro Devices, Inc., and Taiwan Semiconductor Manufacturing Company Limited have invested substantially in EUV lithography equipment.

Spin-on-carbon (SOC) hard mask is useful for the multilayer lithography process because of its high etch resistance, low cost of ownership, low defectivity, high alignment accuracy, good gap filling and planarization for topography. The increasing adoption and development of spin on carbon with EUV lithography process by market players are also driving the market growth.

For instance, in 2022, Brewer Science, Inc. successfully developed a pattern transfer process using their high-temperature SOC with EUV lithography. Thus, Spin-on carbon materials play a critical role in supporting and enhancing the capabilities of EUV lithography, thereby contributing to the growth of the spin on carbon market.

Restraint: Availability of substitute competitive materials

In the field of semiconductor manufacturing, several materials can serve as alternatives or substitutes for spin-on carbon materials that possess comparable or improved properties and performance characteristics.

These key substitutes include spin-on metal, spin-on glass, dielectric polymers and coatings, organic polymers, and others. Inorganic hardmasks, such as silicon nitride (SiN) and silicon oxide (SiO2), offer higher etch resistance and thermal stability than SOC.

This makes them more suitable for use in advanced semiconductor applications, such as extreme ultraviolet (EUV) lithography. However, the growing demand for SOC in advanced semiconductor applications is expected to drive the market growth.

Opportunities: Continued miniaturization of electronic devices

The growing trend of miniaturization in passive electronic components is leading to their integration into consumer electronics like smartphones, cameras, and speakers. Continued miniaturization of electronic devices indeed creates significant opportunities for the spin on the carbon market.

As the demand for smaller, faster, and more energy-efficient electronic devices continues to grow, the role of spin-on carbon materials becomes increasingly critical in enabling the development of advanced semiconductor technologies.

Further, the demand for advanced semiconductors with higher performance and miniaturization increases, and the sales of electronic materials used in semiconductor fabrication processes are expected to be driven by this segment. Thus, electronic materials such as SOC will experience substantial growth in the near future due to the increasing trend of miniaturization.

Challenges: Technical challenges associated with the SOC materials

As the development of new SOC materials and processing methods progresses, the problem of spin-on carbon breakdown at high temperatures is likely to be solved. This will make SOC a more viable option for a wider range of applications.

SOC materials play an important role in the multilayer process of integrated circuit manufacturing to achieve smaller feature sizes. However, selecting a suitable SOC material is challenging because some manufacturing processes require high temperatures ranging from 300°C to 500°C, which can cause the SOC to break down. This breakdown can be caused by several factors, including the SOC polymer's chemical structure, processing temperature, and the presence of contaminants.

Spin on Carbon Market Map/Ecosystem

Spin on Carbon Market: Key Trends.

The prominent players in the spin on carbon market are Samsung SDI Co., Ltd. (South Korea), Merck KGaA (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), YCCHEM CO., Ltd. (South Korea), Brewer Science, Inc. (US), JSR Micro, Inc. (US), KOYJ CO., Ltd. (South Korea), Irresistible Materials Ltd (UK), Nano-C (US), and DNF Co., Ltd. (South Korea) among others. These companies boast mixing trends with a comprehensive product portfolio and strong geographic footprint.

Hot-Temperature Spin on carbon is expected to grow at the highest CARG in the spin on carbon in the semiconductor market during the forecast period.

The hot-temperature spin on carbon is expected to account for a significant share and grow at the highest CAGR during the forecast period. Hot-temperature spin on carbon materials is often used in advanced semiconductor processes, including those at high temperatures.

Moreover, increasing demand for advanced semiconductor devices such as miniaturized and high-performance electronic products also contributes towards the market growth. Thus, the increasing adoption of advanced semiconductor processes such as EUV lithography will drive market growth.

Power devices are expected to grow at the second highest CARG in the spin on carbon in the semiconductor market in 2023.

The power devices segment is expected to account for a significant share and grow at the second highest CAGR during the forecast period. Some common types of power devices include power diodes, power transistors, thyristors, and others.

Spin on carbon materials play a significant role in the development and fabrication of power devices, contributing to various aspects of their design, manufacturing, and performance. Moreover, rising demand for high-energy and power-efficient devices in the electronics segment is further driving the demand of spin on carbon market.

Spin on carbon in the semiconductor market is expected to have a high market share in Taiwan from the Asia Pacific region during the forecast period.

The Asia Pacific region continues to be a significant market for spin on carbons. The fastest-growing market for foundries in Asia Pacific is largely based on increasing investments by TSMC (Taiwan), the world’s leading foundry, to expand capabilities in manufacturing smaller nodes.

The company has made substantial investments in EUV infrastructure and has been instrumental in driving the development and commercialization of EUV lithography systems. With its strong semiconductor ecosystem and commitment to technological innovation, Taiwan plays a crucial role in advancing the capabilities and widespread adoption of EUV lithography in the semiconductor industry which will also increase the demand for spin on carbon in the manufacturing process.

The demand for smaller, faster, and more power-efficient semiconductors is driving the adoption of advanced technologies, such as EUV, advanced packaging technologies, and others. This will enable the production of high-density and high-performance chips crucial for meeting the demands of consumer electronics manufacturers in the region and thus drive the demand for spin on carbon semiconductor material in the region.

Top Companies in Spin on Carbon Market Key Market Players

Major vendors in the spin on carbon companies include

• Samsung SDI Co., Ltd. (South Korea),
• Merck KGaA (Germany),
• Shin-Etsu Chemical Co., Ltd. (Japan),
• YCCHEM Co., Ltd. (South Korea),
• DONGJIN SEMICHEM CO LTD (South Korea),
• Brewer Science, Inc. (US),
• JSR Micro, Inc. (US),
• KOYJ Co., Ltd. (South Korea),
• Irresistible Materials Ltd (UK),
• Nano-C (US), and
• DNF Co., Ltd. (South Korea) among others.

Spin on Carbon market  Report Scope:

This report categorizes the spin on the carbon market based on material type, application, end-user, and region.

By Material Type

• Hot-temperature spin on carbon
• Normal-temperature spin  on carbon

By Application

• Logic Devices
• Memory Devices
• Power Devices
• MEMS
• Photonics
• Advanced Packaging

By End User

• Foundries
• Integrated Device Manufacturers (IDMs) and outsourced Semiconductor Assembly and Test (OSAT)

By Region

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
  • Rest of Asia Pacific
• RoW
  • South America
  • GCC
  • Rest of the Middle East & Africa

Recent Developments in Spin on Carbon Industry

• In September 2023, Samsung Electronics announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung’s ongoing commitment to enriching vRAN and Open RAN ecosystems.
• In February 2023, Merck KGaA expanded its presence in Kaohsiung, Taiwan, for a new production facility in its semiconductor solutions business. The site is to be expanded in multiple stages.
• In August 2023, Brewer Science, Inc. unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023. This new material improvements for advanced packaging, focusing on excellent bonding uniformity, optimizing adhesion for high-density substrates, ensuring high-temperature stability, and groundbreaking innovations in surface modification.

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