Here are relevant reports on : silicon-market

• Silicon Nitride Market by Type (Reaction Bonded Silicon Nitride, Hot Pressed Silicon Nitride, Sintered Silicon Nitride), End-use Industry (Photovoltaic, Automotive, General Industrial, Aerospace, Medical), and Region - Global Forecast to 2023

  The market size of silicon nitride is projected to grow from USD 90 million in 2018 to USD 127 million by 2023, at a CAGR of 7.2% during the forecast period. Silicon nitride (Si3N4) is an inorganic, non-metallic compound of silicon and nitrogen. It is used as a ceramic material. It offers excellent resistance against abrasion, corrosion, and most chemicals. Among the advanced ceramics, silicon nitride has the highest fracture resistance than other advanced ceramic. Hence, these desirable properties make silicon nitride a suitable material for use in end-use industries such as solar photovoltaic, automotive, general industrial, aerospace, and medical among.UBE (Japan), Denka (Japan), AlzChem (Germany), H.C. Starck (Germany), Yantai Tomley Hi-Tech Advanced Materials Co. Ltd (China), and Vesta Si (Sweden). The leading players for the fabrication of silicon nitride are 3M (US), CeramTec (Germany), Kyocera Fine Ceramics (Japan), Morgan Advanced Ceramics (UK), Toshiba (Japan), Rogers Corporation (US), and CoorsTek (US).

  • Published: May 2019
  • Price: $ 4950
  • TOC Available:

• Photonic Integrated Circuit (IC) & Quantum Computing Market (2012 – 2022): By Application (Optical Fiber Communication, Optical Fiber Sensors, Biomedical); Components (Lasers, Attenuators); Raw Materials (Silica on Silicon, Silicon on Insulator)

  Photonic Integrated Circuits are electronic ICs which are put to use in integrating multiple optical components such as lasers, modulators, detectors, attenuators, multiplexers/de-multiplexers and optical amplifiers. Technically, it is an apparatus on a plane substrate where light is guided to the plane of the substrate from one optical component to the other. Photonic ICs increase the functionality of an electronic IC which is meant to integrate transistors, capacitors and transistors.

  • Published: December 2012
  • Price: $ 4950
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• Through-Silicon Vias (TSV) IC Packaging Market, Global Forecast & Analysis (2011-2016)

  Advancment in IC packaging allows the end product to be smaller like smart cell phone,Tablets. Through silicon vias (TSV) is an advanced teqnique of pckaging where electronic product occupy less space and provide more connectivity. TSV is used to connect multiple ICs togeher in one package. TSV can be used in a no. of market including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips.

  • Published: July 2025
  • Price: $ 4950
  • TOC Available:

• Silicon Wafer Market by Type, End-Use Industry, Application and Region - Global Forecast to 2030

  The silicon wafer market plays a crucial role in the semiconductor industry as silicon wafers serve as the fundamental substrate for manufacturing integrated circuits (ICs) and other semiconductor devices. The market outlook for the silicon wafer industry is influenced by various factors, including technological advancements, demand for electronic devices, and industry trends.

  • Published: July 2025
  • Price: $ 4950
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• Ferro Silicon Market by Type (Atomized Ferrosilicon, Milled ferrosilicon), Application (Deoxidizer, Inoculants), End-use Industry (Stainless Steel, Cast Iron, Magnesium), and Region (Asia Pacific, Europe, North America, MEA, SA) - Global Forecast to 2028

  The ferro silicon market is expected to grow from USD 10.9 billion in 2023 to USD 12.9 billion by 2028, at a CAGR of 3.4% during the forecast period. Agreement and expansions are the major growth strategies adopted by the key players in the market. The key global players in the ferrosilicon market include Elkem (Norway), RFA International (Switzerland), DMS Powders (South Africa), Ferroglobe (UK), Eurasian Resources Group (Luxembourg), Feng Erda Group (China), Finnfjord AS (Norway), Mechel PAO (Russia), Om Holdings Ltd (Singapore), Maithan Alloys Ltd (India).

  • Published: November 2023
  • Price: $ 4950
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• Food Anti-Caking Agents Market by Type (Calcium Compounds, Sodium Compounds, Silicon Dioxide, and Microcrystalline Cellulose), Application (Seasonings and Condiments, Bakery, Dairy, and Soups and Sauces), Source & Region - Global Forecast to 2025

  The Food Anti-Caking Agents Market is expected to grow from USD 822 million in 2020 to USD 1,074 million by 2025, at a CAGR of 5.5% during the forecast period. The major vendors in the global food anti-caking agents market are Evonik Industries AG (US), PPG Industries, Inc. (US), Brenntag AG (Germany), Univar Solutions Inc. (US) and Solvay SA (Belgium).

  • Published: February 2021
  • Price: $ 4950
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• Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors and Cables), Components (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Photodetectors) - Global Forecast to 2030

  The global silicon photonics market is expected to grow from USD 2.65 billion in 2025 to USD 9.65 billion by 2030, at a compound annual growth rate (CAGR) of 29.5% during the forecast period. The Key Players Cisco Systems, Inc.(US), Intel Corporation (US), MACOM (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell (US), Coherent Corporation (US), IBM (US), and STMicroelectronics (Switzerland).

  • Published: April 2025
  • Price: $ 4950
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• Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)

  The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.

  • Published: April 2012
  • Price: $ 4950
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• Solar Encapsulation Market by Material (EVA, PVB, PDMS, Ionomer, TPU, Polyolefin), Technology (Crystalline Silicon, Thin-film Solar), Application (Ground-mounted, Building-integrated Photovoltaic, Floating Photovoltaic) & Region - Global Forecast to 2028

  The global Solar encapsulation market is projected to reach USD 7.2 billion by 2028; it is expected to record a CAGR of 8.0% during the forecast period. Some of the major players in the solar encapsulation market are Mitsui Chemicals, Inc. (Japan), Elkem ASA (Norway), Dow (US), 3M (US), and DuPont (US). The major strategies these players adopt include new product launches, contracts, agreements, partnerships, and investments & expansions.

  • Published: January 2024
  • Price: $ 4950
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• Silicon Photomultiplier Market by Offering (NUV, RGB), Type (Analog, Digital), Application (LiDAR and 3D Ranging, BioPhotonics & Medical Imaging, High energy Physics), End User, and Geography 2026

  The silicon photomultiplier market is expected to reach USD 173 million by 2026, at a CAGR of 7.6% during the forecast period. Some of the key companies operating in the market are ON Semiconductor (US), Broadcom (US), Hamamatsu Photonics (Japan), First Sensor (Germany), KETEK GmbH (Germany), AdvanSiD (Italy), Cremat (US), Excelitas Technologies (US), and so on.

  • Published: December 2021
  • Price: $ 4950
  • TOC Available:

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