Board-to-Board Connectors Market Size, Share & Growth

Updated on : October 22, 2024

Board-to-Board Connectors Market Size & Growth

The global board-to-board connectors market size was valued at USD 11.6 billion in 2023 and is estimated to reach USD 15.4 billion by 2028, growing at a CAGR of 5.8% between 2023 to 2028.

The increasing demand for electronic devices is driving the growth of the board-to-board connectors market. With the rising adoption of smartphones, tablets, wearables, IoT devices, and other electronic systems, there is a need for efficient interconnectivity solutions. Technological advancements in areas such as telecommunications, automotive, industrial automation, healthcare, and consumer electronics require advanced board-to-board connectors.

Board-to-Board Connectors Market Forecast to 2028

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Board-to-Board Connectors Market Trends:

Market Dynamics:

Driver: Rapid technological advancements in several applications such as electronics and telecommunications

Rapid technological advancements in several applications such as electronics and telecommunications is a significant driver of the board-to-board connectors market. The continuous evolution of electronic devices and advancements in various industries necessitate the use of advanced connectors to meet the ever-increasing connectivity demands. In consumer electronics, smartphones, tablets, and wearable devices constantly evolve with new features and functionalities. These advancements require smaller, more efficient board-to-board connectors that accommodate complex circuitry while maintaining reliable interconnections. As devices become slimmer and more compact, the connectors must follow suit, enabling seamless communication between PCBs within the limited space. Thus, the rapid technological advancements across various industries drive the need for board-to-board connectors as they meet the demands for miniaturization, high-speed data transfer, signal integrity, and reliable interconnections to enable seamless integration and support the advancement of technology in the modern world.

Restraint: Technological complexities involved while developing application-specific board-to-board connectors

Each application has unique requirements for board-to-board connectors regarding signal integrity, power transmission, size constraints, environmental conditions, and mechanical considerations. Designing and developing connectors that meet these specific requirements can be complex and time-consuming. Additionally, the rapid pace of technological advancements and the need for customization for different applications and industries further contribute to the restraints.

Opportunity: Growing Adoption of IoT and Edge computing

The increasing adoption of IoT devices and edge computing solutions drives the demand for board-to-board connectors to support connectivity between devices, sensors, and edge computing modules. This provides opportunities for connectors with specific features like low power consumption, secure connections, and robust designs for IoT and edge computing applications. For example, edge computing is utilized in the industrial sector for real-time monitoring and control of manufacturing processes. Board-to-board connectors enable the interconnection of sensors, actuators, and processing units, allowing efficient data transfer and decision-making at the edge of the network. In the innovative home sector, IoT devices such as smart thermostats, lighting systems, and security cameras rely on board-to-board connectors to establish connections between the control unit and various sensors or actuators distributed throughout the home.

Challenge: Large technical challenges related to signal integrity and high-speed data transmission

With increasing data transfer rates, ensuring reliable signal transmission with minimal loss, distortion, and interference becomes crucial. Factors such as insertion loss, reflection, crosstalk, impedance control, noise, EMI, skew, timing issues, material selection, and connector crosstalk all contribute to these challenges. Manufacturers must employ advanced design techniques, rigorous testing methodologies, and high-quality materials to address these challenges. Collaboration with customers and considering specific application requirements are key to delivering board-to-board connectors that meet the demanding needs of high-speed data transmission systems. Continuous investment in research and development is necessary to improve connector performance, optimize signal paths, and mitigate the effects of noise, interference, and transmission errors.

Board-To-Board Connectors Market Ecosystem

The Board-To-Board Connectors market is competitive, with major companies such as Amphenol Corporation, TE Connectivity, Japan Aviation Electronics, Hirose Electric Co Ltd, Molex, and numerous small- and medium-sized enterprises. Almost all players offer various products, including pin headers and sockets. These components are widely used in consumer electronics, automotive, telecommunications, industrial automation, healthcare, and others.

Board-to-Board Connectors Market Segmentation

Based on type socket segment is expected to have highest CAGR during the forecast period.

The sockets segment is growing at the highest CAGR in the board-to-board connectors market. Sockets offer a high degree of flexibility and interchangeability, allowing for easy replacement and reconfiguration of components. This feature is precious in industries where frequent changes or upgrades to electronic devices are common, such as consumer electronics or telecommunications. The board-to-board connectors are compatible with a wide range of board-to-board connectors, making them suitable for various applications and industries. Hence, the growth in industries such as consumer electronics is positively impacting the demand for sockets.

Based on pitch, the 1 mm to 2 mm segment is projected to largest market share during the forecast period

The 1 mm to 2 mm pitch connectors are known for their compact size, allowing for electronic device miniaturization. As devices become smaller and more lightweight, connectors with smaller pitches become crucial for enabling the integration of components within limited spaces. This is particularly important in applications where multiple signals, power lines, or data paths must be efficiently routed between boards or modules. These advantages over other pitch types positively impact 1 mm to 2 mm pitch board-to-board connectors.

Board-to-Board Connectors Industry Regional Analysis

Based on region, Asia Pacific is projected to grow fastest for the board-to-board connectors market

Many countries in the Asia Pacific region are actively pursuing smart manufacturing initiatives and adopting Industry 4.0 technologies. This includes the integration of automation, robotics, IoT, and data analytics in manufacturing processes. Board-to-board connectors play a crucial role in facilitating seamless connectivity and communication between different components in smart manufacturing systems, thereby driving the market growth.

Board-to-Board Connectors Market by Region

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Top Board-to-Board Connectors Companies - Key Market Players

The board-to-board connectors companies is dominated by a few globally established players such as

• Amphenol Corporation (US),
• TE Connectivity (Switzerland),
• Japan Aviation Electronics (Japan),
• Hirose Electric Co Ltd (Japan),
• Molex (US),
• Omron Corporation (Japan),
• Samtec (US),
• Harting Technology Group (Germany),
• FIT Hon Teng Limited (Taiwan),
• Kyocera Corporation (Japan),
• CSCONN Corporation (China)

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Scope of the Report

Board-to-Board Connectors Market Highlights

This research report categorizes the board-to-board connectors market based on type, pitch, and application, and region

Recent Developments

• In March 2023, Hirose Electric Co. Ltd.has introduced the IT14 Series, a hermaphroditic board-to-board connector that enables high-speed data transmission at up to 112Gbps using PAM4 technology. The release of the IT14 Series primarily aims to ensure a consistent and reliable supply of components for the telecommunications equipment market. This series is specifically designed to meet the demands and requirements of the telecommunications industry.
• In June 2022, Molex, , has officially launched the Molex Quad-Row Board-to-Board Connectors. This connector series introduces an innovative staggered-circuit layout, resulting in a remarkable 30% reduction in space compared to conventional connector designs. With these patent-pending connectors, product developers and device manufacturers gain enhanced freedom and flexibility to accommodate compact form factors across a wide range of applications, including smartphones, smartwatches, wearables, game consoles, and Augmented Reality/Virtual Reality (AR/VR) devices.
• In April 2022, TE Connectivity has launched new 369 series connector which is ideal for hard and confined environments. While retaining full compatibility with existing 369 connectors, the sealed panel mount connector from the 369 series introduces numerous enhanced features.
• In December 2021, HIROSE Electric Co. Ltd. a manufacturer of cutting-edge connector solutions, has unveiled its BM46 Board-to-Board connectors. These connectors serve as an ideal solution for customers in search of compact-sized connectors that offer exceptional performance and reliable retention security.

Frequently Asked Questions (FAQ):

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