TABLE OF CONTENTS
1 Introduction
1.1. Study Objectives
1.2. Market Definition and Scope
1.2.1. Inclusions and Exclusions
1.3. Study Scope
1.3.1. Markets Covered
1.3.2. Geographic Segmentation
1.3.3. Years Considered for the study
1.4. Currency
1.5. Limitations
1.6. Stakeholders
1.7. Summary of Changes
1.7.1. Recession Impact on Data Center Chip Market
2 Research Methodology
2.1. Research Data
2.1.1. Secondary Data
2.1.1.1. Major Secondary Sources
2.1.1.2. Key Data from Secondary Sources
2.1.2. Primary Data
2.1.2.1. Primary Interviews with Experts
2.1.2.2. Key Data from Primary Sources
2.1.2.3. Key Industry Insights
2.1.2.4. Breakdown of Primaries
2.2. Market Size Estimation
2.2.1. Bottom-Up Approach
2.2.1.1. Approach for Capturing Market Share by Bottom-Up Analysis (Demand Side)
2.2.2. Top-Down Approach
2.2.2.1. Approach for Capturing Market Share by Top-Down Analysis (Supply Side)
2.3. Market Breakdown and Data Triangulation
2.4. Research Assumptions
2.5. Risk Assessment
2.6. Assumptions of Recession
2.7. Limitations of Research
3 Executive Summary
4 Premium Insights
5 Market Overview and Industry Trends
5.1. Introduction
5.2. Market Dynamics
5.3. Trends/Disruptions Impacting Customer’s Business
5.4. Pricing Analysis
5.4.1. Average Selling Price Trend of Key Players, By Component
5.4.2. Average Selling Price Trend, By Region
5.5. Value Chain Analysis
5.6. Ecosystem Analysis
5.7. Investment and Funding Scenario
5.8. Technology Analysis
5.8.1. Key Technology
5.8.2. Complementary Technology
5.8.3. Adjacent Technology
5.9. Sever Cost Structure/ Bill of Material (BOM)
5.9.1. CPU Server
5.9.2. GPU Server
5.10. AI Server’s Current Penetration and Growth Forecast
5.11. Upcoming Deployments of Data Center by Cloud Service Providers (CSPs)
5.12. Cloud Service Providers’ Capex
5.13. Server Procurement by CSP’s (Volume), 2020-2029
5.14. Patent Analysis
5.15. Trade Analysis
5.16. Key Conferences and Events (2024-2025)
5.17. Case Study Analysis
5.18. Regulatory Landscape
5.18.1. Regulatory Bodies, Government Agencies, and Other Organizations
5.19. Porters Five Force Analysis
5.19.1. Threat from New Entrants
5.19.2. Threat of Substitutes
5.19.3. Bargaining Power of Suppliers
5.19.4. Bargaining Power of Buyers
5.19.5. Intensity of Competitive Rivalry
5.20. Key Stakeholders and Buying Criteria
5.20.1. Key Stakeholders in Buying Process
5.20.2. Buying Criteria
6 Data Center Chip Market, By Component
6.1. Introduction
6.2. Processor
6.2.1. CPU
6.2.2. GPU
6.2.3. ASIC
6.2.4. FPGA
6.3. Sensor
6.3.1. Temperature Sensor
6.3.2. Humidity Sensor
6.3.3. Airflow Sensor
6.3.4. Other Sensors
6.4. Power Management
6.4.1. Multiphase Controller
6.4.2. Power Stage
6.4.3. Point-of-Load (POL) (DC/DC Converter)
6.4.4. Low Dropout (LDO)
6.4.5. 48V Intermediate Bus Converter (IBC)
6.4.6. 12V Hot Swap Controller/ eFuse
6.4.7. 48V Hot Swap Controller/ eFuse
6.4.8. Power Sequencer
6.4.9. Baseboard Management Controller (BMC)
6.5. Analog & Mixed-Signal ICs
6.5.1. Multi-Channel ADC/DAC
6.5.2. Switch
6.5.3. Mux
6.5.4. Current Sense Amplifier (CSA)
6.5.5. Supervisory IC
6.5.6. Fan Controller
6.5.7. Clock IC
6.6. Connectivity
6.7. Memory
Note 1: ASIC includes application-specific processors such as TPU, Trainium, Inferentia, Ali, Biren, etc.
Note 2: Other sensors include vibration sensor, proximity and motion sensor, contact closure sensor, etc.
7 Data Center Chip Market, By End-Users
7.1. Introduction
7.2. Hyperscalers/ CSPs
7.3. Server Manufacturers
7.4. Others
Note: Others include Enterprises, Government & Defense, Academic and Research Institutes, etc.
8 Data Center Chip Market, By Region
8.1. Introduction
8.2. North America
8.2.1. Impact of Recession
8.2.2. US
8.2.3. Canada
8.2.4. Mexico
8.3. Europe
8.3.1. Impact of Recession
8.3.2. Germany
8.3.3. UK
8.3.4. France
8.3.5. Rest of Europe
8.4. Asia Pacific
8.4.1. Impact of Recession
8.4.2. China
8.4.3. Japan
8.4.4. South Korea
8.4.5. Rest of Asia Pacific
8.5. RoW
8.5.1. Impact of Recession
8.5.2. Middle East & Africa
8.5.2.1. GCC Countries
8.5.2.2. Rest of Middle East & Africa
8.5.3. South America
9 Data Center Chip Market, Competitive Landscape
9.1. Key Player Strategies/Right to Win
9.2. Revenue Analysis
9.3. Market Share Analysis
9.4. Company Valuation and Financial Metrics
9.5. Product/Brand Comparison
9.6. Company Evaluation Matrix: Key Players, 2023
9.6.1. Stars
9.6.2. Emerging Leaders
9.6.3. Pervasive Players
9.6.4. Participants
9.6.5. Company Footprint: Key Players, 2023
9.6.5.1. Company Footprint
9.6.5.2. Region Footprint
9.6.5.3. Component Footprint
9.6.5.4. Application Footprint
9.7. Company Evaluation Matrix: Startups/SMEs, 2023
9.7.1. Progressive Companies
9.7.2. Responsive Companies
9.7.3. Dynamic Companies
9.7.4. Starting Blocks
9.7.5. Competitive Benchmarking: Startups/SMEs, 2023
9.7.5.1. Detailed List of Key Startups/SMEs
9.7.5.2. Competitive Benchmarking of Key Startups/SMEs
9.8. Competitive Situation and Trends
10 Data Center Chip Market, Company Profiles
10.1. Key Players
10.1.1. NVIDIA Corporation
10.1.2. Intel Corporation
10.1.3. Advanced Micro Devices, Inc.
10.1.4. Google
10.1.5. AWS
10.1.6. Alibaba
10.1.7. Texas Instruments Incorporated
10.1.8. Analog Devices, Inc.
10.1.9. AMS-OSRAM AG
10.1.10. Monolithic Power Systems, Inc.
10.2. Other Players
10.2.1. STMicroelectronics N.V.
10.2.2. Sensirion AG
10.2.3. Honeywell International, Inc.
10.2.4. AKCP
10.2.5. Bosch Sensortec
10.2.6. Renesas Electronics Corporation
10.2.7. Infineon
10.2.8. Diodes Incorporated
10.2.9. Microchip
10.2.10. ASPEED Technology Inc.
10.2.11. Cisco Systems, Inc.
10.2.12. Dell Inc.
10.2.13. Huawei Technologies Co., Ltd.
10.2.14. SEMTECH
10.2.15. ON Semiconductor Corporation
11 Appendix
11.1. Discussion Guide
11.2. Knowledge Store: MarketsandMarkets’ Subscription Portal
11.3. Available Customizations
11.4. Related Reports
11.5. Author Details
Exclusive indicates content/data unique to MarketsandMarkets and not available with any competitors.
Growth opportunities and latent adjacency in Data Center Chip Market