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China Semiconductor Market

Report Code AT 9433
Published in Jun, 2025, By MarketsandMarkets™
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China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semiconductor Export, Alternate Destination - Trends and Strategic Recommendation

The surging demand for semiconductors in the Chinese automotive sector is primarily driven by the rapid adoption of advanced driver assistance systems (ADAS), electric vehicles (EVs), and connected car technologies. These innovations require more sophisticated chips to improve safety, automation, and connectivity. However, China’s heavy reliance on Taiwan for semiconductor supply has increased geopolitical risks and vulnerabilities in the supply chain. In response, leading chipmakers like TSMC are investing in new manufacturing facilities in the United States, Japan, and Europe, supported by government incentives. Additionally, automotive OEMs are increasingly requiring suppliers to ensure geographic redundancy in their production capabilities. This strategic diversification is reshaping global supply chains and reinforcing the resilience of the automotive sector.

China Semiconductor Market

Attractive Opportunities in the China Semiconductor Market

CHINA

By 2025, China's automotive semiconductor industry is expected to experience rapid growth and significant transformation, largely due to its status as the world's largest electric vehicle market and strong government support for achieving chip self-sufficiency. The government has established ambitious goals, requiring domestic automakers to source more than 20% of their chips locally by 2025.

China's ADAS sensor manufacturing sector is experiencing rapid growth, fueled by the government's "China Manufacturing 2025" initiative and the high demand for autonomous driving capabilities.

The emphasis on 12-inch wafer processing in China will create a new revenue stream for major manufacturers.

Rising integration of advanced electrical/electronic architecture, 5G connectivity, and software-defined vehicle features in new vehicles in China is driving the market.

The increasing demand for domestic automotive power semiconductors, especially IGBTs and MOSFETs, is driven by the need for EVs in China.

Global China Semiconductor Market Dynamics

DRIVER: Increased domestic investments in semiconductors

Domestic manufacturers in China are quickly advancing the semiconductor market by increasing investments and expanding production capabilities, especially in response to the rising demand for chips in the automotive sector. These chips are crucial for ADAS, EVs, and connected car technologies. Key players like SMIC and Hua Hong Semiconductor have significantly raised their capital expenditures. A notable investment includes the establishment of a government-backed National IC Industry Investment Fund in May 2024, totaling 344 billion yuan (USD 47 billion). This fund is the largest to date and aims to boost localization and reduce dependence on foreign suppliers. Additionally, companies such as Yangtze Memory Technology Corp (YMTC) and ChangXin Memory Technologies (CXMT) are expanding their production lines. Emerging startups are also securing considerable venture capital for innovations in chip design and materials. The Chinese government supports local manufacturers with substantial funding, favorable policies, and initiatives like “Made in China 2025,” which targets 70% domestic content in core materials by 2025 and aims for complete import substitution by 2030. Recent regulations and government directives, including the dual circulation strategy and indigenous innovation policy, further encourage investments in domestic semiconductor manufacturing and technology development. These combined efforts are rapidly strengthening China’s automotive semiconductor ecosystem, ensuring that the growing demand for next-generation vehicles is met by locally controlled supply chains.

RESTRAINT: Shortage of manufacturing facilities for 12 mm machines

China’s semiconductor manufacturing industry is currently limited by its inability to produce advanced tools and materials necessary for processing 12-inch (300 mm) silicon wafers, which are essential for high-volume and cost-effective chip production. This is especially critical for power-intensive applications like electric and autonomous vehicles, which depend on advanced logic, power management, and sensor chips. Despite significant investments, such as Hua Hong Wuxi’s USD 10 billion Phase II expansion (which became operational on December 10, 2024), SMIC’s plan to add 60,000 wafers per month by the end of 2024, and new 12-inch lines from Runpeng Semiconductor, China continues to rely on foreign suppliers for crucial lithography and wafer fabrication equipment. The main suppliers are from the US, Europe, and Japan, which are restricting exports due to geopolitical and national security concerns. These export controls, including US restrictions on ASML’s EUV lithography tools, aim to limit China’s technological advancement and prevent its military and strategic industries from accessing cutting-edge capabilities. This reflects broader concerns about technology leakage, human rights, and regional security. As a result, while China has rapidly expanded its capacity for mature-node production (14 nm and above)—with companies like SMIC and Nexchip scaling to 100,000 wafers per month at 55 nm and 40 nm nodes, and Huahong focusing on automotive chips—its inability to manufacture or acquire the most advanced wafer processing equipment poses a significant hurdle. This limitation affects China’s competitiveness in leading-edge nodes and restricts growth for wafer thicknesses below 12 inches.

 

OPPORTUNITY: Substantial investments by <12-inch wafer manufacturers

China’s semiconductor manufacturing industry is experiencing significant investment in facilities that produce wafers smaller than 12 inches (the industry typically refers to 8-inch/200 mm and 6-inch/150 mm wafers as “below 12-inch”). This investment surge is fueled by a combination of supportive government policies, strong domestic demand, and increasing interest from foreign investors. The Chinese government has made substantial financial commitments to this sector, exemplified by the launch of the third phase of the National IC Industry Investment Fund in May 2024, which injected USD 47.5 billion to enhance local chip production. Alongside this funding, the government is offering tax incentives, land subsidies, and research and development credits aimed at fostering a resilient supply chain and reducing reliance on foreign technology. At the same time, China’s luxury and high-end vehicle market is rapidly expanding. In 2025, the market size is estimated to reach USD 159.7 billion. Luxury brands such as BMW, Mercedes-Benz, and Lexus are introducing advanced models equipped with cutting-edge technology, autonomous features, and premium infotainment systems—all of which necessitate a growing number of sophisticated semiconductors. This rising demand for luxury vehicles has consequently increased the need for advanced chips manufactured on sub-12-inch wafers, which are critical for complex automotive applications like advanced driver assistance, connectivity, and energy management. Recognizing these prospects, foreign investors are increasingly directing capital into China’s semiconductor sector. This is evident from the joint ventures and technology partnerships announced throughout 2023–2024, including collaborations with global automotive and semiconductor companies to establish new fabrication plants and design centers. This positions the country as a crucial hub for next-generation vehicle electronics.

CHALLENGE: Technological gap and heavy dependence on imported equipment

China’s semiconductor industry is currently dealing with a complex landscape characterized by several challenges. These include a technological gap in advanced manufacturing processes, a heavy dependence on imported equipment, particularly lithography tools from companies like Advanced Semiconductor Materials Lithography, and geopolitical tensions that restrict access to essential foreign technologies. Despite significant government investments, such as the launch of the third National IC Industry Investment Fund in May 2024, which amounts to over USD 47 billion, Chinese companies continue to rely on external suppliers for advanced metrology, coating, and lithography equipment. Export controls from the US and allied countries, including the Netherlands’ restrictions on extreme ultraviolet (EUV) lithography machines, severely limit China’s ability to produce cutting-edge chips at scale. Companies like SMIC and Huawei are advancing with more expensive and less efficient processes to manufacture high-end chips. However, they face low yields and significant economic challenges due to these restrictions. According to a whitepaper published by the GIP Digital Watch Observatory in February 2025, it is projected that China’s semiconductor equipment purchases will decline by 6% in 2025, dropping from USD 41 billion in 2024 to USD 38 billion in 2025, as overcapacity and tightening US sanctions come into effect. US tariffs and export controls, alongside broader technology-related confrontations, continue to influence the trajectory of the sector. This situation compels China to prioritize self-sufficiency and indigenous innovation while creating new uncertainties for global supply chains and foreign investment in the industry.

Global China Semiconductor Market Ecosystem Analysis

The Chinese automotive semiconductor market companies have the latest technologies, diversified portfolios, and global distribution networks. The major players in the China semiconductor market for automotive include SMIC (SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION), GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon.

Top Companies in China Semiconductor Market

Note: The above diagram only shows the representation of the web content management market ecosystem; it is not limited to the companies represented above.
Source: Secondary Research and MarketsandMarkets Analysis

Recent Developments of China Semiconductor Market

  • FAW Group and Tsinghua Unigroup have established a strategic partnership aimed at creating a robust, automotive-grade chip ecosystem in China. Announced in May 2025, the collaboration encompasses chip design, wafer fabrication, packaging and testing, application selection, and integrated system solutions. The partnership seeks to enhance cooperation in domestic chip applications, supply chain development, joint R&D, and market-driven initiatives, leveraging the strengths of each party to improve supply-demand alignment and industrial synergy. Through joint projects, technological breakthroughs, and capital collaboration, FAW and Tsinghua Unigroup strive to set a benchmark for “chip + automotive” industry cooperation and foster innovation in China’s automotive semiconductor sector.
  • United Nova Technology (UNT) and GAC AION, a prominent new energy vehicle manufacturer under GAC Group, have established a joint laboratory focused on the research, development, and design of next-generation automotive semiconductor chips and modules. This partnership, formalized on January 2, 2025, signifies a deepening of their collaboration from prior commercial agreements to joint R&D, encompassing process design, manufacturing, and end-use applications. The lab seeks to strengthen the automotive semiconductor supply chain, accelerate innovation, and address key challenges in automotive-grade power semiconductors, facilitating the transition to smart electric vehicles and improving vehicle performance and energy efficiency.
  • In April 2025, Black Sesame Technologies showcased a chip platform that integrates CPU, DSP, GPU, NPU, MCU, ISP, and CV units at the 2025 Shanghai Auto Show. Manufactured using a 7nm process, it boasts single-chip computing power exceeding 250+ TOPS for next-gen autonomous driving.
  • In April 2025, Black Sesame Technologies showcased a cross-domain fusion chip family at the 2025 Shanghai Auto Show. This technology addresses safety and cost challenges by providing hardware-level security isolation and expanding platform-based computing power. It has already been recognized by international OEMs and is entering mass production.

Key Market Players

List of Top China Semiconductor Market Companies

The China Semiconductor Market is dominated by a few major players that have a wide regional presence. The major players in the China Semiconductor Market are

Key Questions Addressed by the Report

Who are the top players in China’s automotive semiconductor market?

The major players include SMIC (SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION), GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon.

What are the trends for the automotive semiconductor industry in China?

The automotive sector and the Internet of Things (IoT) are significant drivers of demand, largely due to the growth of EVs, autonomous driving technologies, and smart city initiatives. The amount of semiconductors used in vehicles is increasing rapidly. Recent collaborations, such as those between United Nova Technology and GAC AION, as well as FAW Group and Tsinghua Unigroup, are focused on the research and development of automotive-grade chips and the integration of supply chains.

Which are the most prominent factors driving the automotive semiconductor industry in China?

Government support and self-sufficiency goals
Technological advancements
Rise in electric and autonomous vehicles

What are the challenges faced by the automotive semiconductor industry in China?

Geopolitical restrictions and export controls
Technology and talent gaps
Supply chain fragmentation and security
Market adjustment and investment slowdown

Which is the largest market for the semiconductor industry in China?

China’s semiconductor automotive industry holds the largest market for microcontrollers, followed by power semiconductors (IGBTS, MOSFETS).

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Table of Contents

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TITLE
PAGE NO
INTRODUCTION
16
  • 1.1 GLOBAL AUTOMOTIVE SEMICONDUCTOR INDUSTRY OVERVIEW
  • 1.2 HISTORICAL DEVELOPMENT OF CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
    2010–2014
    2015–2020
    2021–2025
  • 1.3 KEY FACTORS DRIVING INDUSTRY SHIFT FROM CHINA
    REGULATORY FACTORS
    - Restrictive controls by US government
    - Chips Act and other global legislation
    - National security concerns
    GEOPOLITICAL FACTORS
    - Taiwan Strait tensions
    - Russia-Ukraine war
    - Technology alliances
    - Technology limitations
    ECONOMIC AND SUPPLY CHAIN FACTORS
    - Rising manufacturing costs in China
    - Incentives from alternative locations
    CHALLENGES
    - Dependency on foreign IP & architecture and gaps in certification
    - Heavy reliance on imported semiconductor manufacturing equipment
CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
25
  • 2.1 CURRENT STATE OF CHINA’S AUTOMOTIVE SEMICONDUCTORS
    MICROCONTROLLERS
    - Key manufacturers, core competencies, and production capacities
    - Future roadmap
    POWER SEMICONDUCTORS
    - Key manufacturers, core competencies, and production capacities
    - Future roadmap
    SENSORS & MEMS
    - Key manufacturers, core competencies, and production capacities
    - Future roadmap
    MEMORY CHIPS
    - Key manufacturers, core competencies, and production capacities
    - Future roadmap
    ANALOG & MIXED-SIGNAL INTEGRATED CIRCUITS
    - Key manufacturers, core competencies, and production capacities
    - Future roadmap
  • 2.2 MARKET VALUE ASSESSMENT
KEY PLAYERS IN CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
35
  • 3.1 DOMESTIC MANUFACTURERS
    SMIC
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    GIGADEVICE
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    NOVOSENSE MICROELECTRONICS
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    SILAN MICROELECTRONICS
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    HISILICON
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    HUA HONG SEMICONDUCTOR LIMITED
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    BYD SEMICONDUCTOR
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    NEXPERIA
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    CHANGXIN MEMORY TECHNOLOGIES
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    YANGTZE MEMORY TECHNOLOGIES CORP
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    GOERTEK MICROELECTRONICS INC.
    - Overview
    - Recent Financials
    - Production plants and capacity
    - Future strategy
    CHINA RESOURCES MICROELECTRONICS LIMITED
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    HESAI TECHNOLOGY
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    OTHERS
  • 3.2 GLOBAL MANUFACTURERS IN CHINA
    NXP SEMICONDUCTORS
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    INFINEON TECHNOLOGIES
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    STMICROELECTRONICS
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    TEXAS INSTRUMENTS
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
    RENESAS ELECTRONICS CORPORATION
    - Overview
    - Recent financials
    - Production plants and capacity
    - Future strategy
  • 3.3 JOINT VENTURES AND STRATEGIC PARTNERSHIPS
EXPORT ANALYSIS OF CHINA'S AUTOMOTIVE SEMICONDUCTORS
61
  • 4.1 KEY EXPORT PRODUCT CATEGORIES
  • 4.2 GLOBAL SEMICONDUCTOR EXPORTS
    ELECTRONIC INTEGRATED CIRCUITS (HS CODE 854231)
    ELECTRONIC INTEGRATED CIRCUITS AS MEMORIES (HS CODE 854232)
    ELECTRONIC INTEGRATED CIRCUITS AS AMPLIFIERS (HS CODE 854233)
    ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS) (HS CODE 854239)
    PARTS OF ELECTRONIC INTEGRATED CIRCUITS (HS CODE 854290)
  • 4.3 EXPORTS FROM CHINA
    ELECTRONIC INTEGRATED CIRCUITS (HS CODE 854231)
    - China
    - Hong Kong, China
    ELECTRONIC INTEGRATED CIRCUITS AS MEMORIES (HS CODE 854232)
    - China
    - Hong Kong, China
    ELECTRONIC INTEGRATED CIRCUITS AS AMPLIFIERS (HS CODE 854233)
    - China
    - Hong Kong, China
    ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS) (HS CODE 854239)
    - China
    - Taipei, China
    - Hong Kong, China
DIVERSIFICATION OF CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
76
  • 5.1 GEOPOLITICAL FACTORS
    US-CHINA TRADE TENSIONS
    - US-China tariffs
    - Diversification strategies
    TECHNOLOGY EXPORT CONTROLS
    - US & Chinese technology export controls
    - Impact of export controls
    NATIONAL SECURITY CONCERNS
  • 5.2 SUPPLY CHAIN RESILIENCE STRATEGIES
    KNOWLEDGE GAINED FROM COVID-19 PANDEMIC
    - Realization by China after Covid-19
    - Impact on global players
    - Shift from JIT to strategic resilience
  • 5.3 ECONOMIC FACTORS
    RISING MANUFACTURING COSTS IN CHINA
    - Cost comparison
    - Bill of Materials
    INCENTIVE PROGRAMS IN ALTERNATIVE LOCATIONS
  • 5.4 IMPACT ON GLOBAL AUTOMOTIVE INDUSTRY
    EFFECTS ON AUTOMOTIVE PRODUCTION COSTS
    SUPPLY CHAIN RELIABILITY AND RESILIENCE
    REGIONAL MANUFACTURING CLUSTERS
    TECHNOLOGY DEVELOPMENT AND INNOVATION PATTERNS
ALTERNATIVE MANUFACTURING DESTINATIONS
86
  • 6.1 OVERVIEW
  • 6.2 COMPARATIVE ANALYSIS OF ALTERNATIVE MANUFACTURING LOCATIONS
    RANKING AS ALTERNATIVES TO CHINA
  • 6.3 TECHNOLOGY DOMINANCE, BY COUNTRY/REGION
  • 6.4 SOUTHEAST ASIA
    MALAYSIA
    - Government incentives and support
    - Key diversifications
    - Challenges
    VIETNAM
    - Government incentives and support
    - Key diversifications
    - Challenges
    THAILAND
    - Government incentives and support
    - Key diversifications
    - Challenges
    SINGAPORE
    - Government incentives and support
    - Key diversifications
    - Challenges
    SOUTH KOREA
    - Government incentives and support
    - Key diversifications
    - Impact of key players
    - Challenges
    TAIWAN
    - Government incentives and support
    - Key diversifications
    - Impact of key players
    - Challenges
  • 6.5 NORTH AMERICA
    GOVERNMENT INCENTIVES AND SUPPORT
    KEY DIVERSIFICATIONS
    - US
    - Mexico
    CHALLENGES
  • 6.6 EUROPE
    INCENTIVES BY EUROPEAN COUNTRIES
    - Germany
    - France
    - Italy
    EUROPEAN MANUFACTURING HUBS
  • 6.7 INDIA
    GOVERNMENT INCENTIVES AND SUPPORT
    KEY DIVERSIFICATIONS
    CHALLENGES
FUTURE OUTLOOK AND RECOMMENDATIONS
101
  • 7.1 PROJECTED INDUSTRY SHIFTS, 2025–2030
  • 7.2 TECHNOLOGY ROADMAP
  • 7.3 STRATEGIC RECOMMENDATIONS FOR INDUSTRY STAKEHOLDERS
    DIVERSIFICATION
    TECHNOLOGY
    SUPPLY CHAIN
LIST OF TABLES
 
  • TABLE 1 AUTOMOTIVE SEMICONDUCTOR COMPONENTS DOMINATED BY CHINA
  • TABLE 2 US EXPORT CONTROLS AND SANCTIONS
  • TABLE 3 SEMICONDUCTOR SUPPORT PROGRAMS
  • TABLE 4 PRICE HIKES OF SEMICONDUCTOR-RELATED MATERIALS BEFORE AND AFTER RUSSIA-UKRAINE WAR
  • TABLE 5 TECHNOLOGY ALLIANCES AND THEIR IMPACT ON CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
  • TABLE 6 COUNTRY-WISE INCENTIVES ON SEMICONDUCTOR COMPONENTS
  • TABLE 7 EQUIPMENT AND KEY FOREIGN SUPPLIERS
  • TABLE 8 MICROCONTROLLERS: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 9 POWER SEMICONDUCTORS: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 10 SENSORS & MEMS: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 11 LIDAR: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 12 MEMORY CHIPS: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 13 ANALOG & MIXED-SIGNAL INTEGRATED CIRCUITS: KEY MANUFACTURERS, CORE COMPETENCIES, AND PRODUCTION CAPACITIES
  • TABLE 14 SMIC: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 15 SMIC: PRODUCTION PLANTS
  • TABLE 16 SMIC: PRODUCTION CAPACITY
  • TABLE 17 GIGADEVICE: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 18 GIGADEVICE: PRODUCTION PLANTS
  • TABLE 19 NOVOSENSE MICROELECTRONICS: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 20 NOVOSENSE MICROELECTRONICS: PRODUCTION PLANTS
  • TABLE 21 NOVOSENSE MICROELECTRONICS: PRODUCTION CAPACITY
  • TABLE 22 SILEN MICROELECTRONICS: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 23 SILEN MICROELECTRONICS: PRODUCTION PLANTS
  • TABLE 24 SILEN MICROELECTRONICS: PRODUCTION CAPACITY
  • TABLE 25 HISILICON: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 26 HISILICON: RECENT FINANCIALS, BY REGION, 2023 VS. 2024
  • TABLE 27 HISILICON: RECENT FINANCIALS, BY BUSINESS SEGMENT, 2023 VS. 2024
  • TABLE 28 HISILICON: PRODUCTION PLANTS
  • TABLE 29 HUA HONG SEMICONDUCTOR LIMITED: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 30 HUA HONG SEMICONDUCTOR LIMITED: RECENT FINANCIALS, BY SERVICE, 2023 VS. 2024
  • TABLE 31 HUA HONG SEMICONDUCTOR LIMITED: RECENT FINANCIALS, BY END MARKET, 2023 VS. 2024
  • TABLE 32 HUA HONG SEMICONDUCTOR LIMITED: PRODUCTION PLANTS
  • TABLE 33 HUA HONG SEMICONDUCTOR LIMITED: PRODUCTION CAPACITY
  • TABLE 34 BYD SEMICONDUCTOR: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 35 BYD SEMICONDUCTOR: PRODUCTION PLANTS
  • TABLE 36 BYD SEMICONDUCTOR: PRODUCTION CAPACITY
  • TABLE 37 NEXPERIA: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 38 NEXPERIA: PRODUCTION PLANTS
  • TABLE 39 NEXPERIA: PRODUCTION CAPACITY
  • TABLE 40 CHANGXIN MEMORY TECHNOLOGIES: PRODUCTION PLANTS
  • TABLE 41 CHANGXIN MEMORY TECHNOLOGIES: PRODUCTION CAPACITY
  • TABLE 42 YANGTZE MEMORY TECHNOLOGIES CORP: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 43 YANGTZE MEMORY TECHNOLOGIES CORP: PRODUCTION PLANTS
  • TABLE 44 YANGTZE MEMORY TECHNOLOGIES CORP: PRODUCTION CAPACITY
  • TABLE 45 GOERTEK MICROELECTRONICS INC.: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 46 GOERTEK MICROELECTRONICS INC.: PRODUCTION PLANTS
  • TABLE 47 CHINA RESOURCES MICROELECTRONICS LIMITED: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 48 CHINA RESOURCES MICROELECTRONICS LIMITED: PRODUCTION PLANTS
  • TABLE 49 CHINA RESOURCES MICROELECTRONICS LIMITED: PRODUCTION CAPACITY
  • TABLE 50 HESAI TECHNOLOGY: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 51 HESAI TECHNOLOGY: PRODUCTION PLANTS
  • TABLE 52 HESAI TECHNOLOGY: PRODUCTION CAPACITY
  • TABLE 53 OTHER CHINESE AUTOMOTIVE SEMICONDUCTOR MANUFACTURERS: RECENT FINANCIALS AND PRODUCTS MANUFACTURED
  • TABLE 54 NXP SEMICONDUCTORS: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 55 NXP SEMICONDUCTORS: PRODUCTION PLANTS
  • TABLE 56 INFINEON TECHNOLOGIES: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 57 INFINEON TECHNOLOGIES: PRODUCTION PLANTS
  • TABLE 58 STMICROELECTRONICS: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 59 STMICROELECTRONICS: PRODUCTION PLANTS
  • TABLE 60 TEXAS INSTRUMENTS: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 61 TEXAS INSTRUMENTS: PRODUCTION PLANTS
  • TABLE 62 RENESAS ELECTRONICS CORPORATION: RECENT FINANCIALS, 2023 VS. 2024
  • TABLE 63 RENESAS ELECTRONICS CORPORATION: PRODUCTION PLANTS
  • TABLE 64 STRATEGIC PARTNERSHIPS BETWEEN SEMICONDUCTOR MANUFACTURERS IN CHINA
  • TABLE 65 GLOBAL SEMICONDUCTOR EXPORTS, BY PRODUCT, 2020–2024 (USD BILLION)
  • TABLE 66 CHINA SEMICONDUCTOR EXPORTS, BY PRODUCT, 2020–2024 (USD BILLION)
  • TABLE 67 EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS, BY COUNTRY, 2020–2024 (USD BILLION)
  • TABLE 68 EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS MEMORIES, BY COUNTRY, 2020–2024 (USD BILLION)
  • TABLE 69 EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS MEMORIES, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 70 EXPORTS OF ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS), BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 71 EXPORTS OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 72 CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 73 HONG KONG, CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 74 CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS MEMORIES, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 75 HONG KONG, CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS MEMORIES, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 76 CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS AMPLIFIERS, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 77 HONG KONG, CHINA: EXPORTS OF ELECTRONICS INTEGRATED CIRCUITS AS AMPLIFIERS, BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 78 CHINA: EXPORTS OF ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS), BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 79 TAIPEI, CHINA: EXPORTS OF ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS), BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 80 HONG KONG, CHINA: EXPORTS OF ELECTRONIC INTEGRATED CIRCUITS (EXCL. PROCESSORS, CONTROLLERS, MEMORIES, AND AMPLIFIERS), BY COUNTRY, 2020–2024 (USD MILLION)
  • TABLE 81 US-CHINA TARIFFS, 2023–2025
  • TABLE 82 US TARIFFS ON KEY CHINESE PRODUCTS/COMPONENTS
  • TABLE 83 CHINESE SEMICONDUCTOR MANUFACTURERS’ DIVERSIFICATION STRATEGIES
  • TABLE 84 US TECHNOLOGY EXPORT CONTROLS AND IMPACT ON CHINA AUTOMOTIVE SEMICONDUCTOR INDUSTRY
  • TABLE 85 CHINESE TECHNOLOGY EXPORT CONTROLS AND IMPACT ON US AUTOMOTIVE SEMICONDUCTOR INDUSTRY
  • TABLE 86 CHINA'S ALLEGATIONS OF CYBERSECURITY AND ESPIONAGE
  • TABLE 87 GLOBAL SUPPLY CHAIN RECALIBRATION: KEY EXAMPLES
  • TABLE 88 COST COMPARISON OF AUTOMOTIVE SEMICONDUCTORS, 2020–2021 VS. 2024–2025
  • TABLE 89 BILL OF MATERIALS OF AUTOMOTIVE SEMICONDUCTORS, 2023 VS. 2024
  • TABLE 90 INCENTIVES/SUBSIDIES FOR AUTOMOTIVE SEMICONDUCTOR MANUFACTURING OUTSIDE CHINA
  • TABLE 91 COMPARATIVE ANALYSIS OF ALTERNATIVE MANUFACTURING LOCATIONS
  • TABLE 92 TECHNOLOGY DOMINANCE, BY COUNTRY/REGION
  • TABLE 93 PLAYERS DIVERSIFYING TO MALAYSIA AND THEIR AUTOMOTIVE FOCUS
  • TABLE 94 PLAYERS DIVERSIFYING TO VIETNAM AND THEIR AUTOMOTIVE FOCUS
  • TABLE 95 PLAYERS DIVERSIFYING TO THAILAND AND THEIR AUTOMOTIVE FOCUS
  • TABLE 96 PLAYERS DIVERSIFYING TO SINGAPORE AND THEIR AUTOMOTIVE FOCUS
  • TABLE 97 PLAYERS DIVERSIFYING TO SOUTH KOREA AND THEIR AUTOMOTIVE FOCUS
  • TABLE 98 PLAYERS DIVERSIFYING TO TAIWAN AND THEIR AUTOMOTIVE FOCUS
  • TABLE 99 PLAYERS DIVERSIFYING TO US AND THEIR AUTOMOTIVE FOCUS
  • TABLE 100 PLAYERS DIVERSIFYING TO MEXICO AND THEIR AUTOMOTIVE FOCUS
  • TABLE 101 INCENTIVES FOR AUTOMOTIVE SEMICONDUCTOR INDUSTRY BY EUROPEAN COUNTRIES
  • TABLE 102 EUROPEAN SEMICONDUCTOR MANUFACTURING HUBS
  • TABLE 103 PLAYERS DIVERSIFYING TO INDIA AND THEIR AUTOMOTIVE FOCUS
  • TABLE 104 AUTOMOTIVE SEMICONDUCTOR TECHNOLOGY ROADMAP, 2024–2030
  • TABLE 105 STRATEGY FOR COUNTRY SELECTION
  • TABLE 106 STRATEGY FOR TECHNOLOGY SELECTION
  • TABLE 107 STRATEGY FOR COLLABORATIVE MODELS
LIST OF FIGURES
 
  • FIGURE 1 SEMICONDUCTOR TECHNOLOGY TREND, 1987–2023
  • FIGURE 2 GLOBAL SEMICONDUCTOR EXPORTS, 2020 VS. 2024
  • FIGURE 3 CHINA AND HONG KONG SEMICONDUCTOR EXPORTS, 2020 VS. 2024
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