3D IC and 2.5D IC Packaging Market Size and Share

Updated on : October 22, 2024

The 3D IC and 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, growing at a CAGR of 10.7% during the forecast period from 2022 to 2028.

Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market.

3D IC and 2.5D IC Packaging Market Forecast to 2028

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3D IC and 2.5D IC Packaging Market Dynamics

Driver: Growing demand for consumer electronics and gaming devices

With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling.

In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period.

Restraint: Thermal issues resulting from higher level of integration

3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal.

Opportunity: Rising number of smart infrastructure and smart city projects

3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability.

Challenge:  Reliability challenges with 3D IC packaging

The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial.

3D IC and 2.5D IC Packaging Market Ecosystem

The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions.

Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market

Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products.

MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages.

3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions.

Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions.

3D IC and 2.5D IC Packaging Market by Region

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3D IC and 2.5D IC Packaging Market Key Players

The major players in the 3D IC and 2.5D IC packaging Companies include. The key players such as Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan). These companies have used both organic and inorganic growth strategies such as product launches, acquisitions, and partnerships to strengthen their position in the market.

3D IC and 2.5D IC Packaging Market Report Scope

3D IC and 2.5D IC Packaging Market Highlights

The study segments the 3D IC and 2.5D IC packaging market based on By Packaging Technology, Application, End User, and Region

Recent Developments in 3D IC and 2.5D IC Packaging Industry

• In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain.
• In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
• In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.

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