Thin Wafer Market

The thin wafer market is projected to grow from USD 11.4 billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is expected to grow at a CAGR of 12.5% from 2022 to 2027.

Increasing adoption of MEMS technology in portable health monitoring devices, reducing sizes of electronic devices, growing smartphone and consumer electronics markets and high amount of material saving is expected to fuel the growth of the thin wafer market.

Major Thin Wafer Suppliers Include: 

• Shin-Etsu Chemical Co., Ltd. (Japan)
• SUMCO Corporation (Japan)
• GlobalWafers Co., Ltd. (Taiwan)
• Siltronic (Germany)
• SK Siltron (South Korea)
• SUSS MicroTec (Germany)
• Soitec (France)
• DISCO Corporation (Japan)
• 3M (US)
• Applied Materials (US)

To know about the assumptions considered for the study download the pdf brochure

Key strategies adopted by the players in the thin wafer ecosystem to enhance their product portfolios, increase their market share and expand their presence in the market mainly include new product launches and partnerships and acquisitions.

In May 2022, Soitec (France) has released its first 200mm silicon carbide SmartSiC™ wafer. With the release, Soitec is able to enlarge its SiC product portfolio beyond 150mm, take the development of its SmartSiC™ wafers to the next level and cater to the growing demand of the automotive market.

In October 2021, Siltronic (Germany), unveiled a new manufacturing facility at JTC’s Tampines Wafer Fab Park in Singapore in partnership with the Singapore Economic Development Board (EDB). Siltronic’s investment of around EUR 2 billion (equivalent to nearly SGD 3 billion) until the end of 2024 will play a crucial role in meeting the growing semiconductor demand.

Shin-Etsu Chemical Co., Ltd. relies on its product portfolio enhancement and R&D investment for its business growth. R&D investment helps the company to leverage strong technical and domain expertise across its organization. The company is accelerating investments in R&D and focusing on the commercialization of innovative new products to strengthen its business foundation and achieve growth. This will help the company to attract new customers and increase its total addressable market. Shin-Etsu Chemical Co., Ltd.  focuses on organic growth strategies to expand its presence across the world. The company focuses on expansions into new potential markets. For example, in June 2022, Shin-Etsu Chemical Co., Ltd. invested over YEN 80 billion in facility investments for its silicones business, one of its main businesses, with the aim of further expanding and strengthening this business. The company has robust R&D capabilities with the total investment of ~USD 0.5 billion in 2021.

SUMCO Corporation is among the top players in the thin wafer market. The company’s quality products have continuously been recognized by various organizations affirming its position of leading player in the industry, which has helped the company create a strong brand image in the market. The company’s current wide range of products caters to a large number of semiconductor manufacturers. SUMCO Corporation is currently focused on increasing its product portfolio.

The silicon wafers provided by the company are used in various semiconductor applications, including MEMS, LED, RF devices, memory, and CMOS image sensor. The company is strengthening its manufacturing capabilities in order to build a structure that can enhance profitability and meet the future increase in demand for its offerings. For example, in October 2021, SUMCO Corporation spent 228.7 billion yen (USD 2.05 billion) in October 2021 to step up production of state-of-the-art 300 mm silicon wafers for semiconductors. In addition to enhancing production capacity, the company is accelerating improvements in production efficiency by promoting advances in underlying technologies and transforming production methods. In order to strengthen its market position, the company can stabilize the supply of key raw materials to ensure superior product quality and on-time delivery. SUMCO Corporation continues to focus on technological developments and invest in the latest trends including AI and IoT technologies to be able to provide leading-edge, high-precision silicon wafers.

Related Reports:

Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

Contact:
Mr. Aashish Mehra
MarketsandMarkets™ INC.
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