Semiconductor Manufacturing Equipment Companies

Semiconductor Manufacturing Equipment Companies - Applied Materials, Inc. (US) and ASML (Netherlands) are the Key Players

The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3% during the forecast period.

Expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increasing demand for advanced and efficient chips are some of the major factors driving the market growth. Moreover, expansion of advanced packaging technologies and government support for domestic semiconductor industry to provide ample opportunities to drive the market growth.

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Major Semiconductor Manufacturing Equipment companies include:

  • Applied Materials, Inc. (US)
  • ASML (Netherlands)
  • Tokyo Electron Limited (Japan)
  • Lam Research Corporation (US)
  • KLA Corporation (US)
  • SCREEN Holdings Co., Ltd. (Japan)
  • Teradyne, Inc. (US)
  • Advantest Corporation (Japan)
  • Hitachi High-Tech Corporation (Japan)
  • Plasma-Therm (US)

Some of the major players in the semiconductor manufacturing equipment market with significant global presence are Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US). These players have incorporated various organic and inorganic growth strategies including collaborations, acquisitions, product launches and developments, partnerships, agreements, and expansions to strengthen their international footprint and penetrate a greater share in the semiconductor manufacturing equipment market. These organic and inorganic strategies have allowed the market players to expand themselves across geographies by offering semiconductor manufacturing equipment, technologies, and services.

Applied Materials, Inc. has a broad strategy focused on both organic growth, through product launches, and inorganic growth strategies in the form of collaborations, acquisitions, and agreements that expand the leading position of Applied Materials, Inc. in the semiconductor manufacturing equipment market. For instance, Applied Materials, Inc. announced the Vistara platform engineered to provide chipmakers enhanced flexibility, intelligence, and sustainability to overcome the ever-changing challenges in chipmaking. The lowest fab energy use, chemical usage, and cleanroom footprint help customers succeed with their sustainability goals. Another inorganic growth strategy that Applied Materials, Inc. emphasizes is collaboration, acquisition, and joint ventures. To this effect, in June 2022, Applied Materials, Inc. acquired Picosun Oy (Finland), an ALD technology provider for specialty semiconductors. This would expand the company's portfolio of manufacturing solutions for specialized semiconductors. This will provide a major support for innovating many smart technologies within various industrial sectors.

ASML emphasizes on organic growth strategies comprising product innovations, among other strategies such as expansions, and inorganic growth strategies comprising collaborations and acquisitions to have a strategic competitive edge in the semiconductor manufacturing equipment market. For instance, in April 2022, ASML launched a multibeam wafer inspection system, the HMI eScan 1100 for in-line yield improvement. ASML is also firmly focused on pursuing inorganic growth by means of strategic collaborations and acquisitions. In January 2022, the company collaborated with Intel Corporation (US) to advance semiconductor lithography technology by supplying the TWINSCAN EXE:5200, a high-NA EUV production system capable of processing over 200 wafers per hour, as part of their ongoing partnership.

Tokyo Electron Limited is concentrated on the expansion of its leadership position in the market of semiconductor manufacturing equipment. For instance, the company introduced Acrevia, a gas cluster beam (GCB) system, in July 2024. This system enhances further ultra-fine pattern dimensions and formation by post-EUV lithography patterning. Acrevia lowers stochastic litho flaws and line edge roughness, increasing yield and decreasing EUV patterning expenses. Tokyo Electron Limited also aims at inorganic growth through partnerships. In July 2023, Tokyo Electron Limited entered a partnership with Athinia Technologies LLC (US), a data analytics platform provider that enables semiconductor fabs and equipment makers to share and analyze data in real-time.

Lam Research Corporation focuses on organic growth strategies in expanding its product offerings, the company also adapts the inorganic growth strategy through collaborations, acquisitions, and partnerships to strengthen its position in the semiconductor manufacturing equipment market. For instance, Lam Research Corporation launched a series of selective etch products that employ innovative wafer fabrication methods and novel chemical processes to aid chip manufacturers in creating gate-all-around (GAA) transistor structures. The selective etch portfolio comprises three new products, namely Argos, Prevos, and Selis. Besides this, in November 2022, Lam Research Corporation acquired SEMSYSCO GmbH (Austria), a semiconductor equipment provider for wet processing.

KLA Corporation follows both organic growth strategies like product launches and expansions to retain market leading position in the semiconductor manufacturing equipment market. For example, KLA Corporation provides a comprehensive range of semiconductor manufacturing equipment, including inspection, packaging, and metrology technologies. Further, in September 2022, KLA Corporation opened a new research and development (R&D) center and a manufacturing center in Newport, Wales, UK, for its SPTS division. The new facility, which is designed to meet the BREEAM sustainability rating of excellence, will span 200,000 square feet and involve a capital investment exceeding USD 100 million.

Related Reports:

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

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Semiconductor Manufacturing Equipment Market Size,  Share & Growth Report
Report Code
SE 5344
RI Published ON
10/10/2024
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