Semiconductor & IC Packaging Materials Market

The semiconductor & IC packaging materials market is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1% from USD 43.9 billion in 2024. The market growth is driven by increasing demand from consumer electronics industry, growing miniaturization and densification in the electronic sector and adoption of emerging technologies like  5G and autonomous vehicles.

Semiconductor & IC Packaging Materials Companies

The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan)  etc. These companies are strong in their home regions and explore geographic diversification alternatives to grow their businesses. They focus on increasing their market shares through new product launches and other expansions.

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LG Chem Ltd.

LG Chem Ltd., headquartered at Seoul, South Korea, is a multinational conglomerate that has been at the forefront of the chemical industry since its founding in 1947. Over the years, LG Chem has diversified its operations across various segments, notably in the manufacturing of petrochemicals and IT & electronic materials, highlighting its pivotal role in the global chemicals and materials market. LG Chem's global presence is underscored by its manufacturing facilities located in various regions around the world. Among these, LG Chem America, Inc. in Atlanta, GA, USA, is an example of its expansive network, indicating a strategic distribution of production capabilities to serve different markets effectively. This global footprint not only demonstrates LG Chem's commitment to innovation and sustainability but also its role as a key player in the chemicals and materials industry worldwide.

Jiangsu ChangJian Technology Co., Ltd.

Jiangsu ChangJian Technology Co., Ltd. established in 1972 in Jiangyin, China, has become a cornerstone in the global semiconductor landscape, renowned for its integrated circuit manufacturing prowess and technological services. With a strategic footprint that spans six manufacturing sites across China, Korea, and Singapore, alongside two cutting-edge R&D centers in China and Korea, JCET has positioned itself as a vital player in the semiconductor sector. Catering to a diverse array of sectors including mobile, communication, compute, consumer electronics, automotive, and industrial applications, Jiangsu ChangJian Technology Co., Ltd. offers a wide range of services. These encompass wafer-level packaging, system-in-packaging, flip chip technology, and wire bonding, each tailored to meet the intricate demands of its global clientele. The company's robust service portfolio underscores its capacity to deliver high-performance, compact, and efficient semiconductor solutions crucial for powering today's digital devices and systems. With approximately 20,135 full-time employees, JCET leverages a vast pool of workforce.

Henkel AG & Co. KGaA

Henkel AG & Co. KGaA, headquartered in Düsseldorf, Germany, is a preeminent global entity operating within the consumer and industrial sectors. With a robust and diversified portfolio, Henkel holds commanding positions across its two primary divisions: Adhesive Technologies and Consumer Brands. The Adhesive Technologies division of Henkel stands as a market leader in adhesives, sealants, and functional coatings, catering to a wide array of industries and applications. Meanwhile, the Consumer Brands division concentrates on two main categories: Laundry & Home Care, and Hair Care, with a portfolio that includes internationally recognized brands such as Schwarzkopf® for hair care, Dial® soaps, and a range of laundry products including Persil®, Purex®, all®, Snuggle® fabric softeners. Additionally, Henkel's adhesive product line features prominent brands like Loctite®, Technomelt®, and Bonderite®.

Henkel's global workforce consists of approximately 50,000 employees. Henkel's operations span multiple geographic regions, including Europe, IMEA (India, Middle East, Africa), North America, Latin America, and Asia-Pacific, reflecting the company's truly global reach. Listed on the German stock index DAX, Henkel's preferred shares signify its stature within the financial markets. The company is also celebrated for its commitment to sustainability, achieving high rankings in numerous international ratings, thereby solidifying its position as an industry leader dedicated to environmental stewardship and corporate responsibility.

Kyocera Corporation

Kyocera Corporation, established in 1959, is a Japanese firm headquartered in Kyoto, Japan. Operating across multiple sectors such as ceramic components, semiconductor parts, mobile phones, electronic devices, telecommunications, and information equipment, Kyocera boasts a diverse product portfolio catering to environmental protection, energy generation, telecommunications, and information processing needs. Serving individuals, corporations, governments, and agencies worldwide, the company maintains research and development facilities in Japan and the US, while its manufacturing facilities span across Japan, Poland, France, India, China, Thailand, Malaysia, Vietnam, and the US. With a strong business presence in the Americas, Asia-Pacific, Europe, the Middle East, and Africa, Kyocera's operations encompass a wide range of units including core components, industrial & automotive components, semiconductor components, electronic components, solutions, industrial tools, document solutions, communications, and more.

ASE

ASE formerly known as ASE Technology Holding Co., Ltd., headquartered in Kaohsiung, Taiwan, was established in 1984 and operates within the Electronic Components & Boards sector. The company's primary manufacturing facility is located in Kaohsiung, Taiwan, with additional plants situated in China, South Korea, Japan, Malaysia, and Singapore. ASE Technology Holding Co., Ltd. maintains a global presence through offices and service centers in China, South Korea, Japan, Singapore, Belgium, and the United States. Furthermore, the company has a joint venture with TDK named ASE Embedded Electronics Inc. in Kaohsiung, Taiwan. Specializing in semiconductor assembling and test manufacturing services, ASE Group caters to over 90% of electronics companies worldwide. Their offerings encompass a wide range of services including fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip technology, 2.5D and 3D packaging, system-in-package (SiP), and copper wire bonding.

Related Reports:

Semiconductor & IC packaging materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029

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