Semiconductor Bonding Market

The semiconductor bonding market is estimated to be valued at USD 887 million in 2021 and is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026.  Factors such as growing demand for miniature electronic components and increasing adoption of stacked die technology in IoT devices are driving the growth of the market during the forecast period.

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Semiconductor Bonding companies include: 

• Besi (Netherland),
• ASM Pacific Technology (Singapore),
• Fuji Corporation (Japan),
• Intel Corporation (US),
• Google. Inc (US),
• NVIDIA Corporation (US),
• Xilinx Inc. (US),
• IBM Corporation (US),
• Advanced Micro Devices, Inc (US),
• Marvell Technology (Hamilton),
• Marvell Technology (Hamilton),
• Qualcomm Technology (US).

Besi has operations across Europe and APAC. The company has a prominent presence in the electronic supply chain and semiconductor equipment manufacturing market, with Sony (Japan), Toshiba (Japan), Bosch (Germany), etc. as its customers. Its strong customer base spans industries such as aerospace, automotive, consumer electronics, and industrial electronics. Moreover, Besi has online customer service portals, sales offices, agents, and distributors. The company’s strong manufacturing and distribution capabilities add to its strength and help it generate increased revenue.

ASM Pacific Technology has robust and diversified product offerings and technologies related to the semiconductor bonding market. As mass reflow flip-chip methods migrate to thermocompression bonding (TCB), there is a significant increase in the adoption of thermocompression bonders (TCB) in flip-chip assembly. The company focuses on developing innovative products and solutions, and the company’s strong TCB is one of its key strengths in the market. In February 2021, the company delivered its 250th TCB, which is a milestone for the company. The research and development team of the company focuses on developing semiconductor bonding equipment for use in different industries. It has adopted strategies such as partnerships and acquisitions for profitable and sustainable growth. ASM Pacific Technology aims to provide its customers with value-added products and focuses on emerging technologies related to the semiconductor bonding market.

Fuji Corporation has a strong Machine Tools business segment that helps dominate the semiconductor manufacturing market, and its Robotics Solution division helps innovate and expand in the increasing robotics and smart devices market. The company also has years of manufacturing experience in the semiconductor manufacturing market. It has manufacturing and operation units across the world that help it identify the requirements of its customers in different regions and cater to them faster, in a more flexible manner than its competitors. Fuji Corporation also focuses increasingly on research and development activities and has a dynamic intellectual property strategy that strengthens its business globally. The company registered more than 800 patents in 2020, which shows its strong research support and acts as a key strength in the market.

Related Reports:

Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Forecast to 2026

Contact:
Mr. Aashish Mehra
MarketsandMarkets™ INC.
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USA : 1-888-600-6441
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