System in Package Market

The system in package (SiP) process includes several IC packaging technologies, such as 2D IC, 2.5D IC, and 3D IC. The system in package market is expected to be valued at USD 9.07 Billion by 2023, growing at a CAGR of 9.4% between 2017 and 2023. The growth of this market is propelled by the growing demand for miniaturization of electronic devices, impact of Internet of Things (IoT), and reduced time-to-market.

ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore) are the leading players in the system in package market. Product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships are some of the key strategies adopted by the major players to gain a competitive edge in this market.

ASE Group offers a complete packaging and testing services for the semiconductor IC packaging market. The company’s service portfolio includes substrate design services, characterization services, and e-Services. These services help end users to improve the IC packaging development process as well as allow circuit designers to achieve maximum flexibility in the designing process. ASE Group offers a real-time web-based status to its customers. The real-time web-based packaging service is referred to as e-Service. To grow in the system in package market, the company has adopted organic and inorganic growth strategies. For instance, in March 2016, the company successfully developed system in package solutions for consumer and automotive applications. It has dedicated its R&D efforts toward advanced IC packaging technologies such as 3D TSV and wafer-level integration passive device technology to leverage the opportunities in next-generation of heterogeneous integration modules and miniaturized electronic systems.

Amkor Technology offers a wide range of packaging and test services through Advanced Products and Mainstream Products segments. The Advanced Products segment includes flip chip and wafer-level processing-related test services, whereas mainstream products contain wire bond packaging and related test services. In addition, the company offers chip scale packaging (CSP) and ball grid array (BGA) solutions for high pin count and various high-density applications, such as stacked die packaging, wafer-level packaging, packaging module, flip chip packaging, and 3D packaging. The company focuses on inorganic growth strategies to strengthen its market position. For instance, in May 2017, Amkor Technology acquired NANIUM (Portugal), a leading provider of fan-out wafer-level (FOWL) semiconductor packaging solutions. Through this acquisition, Amkor Technology strengthens its business position.

Other major companies operating in the system in package market are Intel (US), Samsung Electronics (South Korea), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Texas Instruments (US), Signetics (South Korea), Unisem (Malaysia), and Carsem (Malaysia).

Related Reports:

System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

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