3D IC and 2.5D IC Packaging Companies

The 3D IC and 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2023 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. The increasing need for advanced architecture in electronic products is a major factor driving the growth of 3D IC and 2.5D IC packaging market globally. Moreover, growing adoption of high-end computing, servers, and data centers is also key factor contributing to the market growth.

3D IC and 2.5D IC Packaging companies include:

• Samsung (South Korea),
• Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan),
• Intel Corporation (US),
• ASE Technology Holding Co., Ltd. (Taiwan),
• Amkor Technology (US),
• Broadcom (US),
• Texas Instruments Inc. (US),
• United Microelectronics Corporation (Taiwan),
• JCET Group Co., Ltd. (China) and
• Powertech Technology Inc. (Taiwan).

The market players have adopted various strategies such as development of advanced products, partnerships, collaborations, agreements, joint ventures, and acquisitions to strengthen their position in the 3D IC and 2.5D IC packaging market. The organic and inorganic strategies have helped the market players to expand themselves globally by providing advanced solutions for 3D IC and 2.5D IC packaging.

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Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan)

Taiwan Semiconductor Manufacturing Company (TSMC) is one of the world's leading semiconductor foundries, and it offers a variety of advanced packaging technologies to meet the needs of its customers. Among these technologies are 3D IC and 2.5D IC packaging. TSMC's 3D IC packaging solutions are designed to optimize power consumption, performance, and form factor, making them well-suited for high-performance computing applications.

Samsung (South Korea)

Samsung is one of the leading semiconductor manufacturers and offers a range of advanced packaging technologies, including 3D IC and 2.5D IC packaging. Samsung's 3D IC packaging solutions are designed to improve the performance, power efficiency, and density of semiconductor devices. Samsung's 3D IC packaging solutions are used in a variety of applications, including consumer electronics, servers, and data centers. Samsung's 3D IC packaging technology uses through-silicon vias (TSVs), which are vertical interconnects that pass through the silicon substrate of each chip layer, allowing for communication between the layers.

Intel Corporation (US)

Intel Corporation is a technology company specializing in the development and manufacture of computer hardware and software. In recent years, Intel has been actively exploring the use of 2.5D and 3D IC technologies to improve the performance and energy efficiency of its products. Intel has also been developing 3D IC technologies for use in future products. For instance, in 2020, Intel announced its "EMIB" (Embedded Multi-die Interconnect Bridge) technology, which allows for high-speed interconnects between different components on a chip using TSVs. This technology enables the creation of highly integrated systems, such as AI accelerators, with improved performance and power efficiency.

ASE (Advanced Semiconductor Engineering) is one of the leading providers of semiconductor manufacturing and packaging services, offering its customers both 3D IC and 2.5D IC packaging solutions. ASE's CoWoS technology is designed to provide higher bandwidth and improved thermal performance, as well as reduced power consumption. In addition, ASE has been working on new processes and materials to improve the performance and reliability of its 3D IC packaging solutions.

Amkor Technology (US)

Amkor Technology is a leading provider of advanced semiconductor packaging and test services, and it offers a range of 3D IC and 2.5D IC packaging solutions. In addition to TSV technology, Amkor offers a range of other packaging solutions, such as wafer-level chip-scale packaging (WLCSP) and flip chip packaging. WLCSP offers a compact form factor and low cost, while flip chip packaging provides improved thermal performance and higher interconnect density.

Related Reports:

3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

See Also:

System in Package Companies

Contact:
Mr. Aashish Mehra
MarketsandMarkets™ INC.
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USA : 1-888-600-6441
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