Flip Chip Technology Market

According to the new market research report "Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022", the flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.

Browse 66 market data tables and 71 figures spread through 157 pages and in-depth TOC on “Flip Chip Technology Market - Global Forecast to 2022"
https://www.marketsandmarkets.com/Market-Reports/flip-chip-technology-market-264572064.html
Early buyers will receive 10% customization on reports.

3D IC packaging technology to register the highest growth rate

On the basis of packaging technology, the flip chip technology market is segmented into 2D IC, 2.5D IC, and 3D IC packaging technology. With the semiconductor technology moving towards integration of diverse chips, 2.5D IC packaging technology and 3D IC packaging technology are becoming the mainstream trend in obtaining the integration objectives. Owing to the growing demand for increasing density, higher bandwidth, and lower power, design teams are expected to adopt 3D ICs with TSVs, which promise ‘more than Moore’ integration by packaging a great deal of functionality into small form factors, while improving performance and reducing costs.

Applications in consumer electronics held the largest market size and would also grow at the highest rate

Smartphones & tablets are observed to have the highest adoption among all the consumer electronic devices, owing to their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. The automotive market is expected to grow at a second-highest CAGR rate, catapulting the flip chip technology market further.

The market in Asia-Pacific to grow at the highest rate

The APAC held a large share of the overall flip chip technology market in 2015; moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Countries in Asia-Pacific are major manufacturing hubs and are expected to provide ample opportunities for the growth of the flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.

Major players in this market are Intel (U.S.), TSMC (Taiwan), Samsung (South Korea), and GlobalFoundries (U.S.), ASE group (Taiwan), Amkor Technology (U.S.), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland) among others.

On the basis of wafer bumping process, the flip chip technology market is segmented into copper pillar, lead free, tin/lead eutectic solder, and gold stud+ plated solder. The product segment consists of CPU, SoC, GPU, memory, LED, CMOS image sensor, and RF, mixed signal, analog, and power IC. On the basis of application, the market is segmented into consumer electronics, telecommunications, automotive, industrial sector, medical devices, smart technologies, and military and aerospace. The packaging type segment includes FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, and FC CSP. The packaging technology in flip chip has been segmented into 2D IC, 2.5D IC, and 3D IC. This global report gives a detailed view of the market across the four regions, namely, Americas, Europe, Asia-Pacific, and the Rest of the World which includes the Middle East and Africa. The report profiles the 10 most promising players in the flip chip technology market.

About MarketsandMarkets

MarketsandMarkets is the world’s No. 2 firm in terms of annually published premium market research reports. Serving 1700 global fortune enterprises with more than 1200 premium studies in a year, M&M is catering to a multitude of clients across 8 different industrial verticals. We specialize in consulting assignments and business research across high growth markets, cutting edge technologies and newer applications. Our 850 fulltime analyst and SMEs at MarketsandMarkets are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors.

M&M’s flagship competitive intelligence and market research platform, "RT" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets. The new included chapters on Methodology and Benchmarking presented with high quality analytical infographics in our reports gives complete visibility of how the numbers have been arrived and defend the accuracy of the numbers.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository.

Contact:
Mr. Rohan
Markets and Markets
UNIT no 802, Tower no. 7, SEZ
Magarpatta city, Hadapsar
Pune, Maharashtra 411013, India
1-888-600-6441
Email: [email protected]