SiC Wafer Polishing Market

Updated on : March 19, 2024

SiC Wafer Polishing Market

The global SiC wafer polishing market was valued at USD 0.4 billion in 2023 and is projected to reach USD 2.2 billion by 2028, growing at 37.5% cagr from 2023 to 2028. Power electronics is one of the major applications of the  Sic wafer polishing market and offers market growth opportunities. The polishing product sic wafer polishing centrifuge by product type segment is experiencing high growth rates in emerging regions such as Asia Pacific.

Attractive Opportunities in the  SiC Wafer Polishing Market

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SiC Wafer Polishing Market Dynamics

Driver: Development of advanced polishing consumable

The advancement of advanced polishing consumables has a significant impact on the growth of the SiC wafer polishing market. Polishing consumables are items used in the wafer polishing process, including abrasive slurries, pads, and chemicals. The developments in these consumables have given various benefits to the SiC wafer polishing market, driving its growth and efficiency. One of the primary advantages of modern polishing consumables is their capacity to produce better levels of precision and uniformity in the wafer polishing process. As SiC wafers become thinner and more complicated in design, the demand for precise and consistent polishing grows. Advanced consumables are meant to enable greater control over material removal rates, surface roughness, and planarization, resulting in higher overall wafer quality. This is extremely critical for SiC wafers, as their unique properties require meticulous polishing to maintain their desired characteristics. Furthermore, modern polishing consumables improve productivity and cost-effectiveness in the SiC wafer polishing process. They are designed to improve polishing efficiency, reduce polishing time, and reduce material waste.

Restraint: Long cycle polishing times

The long polishing cycle time in the SiC wafer polishing industry might have a substantial impact on market growth and even hinder it. SiC wafers are widely utilized in a variety of industries, including power electronics, automotive, telecommunications, and aerospace, due to their exceptional qualities, such as high-temperature resistance, high power density, and low power loss. However, the polishing process used in the manufacture of SiC wafers is a critical and time-consuming phase. The increased polishing cycle time has a direct impact on the production capacity and throughput of SiC wafers. Because the polishing process takes longer, it affects overall manufacturing efficiency and slows the rate at which finished wafers may be produced. This can result in supply shortages and delays in meeting client requests, especially in industries with high demand. The SiC wafer polishing market is experiencing slow growth due to a variety of factors, including extended polishing cycle times. For starters, manufacturers' ability to scale up their operations and meet the increasing demand for SiC wafers is hampered by restricted production capacity.

Opportunities: Advancement in polishing technology

Polishing technology advancements create a substantial opportunity for the SiC wafer polishing market. As the demand for SiC wafers grows, more efficient, precise, and cost-effective polishing processes are required. The advancement of modern polishing technology allows for better process control, higher surface quality, and higher productivity. The opportunity resides in the SiC wafer polishing market's capacity to embrace these improvements and provide cutting-edge solutions. The market can meet the changing needs of SiC wafer manufacturers and end-users by adopting and refining novel polishing techniques. Surface flaws, homogeneity, and dimensional control can all be addressed by advanced polishing processes, assuring the manufacturing of high-quality polished SiC wafers. Polishing technology improvements include improved chemical mechanical planarization (CMP) techniques, innovative slurries, and optimized polishing pads. These methods contribute to higher material removal rates, lower surface roughness, and improved planarity. Polishing service providers and equipment manufacturers may address the demand for high-performance SiC wafers across multiple industries by incorporating these developments into their offerings.

Challenges: Intense competition and market consolidation

The SiC wafer polishing market faces major challenges due to intense rivalry and market consolidation. As demand for SiC wafers grows, the industry becomes more competitive, with multiple firms fighting for market share. This rivalry increases pricing pressures and diminishes profit margins, affecting the profitability and sustainability of SiC wafer polishing firms. Consolidation in the market adds to the difficulties. Mergers, acquisitions, and strategic alliances can result in a highly concentrated market dominated by a few companies. This consolidation has the potential to create entry hurdles for new players, reducing market diversity and innovation. Smaller enterprises may struggle to get market access and compete against well-established companies with existing client relationships and economies of scale. Intense rivalry and market consolidation pose various challenges to the expansion of the SiC wafer polishing market. To begin with, smaller players may find it difficult to compete successfully in terms of pricing and resources, limiting their potential to gain market share. This can hinder innovation and limit the market's diversity of products and services.

SIC WAFER POLISHING MARKET ECOSYSTEM

Manufacturers of sic wafer polishing who are well-known in the industry and have a secure financial situation. These businesses have a long history in the industry, a wide range of products, and effective international sales and marketing networks. Prominent companies in this market include Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US).

The polishing pad segment, by product type, is expected to be the largest market during the forecast period.

Based on the product type, With the polishing pad type of the market,  Sic wafer polishing centrifuge manufacturers can target a larger customer base across different industries. Due to their material-specific design, precision and uniformity capabilities, efficient material removal characteristics, compatibility with chemical slurry, continuous innovation, and increasing demand driven by the expanding applications of SiC wafers, polishing pads dominate the SiC wafer polishing market. These features combine to make polishing pads the preferred method for achieving the required surface smoothness and flatness for high-performance SiC semiconductor devices.

Based on process, the chemical mechanical polishing segment accounts for the largest share of the overall market.

Based on application, The chemical polishing segment accounts for the largest share of the globally; because of its effectiveness in eliminating faults and contaminants from SiC wafers, CMP is a popular method for producing reliable and high-quality devices. As a result of these benefits, CMP has the fastest-growing market share in the SiC wafer polishing market and has emerged as the go-to technology for semiconductor manufacturers seeking optimal wafer surface quality and productivity.

Asia Pacific is expected to account for the largest share of the global market during the forecast period.

Based on the region the Asia Pacific region is home to a large consumer electronics market, with a growing population and rising disposable incomes driving the demand for smartphones, tablets, and other electronic devices. SiC-based power devices are increasingly being incorporated into these consumer electronics for enhanced efficiency and longer battery life, further propelling the need for polished SiC wafers.

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Key Market Players

The SiC wafer polishing market is dominated by a few major players that have a wide regional presence. The key players in the  Sic wafer polishing market include Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US). In the last few years, the companies have adopted growth strategies such as acquisitions, new product launches, partnerships, contracts, and agreements to capture a larger share of the Sic wafer polishing market.

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Scope of the Report

This report categorizes the global Sic wafer polishing market based on product type, process, application, and region.

Based on By Process Type, the Sic wafer polishing market has been segmented as follows:

• Mechanical polishing
• Chemical-mechanical polishing (CMP)
• Electropolishing
• Chemical polishing
• Plasma-assisted polishing
• Others

Based on By Product type, the Sic wafer polishing market has been segmented as follows:

• Abrasive powders
• Polishing pads
• Diamond slurries
• Colloidal silica suspensions
• Others

Based on Application, the Sic wafer polishing market has been segmented as follows:

• Power Electronics
• Light-emitting diodes (LEDs)
• Sensors and detectors
• Rf and microwave devices
• Others

Based on the Region, the Sic wafer polishing market has been segmented as follows:

• North America
• Asia Pacific
• Europe
• Middle East & Africa
• South America

Recent Developments

• December 2019 Entegris Completes Acquisition of CABOT MICROELECTRONICS; the acquisition is helping Cabot Microelectronics become more critical to its semiconductor industry customers and touch more parts of its production processes.
• In November  2021, SKC will borrow 1.5 trillion won from Korea Development Bank (KDB) to expand its secondary battery and eco-friendly materials business.
• July 2021 Fujifilm Announces $350 Million Investment in its U.S. Electronic Materials Business; the planned U.S. investment will support the development and manufacture of Fujifilm’s broad range of semiconductor materials and chemicals, particularly Chemical Mechanical Polishing (CMP) slurry and Photolithography-related high purity materials.
• In July 2023, SKC decided to acquire ISC, a semiconductor test solution provider.

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