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Automotive Hardware-in-Loop Market

Automotive Hardware-in-Loop Market - Global Forecast to 2032

Report Code: UC-AT-6904 Jun, 2025, by marketsandmarkets.com

The automotive hardware in-loop market is projected to grow from USD 664.5 million in 2025 to USD 1,348.7 million by 2032 at a CAGR of 10.6%. The use of HIL testing is growing in automotive because it is an early-stage testing that ensures robust safety and performance in response to the increasing complexity of vehicle electronics. By minimizing the requirement for physical prototypes, HIL technology improves product reliability while reducing development time and expenses. Growth in the electric & hybrid vehicles, rising integration of various e-powertrain components, advancement in the high voltage battery chemistries, and development in autonomous driving technologies will increase vehicle complexity and boost the automotive hardware in-loop market by 2032. However, the challenge associated with implementing HIL is the complexity of creating precise hardware-in-loop simulation models, which require accurate real-time simulations with high computational power and result in an increased cost of specialized HIL equipment and software.

ICE segment holds the largest market in the global automotive hardware-in-loop segment market.

The ICE vehicles comprising light & heavy-duty vehicles account for the largest share in the global automotive hardware-in-loop market by propulsion. It is mainly due to its maximum share (~85-88%) collectively in production & sales of all vehicles available in various propulsion categories. Despite the rapid acceptance rate for EVs, the ICE vehicles will likely demonstrate a leading position by 2032. The rising adoption of telematics & connected services is changing dynamically globally. Furthermore, various advanced driver assistance systems (ADAS), such as automatic cruise control (ACC), emergency braking, collision avoidance systems, and lane departure warning/assistance, are being adopted in these vehicles to improve safety and ride comfort. Hardware-in-the-loop testing can be utilized for ECUs, algorithms, and software used in autonomous technology. Camera, radar, LIDAR, Image Signal Processing units, GPS, and other sensors are also tested to validate the sensor data using hardware-in-the-loop test benches. Hence, automotive HIL systems are utilized to improve the ICE vehicle quality and speed up innovation through several advanced technologies.

The hardware in-loop market for autonomous vehicles is projected to grow at the fastest rate globally during the forecast period.

Self-driving vehicles depend on sophisticated technology, including sensors like LiDAR, radar, cameras, GPS, image processing units, and smart control algorithms. Hardware-in-the-loop (HIL) testing helps manufacturers ensure these components work seamlessly together in real-world conditions without needing a physical prototype. Further, testing autonomous vehicles on public roads requires strict regulations and safety measures. With hardware-in-the-loop (HIL) testing, manufacturers can recreate real-world driving conditions in a safe and controlled setting, helping them meet safety standards while sidestepping legal hurdles. China, the largest market for electric passenger and commercial vehicles, offers different complex powertrain structures, which require HIL testing and battery management testing using HIL. Further, several OEMs are also tied up with other software and HIL providers to understand the performance and results of their products through virtual simulation using HIL. For instance, Rohde & Schwarz partnered with IPG Automotive to revolutionize automotive radar Hardware-in-the-Loop (HIL) testing. This collaboration aims to cut costs by shifting autonomous driving (AD) testing from outdoor test tracks to controlled lab environments. Similarly, in the US, Hyundai has formed a JV with Aptiv to develop self-driving systems for the commercialization of automobile applications to be used in robotaxis. Moreover, ?Software-defined vehicles (SDVs) are transforming hardware-in-the-loop (HIL) testing by integrating virtualization and cloud-based continuous integration/continuous deployment (CI/CD) pipelines. This shift enables earlier validation through virtual prototypes (vHIL) and scalable automation. While HIL remains essential for final hardware validation, it now complements software-in-the-loop (SIL) and model-in-the-loop (MIL) workflows, adapting to manage complex, data-driven scenarios and real-time fault injection for safety-critical systems. This evolution enhances testing efficiency and coverage, addressing the rapid development cycles and diverse software architectures of SDVs.

Thus, the growing autonomy level in vehicles, increasing OEM tie-ups with different HIL & software providers, use of HIL in SDV vehicles, and more automobile manufacturers adopting the features in their vehicles will drive the demand for HIL in autonomous vehicles.

Asia Pacific is expected to be the largest automotive hardware-in-loop market during the forecast period.

Asia Pacific is the largest market for automotive HIL. The region's higher market share is mainly due to its sizeable automotive manufacturing base in countries like China, Japan, and India. Rising investment in automotive R&D, rapid technology adoption, and favorable government policies will boost the demand for automotive HIL. Further, the increasing production of electric and hybrid vehicles and rising acceptance of autonomous vehicles are also driving the demand for the HIL market in Asia Pacific.

Countries like China, Japan, and India drive this growth due to their strong automotive sectors and focus on innovation. Automotive OEMs from Asia Pacific are forming partnerships with HIL providers to build HIL systems in their facilities. For instance, in July 2024, Toyota Kirloskar Motor collaborated with the Indian Institute of Science to build the HIL laboratory. The laboratory will focus on electrified vehicle powertrain technologies, utilizing Hardware-in-Loop (HIL) simulation for comprehensive testing and development. Similarly, in January 2024, Volvo expanded its group technical center in Chennai, India, focusing on strategy and innovation. This lab is equipped with HIL and SIL testing equipment. Also, China continues to lead the way with its massive EV production, increasing the need for HIL testing to fine-tune key systems like battery management, electric powertrain, etc.

The automotive Hardware-in-loop market is dominated by major players, including Molex Inc. (US),  Softing Automotive Electronics GmbH (Germany), Magna International Inc. (Canada), Delphi Automotive PLC (UK), Continental AG (Germany), Robert Bosch GmbH (Germany), Altech Berlin GmbH (Germany), dSPACE GmbH (Germany), Opal-RT Technologies, Inc. (Canada), and National Instrument Corp (US). These companies have expanded and undergone new product launches, partnerships, mergers, and acquisitions to gain traction in the automotive hardware-in-loop market.

Key Benefits of Buying the Report:

  • The report will help market leaders/new entrants with information on the closest approximations of revenue numbers for the overall automotive piston market and its subsegments.
  • This report will help stakeholders understand the competitive landscape and gain more insights, enabling them to position their businesses better and plan suitable go-to-market strategies.
  • The report also helps stakeholders understand the market pulse and provides information on key market drivers, restraints, challenges, and opportunities.
  • The report also helps stakeholders understand the automotive hardware-in-loop market's current and future pricing trends.

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1. INTRODUCTION
       1.1 OBJECTIVES OF THE STUDY
       1.2 MARKET DEFINITION
            1.2.1 INCLUSIONS & EXCLUSIONS
       1.3 MARKET SCOPE
            1.3.1 YEARS CONSIDERED FOR THE STUDY
            1.3.2 REGIONAL SCOPE
       1.4 STAKEHOLDERS
2. RESEARCH METHODOLOGY
       2.1 RESEARCH DATA
            2.1.1 SECONDARY DATA
            2.1.2 PRIMARY DATA
       2.2 MARKET SIZE ESTIMATION
            2.2.1 BOTTOM-UP/TOP-DOWN APPROACH
       2.3 DATA TRIANGULATION
       2.4 FACTOR ANALYSIS
       2.5 RESEARCH ASSUMPTIONS/RESEARCH LIMITATIONS
3. EXECUTIVE SUMMARY
4. PREMIUM INSIGHTS
5. MARKET OVERVIEW
       5.1 INTRODUCTION
       5.2 MARKET DYNAMICS
            5.2.1 DRIVERS
            5.2.2 RESTRAINTS
            5.2.3 OPPORTUNITIES
            5.2.4 CHALLENGES
       5.3 TRENDS & DISRUPTIONS IMPACTING CUSTOMER BUSINESS
       5.4 PRICING ANALYSIS
            5.4.1 BY TESTING TYPE
            5.4.2 BY REGION
       5.5 HARDWARE-IN-LOOP MARKET ECOSYSTEM
       5.6 SUPPLY CHAIN ANALYSIS
       5.7 KEY STAKEHOLDERS & BUYING CRITERIA
            5.7.1 KEY STAKEHOLDERS IN THE BUYING PROCESS
            5.7.2 BUYING CRITERIA
6. HARDWARE-IN-LOOP MARKET, BY TYPE
       6.1 INTRODUCTION
       6.2 OPEN-LOOP HIL
       6.3 CLOSED-LOOP HIL
7. HARDWARE-IN-LOOP MARKET, BY COMPONENT
       7.1 INTRODUCTION
       7.2 HARDWARE
              7.2.1 POWER SUPPLY
              7.2.2 I/O MODULES
              7.2.3 CHASSIS
              7.2.4 SENSORS
       7.3 SOFTWARE
8. HARDWARE-IN-LOOP MARKET, BY END-USE INDUSTRY
       8.1 INTRODUCTION
       8.2 AUTOMOTIVE
       8.3 AEROSPACE
       8.4 POWER ELECTRONICS
       8.5 RESEARCH & EDUCATION
       8.6 OTHERS
9. HARDWARE-IN-LOOP MARKET, BY REGION
       9.1 INTRODUCTION
       9.2 NORTH AMERICA
              9.2.1 US
              9.2.2 CANADA
       9.3 EUROPE
              9.3.1 GERMANY
              9.3.2 UK
              9.3.3 FRANCE
              9.3.4 REST OF EUROPE
       9.4 ASIA PACIFIC
              9.4.1 CHINA
              9.4.2 JAPAN
              9.4.3 INDIA
              9.4.4 REST OF ASIA PACIFIC
       9.5 REST OF THE WORLD
              9.5.1 MIDDLE EAST
              9.5.2 AFRICA
              9.5.3 SOUTH AMERICA
10. COMPETITIVE LANDSCAPE
       10.1 OVERVIEW
       10.2 MARKET RANKING OF KEY PLAYERS
       10.3 COMPETITIVE SCENARIO
              10.3.1 PRODUCT LAUNCHES
              10.3.2 DEALS
              10.3.3 OTHERS
11. COMPANY PROFILES
       *Note: The list of companies to be profiled will be finalized during the study
12. APPENDIX

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