Interposer and Fan-out Wafer Level Packaging Market

Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029

Report Code: SE 5184 Jan, 2024, by marketsandmarkets.com

[203 Pages Report] The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029. The market is experiencing growth driven by the cost advantages offered by advanced packaging and growing demand for consumer electronics and gaming devices. However, challenges surrounding thermal issues in wafer-level packaging are impeding market advancement. Despite these hurdles, opportunities emerge from the integration of advanced electronics in automobiles.

Interposer and Fan-out Wafer Level Packaging Market

Interposer and Fan-out Wafer Level Packaging Market

Interposer and Fan-out Wafer Level Packaging Market Forecast to 2029

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Interposer and FOWLP Market Dynamics

Driver: Cost advantages offered by advanced packaging

FOWLP offers certain cost advantages compared to traditional packaging methods, contributing to overall economic efficiency in semiconductor manufacturing. One contributing factor is the utilization of wafer-level processes, allowing multiple chips to be processed simultaneously on a single wafer. This parallel processing capability improves throughput and reduces manufacturing costs per unit, as compared to sequential processing of individual chips. Additionally, FOWLP has the potential to enhance overall yield rates in semiconductor production. The technology facilitates a higher number of good die per wafer, minimizing the impact of defects and improving the overall yield, which is crucial for cost-effective mass production..

Restraint: Complex manufacturing process

The production of interposers and WLP involves intricate and advanced manufacturing techniques, which can lead to several challenges for companies in the semiconductor industry. The complexity arises from the need to create precise and intricate structures, often involving multiple layers of materials and intricate patterns of conductive traces and vias. This complexity can result in a higher likelihood of defects during manufacturing, requiring rigorous quality control measures to ensure the reliability of the final product..

Opportunity: Integration of advanced electronics in automobiles

The automotive sector is experiencing a significant increase in the integration of advanced electronics to enhance vehicle performance, safety, and connectivity. Modern vehicles are equipped with a variety of electronic components and systems, including advanced driver-assistance systems (ADAS), in-vehicle infotainment (IVI), engine control units, sensors, and communication modules. These electronic systems contribute to the development of smart and connected vehicles, paving the way for innovations such as autonomous driving and intelligent transportation systems.

Challenge: Complexities in the supply chain

The adoption of advanced packaging technologies introduces intricacies into the semiconductor supply chain, requiring effective coordination among multiple entities involved in the production process. Interposers and wafer-level packaging often involve the collaboration of various suppliers, each contributing different components or services to the final product. Coordinating the production schedules, quality control measures, and delivery timelines among these diverse suppliers can be a complex task. Any disruptions or delays at one stage of the supply chain can have a cascading effect on the entire manufacturing process, potentially leading to increased lead times and production costs..

Interposer and Fowlp Market Ecosystem

The interposer and FOWLP market is dominated by established and financially sound manufacturers with extensive experience in the industry. These companies have diversified product portfolios, cutting-edge technologies, and strong global sales and marketing networks. Leading players in the market include Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan).

Wireless Charging Market by Ecosystem

FOWLP to witness the highest CAGR during the forecast period.

The rise of Fan-Out Wafer Level Packaging (FOWLP) in advanced semiconductor packaging is driven by its capacity to boost device efficiency, minimize size, and facilitate heterogeneous integration, aligning with the growing need for streamlined and powerful electronic solutions. FOWLP's adaptability and cost-efficiency further underscore its significance in meeting dynamic market demands.

3D packaging type to hold the highest CAGR during the forecast period

The ascent of 3D packaging is propelled by its capability to enhance device efficiency, reduce footprint, and promote heterogeneous integration, addressing the escalating demand for compact and high-performance electronic solutions. This trajectory is further fueled by ongoing innovations, technological advancements, and the pursuit of more efficient and miniaturized semiconductor solutions.

MEMS/Sensors in Interposer and FOWLP market to hold the highest market share.

Advanced packaging techniques for MEMS (Micro-Electro-Mechanical Systems) and sensors are increasingly employed to enhance miniaturization, improve performance, and enable integration into compact devices such as wearables, IoT devices, and automotive applications. These packaging methods contribute to the reliability and functionality of MEMS and sensors, addressing the diverse and evolving requirements of modern electronic systems.

Based on the end-user industry, the automotive sector to witness highest CAGR during forecast period

In the automotive industry, advanced packaging plays a crucial role by enabling compact design, improving reliability, and accommodating the integration of complex electronic components such as microcontrollers, sensors, and power modules. These packaging technologies contribute to the development of advanced driver assistance systems (ADAS), electrification, and connectivity features, enhancing overall vehicle performance, safety, and efficiency.

Interposer and FOWLP market in Asia Pacific region to exhibit highest CAGR during the forecast period

Asia Pacific's interposer-based packaging growth is driven by its robust electronics ecosystem, technological expertise, and increasing demand for high-performance and compact semiconductor solutions in various industries.

Interposer and Fan-out Wafer Level Packaging Market
 by Region

Interposer and Fan-out Wafer Level Packaging Market by Region

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Key Market Players

The interposer and FOWLP companies is dominated by players such as Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), and others.

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Scope of the Report

Report Metric

Details

Market size available for years

2020-2029

Base year considered

2023

Forecast period

2024-2029

Forecast units

Value (USD Million/Billion)

Segments Covered

By Packaging Component & Design; Packaging Type; Device Type; By End-user Industry and Region.

Geographies covered

North America, Europe, Asia Pacific, and Rest of the world (RoW)

Companies covered

The major market players include Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US). (A total of 25 players are profiled)

Interposer and Fan-out Wafer Level Packaging Market Highlights

The study categorizes the Interposer and FOWLP market based on the following segments:

Segment

Subsegment

By Packaging Component & Design

  • Interposer
  • FOWLP

By Packaging Type

  • 2.5D
  • 3D

By Device Type

  • Logic ICs
  • Imaging & Optoelectronics
  • LEDs
  • MEMS/Sensors
  • Memory Devices
  • Other Device Types

By End-user Industry

  • Consumer Electronics
  • Communications
  • Manufacturing
  • Automotive
  • Medical Devices
  • Aerospace

By Region

  • North America
  • Europe
  • Asia Pacific
  • RoW

Recent Developments

  • In October 2023, Advanced Semiconductor Engineering, Inc. (ASE) introduced the Integrated Design Ecosystem (IDE), a collaborative design toolset designed to systematically enhance advanced package architecture throughout its VIPack platform.
  • In October 2022, Samsung (South Korea) collaborated with Cadence (US), an electronic system design company, to provide customers with optimal TSV placement in stacked die designs. With this collaboration, both companies look forward to accelerating 3D-IC design for better performance.
  • In October 2022, Synopsys (US) an electronic design automation company collaborated with TSMC (Taiwan) to achieve the multi-die system design technology with advanced packaging and silicon process technology for providing their customers with a comprehensive solution for semiconductor and system-level packaging.
  • In November 2021, Samsung launched Hybrid-Substrate Cube (H-Cube) technology, a 2.5D packaging solution that applies silicon interposer technology and hybrid-substrate structure specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

Frequently Asked Questions(FAQs):

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TABLE OF CONTENTS
 
1 INTRODUCTION (Page No. - 29)
    1.1 STUDY OBJECTIVES 
    1.2 MARKET DEFINITION 
    1.3 INCLUSIONS AND EXCLUSIONS 
    1.4 STUDY SCOPE 
           FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION
           1.4.1 REGIONAL SCOPE
           1.4.2 YEARS CONSIDERED
           1.4.3 CURRENCY CONSIDERED
           1.4.4 UNITS CONSIDERED
    1.5 LIMITATIONS 
    1.6 STAKEHOLDERS 
    1.7 SUMMARY OF CHANGES 
    1.8 IMPACT OF RECESSION 
 
2 RESEARCH METHODOLOGY (Page No. - 34)
    2.1 RESEARCH DATA 
           FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN
           2.1.1 SECONDARY AND PRIMARY RESEARCH
           2.1.2 SECONDARY DATA
                    2.1.2.1 List of major secondary sources
                    2.1.2.2 Key data from secondary sources
           2.1.3 PRIMARY DATA
                    2.1.3.1 Breakdown of primaries
                    2.1.3.2 Key data from primary sources
                    2.1.3.3 Key industry insights
                    2.1.3.4 List of primary interview participants
    2.2 MARKET SIZE ESTIMATION METHODOLOGY 
           FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY
           2.2.1 BOTTOM-UP APPROACH
                    2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
                               FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH
           2.2.2 TOP-DOWN APPROACH
                    2.2.2.1 Approach to arrive at market size using top-down analysis (supply side)
                               FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH
                               FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS
    2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 
           FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION
    2.4 RESEARCH ASSUMPTIONS 
           TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS
    2.5 RESEARCH LIMITATIONS 
           FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS
    2.6 RISK ASSESSMENT 
           TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT
    2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET 
           TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
 
3 EXECUTIVE SUMMARY (Page No. - 45)
    FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029
    FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024
    FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029
 
4 PREMIUM INSIGHTS (Page No. - 48)
    4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET 
           FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
    4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN 
           FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029
    4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY 
           FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY 
           FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023
    4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY 
           FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
 
5 MARKET OVERVIEW (Page No. - 51)
    5.1 INTRODUCTION 
    5.2 MARKET DYNAMICS 
           FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
           5.2.1 DRIVERS
                    5.2.1.1 Surging demand for miniaturized electronic devices
                    5.2.1.2 Growing reliance on AI and high-performance computing technologies
                    5.2.1.3 Rising popularity of esports and game streaming platforms
                               FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020–2025
                    5.2.1.4 Increasing focus on developing advanced chip packaging techniques
                               FIGURE 20 IMPACT ANALYSIS: DRIVERS
           5.2.2 RESTRAINTS
                    5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities
                    5.2.2.2 Requirement for advanced and high-cost manufacturing techniques
                               FIGURE 21 IMPACT ANALYSIS: RESTRAINTS
           5.2.3 OPPORTUNITIES
                    5.2.3.1 Growing demand for wearable IoT devices
                    5.2.3.2 Integration of advanced electronics into automobiles
                               FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES
           5.2.4 CHALLENGES
                    5.2.4.1 Thermal issues in interposer and wafer-level packaging
                    5.2.4.2 Managing complex semiconductor supply chain
                               FIGURE 23 IMPACT ANALYSIS: CHALLENGES
    5.3 SUPPLY CHAIN ANALYSIS 
           FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS
    5.4 ECOSYSTEM/MARKET MAP 
           FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM
           TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM
    5.5 PRICING ANALYSIS 
           5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS
                    FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)
           5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS
                    TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 (USD/THOUSAND UNITS)
                    FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023
           5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION
                    FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019–2023
    5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 
           FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES
    5.7 TECHNOLOGY ANALYSIS 
           5.7.1 3D STACKING
           5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
           5.7.3 MONOLITHIC 3D
           5.7.4 3D IC
    5.8 PORTER’S FIVE FORCES ANALYSIS 
           FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
           TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS
           5.8.1 INTENSITY OF COMPETITIVE RIVALRY
           5.8.2 BARGAINING POWER OF SUPPLIERS
           5.8.3 BARGAINING POWER OF BUYERS
           5.8.4 THREAT OF SUBSTITUTES
           5.8.5 THREAT OF NEW ENTRANTS
    5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 
           5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
                    FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES
                    TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%)
           5.9.2 BUYING CRITERIA
                    FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
                    TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
    5.10 CASE STUDY ANALYSIS 
           5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS
           5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS
           5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS
    5.11 TRADE ANALYSIS 
           5.11.1 IMPORT SCENARIO
                    FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
           5.11.2 EXPORT SCENARIO
                    FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION)
    5.12 PATENT ANALYSIS 
           FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013–2023
           TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET
    5.13 KEY CONFERENCES AND EVENTS, 2024–2025 
           TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024–2025
    5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS 
           5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS
                    TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL
           5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
           5.14.3 REGULATIONS
                    5.14.3.1 North America
                    5.14.3.2 Europe
                    5.14.3.3 Asia Pacific
                    5.14.3.4 RoW
           5.14.4 STANDARDS
 
6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN (Page No. - 80)
    6.1 INTRODUCTION 
           FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029
           TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD BILLION)
           TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD BILLION)
    6.2 INTERPOSERS 
           TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
           TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
           TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020–2023 (USD MILLION)
           TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024–2029 (USD MILLION)
           TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
           TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
           6.2.1 SILICON
                    6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth
           6.2.2 ORGANIC
                    6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth
           6.2.3 GLASS
                    6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth
           6.2.4 CERAMIC
                    6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers
           6.2.5 OTHER INTERPOSERS
    6.3 FOWLP 
           6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY
                    TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
                    TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
                    TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
           6.3.2 SINGLE-DIE
           6.3.3 MULTI-DIE
 
7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE (Page No. - 91)
    7.1 INTRODUCTION 
           FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
           FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029
           TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION)
           TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION)
    7.2 2.5D 
           7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET
                    TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    7.3 3D 
           7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH
                    TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
 
8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE (Page No. - 96)
    8.1 INTRODUCTION 
           FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
           TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD BILLION)
           TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD BILLION)
    8.2 LOGIC ICS 
           8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH
                    TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
    8.3 IMAGING & OPTOELECTRONICS 
           8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH
                    TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
    8.4 MEMORY DEVICES 
           8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET
                    TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
    8.5 MEMS/SENSORS 
           8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH
                    TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
    8.6 LEDS 
           8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET
                    TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
                    TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
    8.7 OTHER DEVICE TYPES 
           TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
           TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
 
9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY (Page No. - 106)
    9.1 INTRODUCTION 
           FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029
           TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD BILLION)
           TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD BILLION)
    9.2 CONSUMER ELECTRONICS 
           9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET
                    TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    9.3 MANUFACTURING 
           9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH
                    TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    9.4 COMMUNICATIONS 
           9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH
                    TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    9.5 AUTOMOTIVE 
           9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH
                    TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    9.6 HEALTHCARE 
           9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH
                    TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
    9.7 AEROSPACE 
           9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH
                    TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION)
                    TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION)
                    TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION)
                    TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION)
                    TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
                    TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
 
10 INTERPOSER AND FOWLP MARKET, BY REGION (Page No. - 123)
     10.1 INTRODUCTION 
             FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029
             TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD BILLION)
             TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD BILLION)
     10.2 NORTH AMERICA 
             FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT
             TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
             TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
             TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
             TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
             TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
             TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
             10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA
             10.2.2 US
                        10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market
             10.2.3 CANADA
                        10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth
             10.2.4 MEXICO
                        10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth
     10.3 EUROPE 
             FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT
             TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
             TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
             TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
             TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
             TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
             TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
             10.3.1 RECESSION IMPACT ON MARKET IN EUROPE
             10.3.2 UK
                        10.3.2.1 Rapid advancement in 5G technology to foster market growth
             10.3.3 GERMANY
                        10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth
             10.3.4 FRANCE
                        10.3.4.1 Highly developed transport and communication networks to contribute to market growth
             10.3.5 REST OF EUROPE
     10.4 ASIA PACIFIC 
             FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT
             TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION)
             TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION)
             TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
             TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
             TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
             TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
             10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC
             10.4.2 CHINA
                        10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market
             10.4.3 JAPAN
                        10.4.3.1 Rising production of advanced consumer electronics to boost market growth
             10.4.4 SOUTH KOREA
                        10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth
             10.4.5 REST OF ASIA PACIFIC
     10.5 ROW 
             TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION)
             TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION)
             TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION)
             TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION)
             TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION)
             TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION)
             10.5.1 RECESSION IMPACT ON MARKET IN ROW
             10.5.2 MIDDLE EAST & AFRICA
                        10.5.2.1 High commitment to technological innovation to contribute to market growth
             10.5.3 SOUTH AMERICA
                        10.5.3.1 Increased R&D of advanced packaging technologies to propel market
 
11 COMPETITIVE LANDSCAPE (Page No. - 144)
     11.1 INTRODUCTION 
     11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023 
             TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023
             11.2.1 PRODUCT PORTFOLIO EXPANSION
             11.2.2 REGIONAL FOOTPRINT EXPANSION
             11.2.3 ORGANIC/INORGANIC GROWTH
     11.3 MARKET SHARE ANALYSIS, 2023 
             TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION
     11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022 
             FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022
     11.5 COMPANY EVALUATION MATRIX, 2023 
             11.5.1 STARS
             11.5.2 EMERGING LEADERS
             11.5.3 PERVASIVE PLAYERS
             11.5.4 PARTICIPANTS
                        FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023
             11.5.5 COMPANY FOOTPRINT
           TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)
           TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)
           TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES)
           TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)
     11.6 START-UP/SME EVALUATION MATRIX, 2023 
           TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES
             11.6.1 PROGRESSIVE COMPANIES
             11.6.2 RESPONSIVE COMPANIES
             11.6.3 DYNAMIC COMPANIES
             11.6.4 STARTING BLOCKS
                        FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023
             11.6.5 COMPETITIVE BENCHMARKING
                        TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES
     11.7 COMPETITIVE SITUATION AND TRENDS 
             11.7.1 PRODUCT LAUNCHES
                        TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020–NOVEMBER 2023
             11.7.2 DEALS
                        TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021–JANUARY 2024
 
12 COMPANY PROFILES (Page No. - 157)
     12.1 INTRODUCTION 
     12.2 KEY PLAYERS 
(Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)*  
             12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
                        TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
                        FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
                        TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
                        TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
             12.2.2 SAMSUNG
                        TABLE 126 SAMSUNG: COMPANY OVERVIEW
                        FIGURE 49 SAMSUNG: COMPANY SNAPSHOT
                        TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 128 SAMSUNG: PRODUCT LAUNCHES
                        TABLE 129 SAMSUNG: DEALS
             12.2.3 ASE TECHNOLOGY HOLDING CO., LTD.
                        TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
                        FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT
                        TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
                        TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS
             12.2.4 AMKOR TECHNOLOGY
                        TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW
                        FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
                        TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 136 AMKOR TECHNOLOGY: DEALS
                        TABLE 137 AMKOR TECHNOLOGY: OTHERS
             12.2.5 SK HYNIX INC.
                        TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW
                        FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT
                        TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES
             12.2.6 GLOBAL FOUNDRIES INC.
                        TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW
                        FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT
                        TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 143 GLOBAL FOUNDRIES INC.: DEALS
                        TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS
             12.2.7 DECA TECHNOLOGIES
                        TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW
                        TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 147 DECA TECHNOLOGIES: DEALS
             12.2.8 JCET GROUP LTD.
                        TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW
                        FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT
                        TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES
                        TABLE 151 JCET GROUP LTD.: OTHERS
             12.2.9 POWERTECH TECHNOLOGY INC.
                        TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
                        FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
                        TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS
             12.2.10 ADVANCED MICRO DEVICES, INC.
                        TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
                        FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
                        TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES
                        TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
     12.3 OTHER PLAYERS 
             12.3.1 NEXLOGIC TECHNOLOGIES INC.
             12.3.2 SPTS TECHNOLOGIES LTD.
             12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
             12.3.4 SAMTEC
             12.3.5 TELEDYNE DIGITAL IMAGING INC.
             12.3.6 OKMETIC
             12.3.7 AMS-OSRAM AG
             12.3.8 NEPES
             12.3.9 NHANCED SEMICONDUCTORS
             12.3.10 DUPONT
             12.3.11 ALLVIA INC.
             12.3.12 UNITED MICROELECTRONICS CORPORATION
             12.3.13 DAI NIPPON PRINTING CO., LTD.
             12.3.14 RENA TECHNOLOGIES GMBH
             12.3.15 MURATA MANUFACTURING CO., LTD
*Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.  
 
13 APPENDIX (Page No. - 196)
     13.1 INSIGHTS FROM INDUSTRY EXPERTS 
     13.2 DISCUSSION GUIDE 
     13.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 
     13.4 CUSTOMIZATION OPTIONS 
     13.5 RELATED REPORTS 
     13.6 AUTHOR DETAILS 
 

 

The study involved four major activities in estimating the current size of the interposer and fan-out wafer level packaging (FOWLP) market. Exhaustive secondary research was done to collect information on the market, peer, and parent markets. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market size. After that, market breakdown and data triangulation were used to estimate the market size of segments and subsegments.

Secondary Research

Various secondary sources have been referred to in the secondary research process for identifying and collecting information important for this study. The secondary sources include annual reports, press releases, and investor presentations of companies; white papers; journals and certified publications; and articles from recognized authors, websites, directories, and databases. Secondary research has been conducted to obtain key information about the industry’s supply chain, the market’s value chain, the total pool of key players, market segmentation according to the industry trends (to the bottom-most level), regional markets, and key developments from market- and technology-oriented perspectives. The secondary data has been collected and analyzed to determine the overall market size, further validated by primary research.

List of major secondary sources

Sources

Web Link

Chinese American Semiconductor Professional Association

https://www.caspa.com/

Global Semiconductor Alliance

https://www.gsaglobal.org/

Semiconductor Equipment Association of Japan (SEAJ)

https://www.seaj.or.jp/english/

China Semiconductor Industry Association

https://www.csia.net.cn/wsc/

SEMI

https://www.semi.org/en

Primary Research

Extensive primary research was conducted after gaining knowledge about the current scenario of the interposer and FOWLP market through secondary research. Several primary interviews were conducted with experts from both the demand and supply sides across four major regions—North America, Europe, Asia Pacific and RoW. This primary data was collected through questionnaires, emails, and telephonic interviews.

Interposer and Fan-out Wafer Level Packaging Market
 Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

In the complete market engineering process, both top-down and bottom-up approaches have been used, along with several data triangulation methods, to perform market estimation and forecasting for the overall market segments and subsegments listed in this report. Key players in the market have been identified through secondary research, and their market shares in the respective regions have been determined through primary and secondary research. This entire procedure includes the study of annual and financial reports of the top market players and extensive interviews for key insights (quantitative and qualitative) with industry experts (CEOs, VPs, directors, and marketing executives).

All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources. All the parameters affecting the markets covered in this research study have been accounted for, viewed in detail, verified through primary research, and analyzed to obtain the final quantitative and qualitative data. This data has been consolidated and supplemented with detailed inputs and analysis from MarketsandMarkets and presented in this report. The following figure represents this study’s overall market size estimation process.

Bottom-Up Approach

The bottom-up approach was used to arrive at the overall size of the interposer and FOWLP market from the revenues of the key players and their shares in the market. The overall market size was calculated based on the revenues of the key players identified in the market.

  • Identifying entities in the interposer and FOWLP value chain influencing the entire semiconductor packaging industry
  • Analyzing each entity along with related major companies identifying technology providers for the implementation of offerings and services
  • Estimating the market for these interposers and FOWLP end users
  • Tracking ongoing and upcoming implementation of interposer and FOWLP developments by various companies and forecasting the market based on these developments and other critical parameters
  • Arriving at the market size by analyzing interposer and FOWLP companies based on their countries and then combining it to get the market estimate by region
  • Verifying estimates and crosschecking them by a discussion with key opinion leaders, which include CXOs, directors, and operation managers

Interposer and Fan-out Wafer Level Packaging Market
 Size, and Bottom-Up Approach

Top-Down Approach

In the top-down approach, the overall market size has been used to estimate the size of individual markets (mentioned in the market segmentation) through percentage splits from secondary and primary research.

The most appropriate immediate parent market size has been used to implement the top-down approach to calculate the market size of specific segments. The top-down approach has been implemented for the data extracted from the secondary research to validate the market size obtained.

Each company’s market share has been estimated to verify the revenue shares used earlier in the top-down approach. This study has determined and confirmed the overall parent market and individual market sizes by the data triangulation method and data validation through primaries. The data triangulation method in this study is explained in the next section.

  • Focusing initially on topline investments by market players in the semiconductor packaging ecosystem
  • Calculating the market size based on the revenue generated by market players through the sales of interposer and fan-out and wafer level packaging.
  • Mapping the use of interposer and FOWLP in different offerings.
  • Building and developing the information related to the revenue generated by market players through key products
  • Estimating the geographic split using secondary sources considering factors, such as the number of players in a specific country and region, the role of major players in the development of innovative products, and adoption and penetration rates in a particular country for various segments.

Interposer and Fan-out Wafer Level Packaging Market
 Size, and Top-Down Approach

Data Triangulation

After arriving at the overall market size from the estimation process explained above, the overall market has been split into several segments and subsegments. The data triangulation procedure has been employed wherever applicable to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The data has been triangulated by studying various factors and trends from both the demand and supply sides. Additionally, the market size has been validated using top-down and bottom-up approaches.

Market Definition

Interposer and fan-out wafer level packaging (FOWLP) are key technologies in the semiconductor packaging industry. An interposer serves as an intermediary substrate, allowing the integration of many semiconductor dies into a single package via a network of interconnects and perhaps passive components.

FOWLP is a packaging technology that redistributes external connections from a thinned semiconductor die to the package substrate, resulting in a more compact design with better electrical performance. This market is driven by the growing demand for smaller, more powerful, and energy-efficient electronic devices across various industries.

Key Stakeholders

  • Suppliers of Raw Materials and Manufacturing Equipment
  • Providers and Manufacturers of Components
  • Providers of Software Solutions
  • Manufacturers and Providers of Semiconductor Devices
  • Original Equipment Manufacturers (OEMs)
  • ODM and OEM Technology Solution Providers
  • Suppliers and Distributors of Semiconductor Manufacturing Devices
  • System Integrators
  • Assembly, Testing, and Packaging Vendors
  • Market Research and Consulting Firms
  • Associations, Organizations, Forums, and Alliances Related to the Semiconductor Packaging
  • Technology Investors
  • Governments, Regulatory Bodies, and Financial Institutions
  • Venture Capitalists, Private Equity Firms, and Startups
  • End-user Industries

Report Objectives

  • To describe and forecast the interposer and fan-out wafer level packaging (FOWLP) market, in terms of value, based on packaging component & design, packaging type, device type and end-user industry.
  • To forecast the market size, in terms of value, for various segments concerning four regions: North America, Europe, Asia Pacific, and the Rest of the World.
  • To provide detailed information regarding the major factors influencing the market growth (drivers, restraints, opportunities, and challenges).
  • To strategically analyze micromarkets1 for individual growth trends, prospects, and contributions to the total market.
  • To analyze market opportunities for stakeholders by identifying well-developed segments of the interposer and fan-out wafer level packaging (FOWLP) market.
  • To provide a detailed overview of the market's value chain and analyze market trends with Porter’s five forces analytical framework.
  • To strategically profile the key players and comprehensively analyze their market position regarding ranking and core competencies2, along with detailing the competitive landscape for market leaders.
  • To analyze strategic developments, such as product launches, related developments, acquisitions, expansions, and agreements in the interposer and fan-out wafer level packaging (FOWLP) market.
  • To track and analyze competitive developments, such as partnerships, collaborations, agreements, joint ventures, mergers and acquisitions, expansions, product launches, and other developments in the market.

Customization Options

With the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five)

Geographic Analysis

  • Further breakdown of regions into respective countries
Custom Market Research Services

We will customize the research for you, in case the report listed above does not meet with your exact requirements. Our custom research will comprehensively cover the business information you require to help you arrive at strategic and profitable business decisions.

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Report Code
SE 5184
Published ON
Jan, 2024
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