3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

Report Code: SE 4844 May, 2023, by marketsandmarkets.com

[224 Pages Report] The 3D IC and 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2022 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. Growing adoption of high-end computing, servers, and data centers and miniaturization of IoT Devices are some of the major opportunities that lie ahead for the market.

3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market Forecast to 2028

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3D IC and 2.5D IC Packaging Market Dynamics

Driver: Growing demand for consumer electronics and gaming devices

With the latest technological advancements, there are many new gadgets coming up in the market, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products which demand high-performance electronic components. 3D IC packaging technology has helped bridge the processor memory performance gap by shortening the critical path and reducing the latency. It also allows scaling to continue efficiently by moving the focus from device-level scaling to circuit- and system-level scaling.

In addition, the advent of 5G technology has fueled the demand for 5G-enabled smartphones. According to Samsung, the demand for smartphones and 5G smartphones is expected to grow at a CAGR of 6% and 37%, respectively, from 2021 to 2025, due to the rising commercialization of 5G technology. Smartphone manufacturers such as Apple Inc., Samsung, Huawei, Vivo, Honor, OPPO, Xiaomi, and OnePlus have commercialized their 5G smartphones worldwide. Thus, the increase in the shipment of 5G smartphones is expected to fuel the demand for 3D IC and 2.5D IC packaging industry during the forecast period.

Restraint: Thermal issues resulting from higher level of integration

3D IC offers highly dense multi-level integration per unit footprint. Though this is attractive for many applications where miniaturization is a concern, it also creates challenges for thermal management; increased integration leads to high on-chip temperature. 3D ICs have several issues that must be resolved, including a larger form factor, the requirement for a larger silicon interposer, and longer design cycles. Overheating is observed during the production of 3D ICs with TSVs. Elevated temperatures result in a drop in threshold voltage and degradation of mobility. The resistance and power dissipation increases as a major part of the component is made up of metal.

Opportunity: Rising number of smart infrastructure and smart city projects

3D IC packaging can play a significant role in the development and implementation of smart city technology. Smart cities rely on a variety of electronic devices, sensors, and systems to collect and analyze data in real time, enabling better decision-making and more efficient resource management. By using 3D IC packaging, these devices and systems can be made smaller and more powerful and energy efficient. This helps reduce the overall cost and size of smart city infrastructure while improving performance and reliability.

Challenge:  Reliability challenges with 3D IC packaging

The semiconductor industry business is primarily driven by applications such as data centers/cloud, mobility, and the Internet of Things (IoT). The packaging technique must advance alongside the scaling of integrated circuit (IC) technology in order to fulfill the demands of next-generation information and communication technology (ICT) systems. Package design and development must simultaneously meet cost, performance, form factor, and reliability objectives. In terms of powering the design, the power density is higher for a given footprint than for traditional 2D chips. However, answering reliability issues will be crucial.

3D IC and 2.5D IC Packaging Market Ecosystem

The 3D IC and 2.5D IC packaging technology market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D IC and 2.5D IC packaging solutions.

3D IC and 2.5D IC Packaging Market by Ecosystem

Consumer electronics to hold largest market share among end users in 3D IC and 2.5D IC packaging market

Consumer electronics, by end user, is expected to hold the largest market share of the 3D IC and 2.5D IC packaging market. Increasing memory requirements in consumer products such as smartphones and tablets are driving the need for various advanced memories such as double-data-rate (DDR) dynamic random-access memory (DRAM), flash memory, and so on to be integrated. The advanced memory architectures are driving the demand for the 3D IC and 2.5D IC packaging market to offer high-performing, large-capacity, and compact products.

MEMS/Sensors to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

The functional components of MEMS are micro sensors, micro actuators, and microelectronics. The advanced elements of MEMS are accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The key requirement in all these elements and sensors is a miniaturized structure. Therefore, many sensors have started adopting 3D IC and 2.5D IC packages.

3D WLCSP to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

3D WLCSP is one of the most compact package types, with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. 3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other portable consumer devices as well as industrial products as it offers cost-effective, small, lightweight, high-performance semiconductor solutions.

Asia Pacific held to register highest CAGR in the 3D IC and 2.5D IC packaging market during forecast period

The Asia Pacific region is one of the key markets for 3D IC and 2.5D IC packaging owing to its broad scope in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the region, making it the largest potential market for 3D IC and 2.5D IC packaging among the four major regions.

3D IC and 2.5D IC Packaging Market by Region

3D IC and 2.5D IC Packaging Market by Region

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Key Market Players

The major players in the 3D IC and 2.5D IC packaging Companies include. The key players such as Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan). These companies have used both organic and inorganic growth strategies such as product launches, acquisitions, and partnerships to strengthen their position in the market.

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Scope of the Report

Segment

Subsegment

Estimated Market Size USD 49.3 Billion
Projected Market Size USD 82.0 Billion
Growth Rate 10.7%

Market size available for years

2019–2028

Base year considered

2022

Forecast period

2023–2028

Forecast units

Value (USD Million/USD Billion)

Segments covered

By Packaging Technology, Application, End User, and Region

Geographies covered

North America, Europe, Asia Pacific, and Rest of World

Companies covered

The major players in the 3D IC and 2.5D IC packaging market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan)

3D IC and 2.5D IC Packaging Market Highlights

The study segments the 3D IC and 2.5D IC packaging market based on By Packaging Technology, Application, End User, and Region

Segment

Subsegment

By Packaging Technology

  • 3D wafer-level chip-scale packaging (WLCSP)
  • 3D Through-silicon via (TSV)
  • 2.5D

By Application

  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others (Power, Analog & Mixed Signals, RF, Photonics)

By End User

  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Automotive
  • Military & Aerospace
  • Medical Devices

By Region

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World

Recent Developments

  • In February 2023, Amkor Technology (US) has partnered with GlobalFoundries (US), a semiconductor manufacturer. Under the arrangement, foundry chipmaker GlobalFoundries will transfer bump and sort lines for 300 mm wafers from its Dresden wafer fab to Amkor’s facility in Porto, Portugal. This strategic partnership with GlobalFoundries will enhance Amkor's advanced semiconductor packaging supply chain.
  • In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
  • In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. The platform leverages advanced re-distribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.

Frequently Asked Questions (FAQ):

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TABLE OF CONTENTS
 
1 INTRODUCTION (Page No. - 27)
    1.1 STUDY OBJECTIVES 
    1.2 MARKET DEFINITION 
           1.2.1 INCLUSIONS AND EXCLUSIONS
    1.3 STUDY SCOPE 
           FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION
           1.3.1 REGIONAL SCOPE
           1.3.2 YEARS CONSIDERED
    1.4 CURRENCY CONSIDERED 
    1.5 LIMITATIONS 
    1.6 STAKEHOLDERS 
    1.7 SUMMARY OF CHANGES 
           1.7.1 RECESSION IMPACT
 
2 RESEARCH METHODOLOGY (Page No. - 32)
    2.1 RESEARCH DATA 
           FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN
           2.1.1 SECONDARY AND PRIMARY RESEARCH
           2.1.2 SECONDARY DATA
                    2.1.2.1 Major secondary sources
                    2.1.2.2 Secondary sources
           2.1.3 PRIMARY DATA
                    2.1.3.1 Breakdown of primaries
                    2.1.3.2 Key data from primary sources
                    2.1.3.3 Key industry insights
    2.2 MARKET SIZE ESTIMATION 
           FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION
           2.2.1 BOTTOM-UP APPROACH
                    2.2.1.1 Estimating market size by bottom-up approach (demand side)
                               FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
           2.2.2 TOP-DOWN APPROACH
                    2.2.2.1 Estimating market size by top-down approach (supply side)
                               FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
                               FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES
    2.3 DATA TRIANGULATION 
           FIGURE 7 DATA TRIANGULATION
    2.4 RESEARCH ASSUMPTIONS 
           TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY
           2.4.1 RESEARCH LIMITATIONS
    2.5 RISK ASSESSMENT 
    2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET 
 
3 EXECUTIVE SUMMARY (Page No. - 45)
    3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT 
           FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES
           FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019–2028 (USD MILLION)
           FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET
           FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET
           FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
           FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD
 
4 PREMIUM INSIGHTS (Page No. - 50)
    4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 
           FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
    4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER 
           FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028
    4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY 
           FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
    4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 
           FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
    4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY 
           FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022
    4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET 
           FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD
 
5 MARKET OVERVIEW (Page No. - 54)
    5.1 INTRODUCTION 
    5.2 MARKET DYNAMICS 
           FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET
           5.2.1 DRIVERS
                    FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET
                    5.2.1.1 Increasing need for advanced architecture in electronic products
                    5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices
                    5.2.1.3 Growing demand for consumer electronics and gaming devices
                               FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025 (BILLION)
           5.2.2 RESTRAINTS
                    FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET
                    5.2.2.1 Thermal issues resulting from higher level of integration
                    5.2.2.2 High unit cost of 3D IC packages
           5.2.3 OPPORTUNITIES
                    FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET
                    5.2.3.1 Growing adoption of high-end computing, servers, and data centers
                    5.2.3.2 Miniaturization of IoT devices
                    5.2.3.3 Rising number of smart infrastructure and smart city projects
           5.2.4 CHALLENGES
                    FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET
                    5.2.4.1 Effective supply chain management
                    5.2.4.2 Reliability challenges in 3D IC packaging
    5.3 SUPPLY CHAIN ANALYSIS 
           FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET
    5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM 
           FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
    5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET 
           FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET
    5.6 AVERAGE SELLING PRICE ANALYSIS 
           TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS)
           5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
                     FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
           5.6.2 AVERAGE SELLING PRICE TREND
                    TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS)
           FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS)
    5.7 TECHNOLOGY TRENDS 
           5.7.1 FAN-OUT WAFER-LEVEL PACKAGING
           5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
    5.8 PORTER’S FIVE FORCES ANALYSIS 
           TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER’S FIVE FORCES ANALYSIS
           FIGURE 31 PORTER’S FIVE FORCES ANALYSIS
           5.8.1 THREAT OF NEW ENTRANTS
           5.8.2 THREAT OF SUBSTITUTES
           5.8.3 BARGAINING POWER OF SUPPLIERS
           5.8.4 BARGAINING POWER OF BUYERS
           5.8.5 INTENSITY OF COMPETITIVE RIVALRY
    5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA 
           5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
                    FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS
                    TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%)
           5.9.2 BUYING CRITERIA
                    FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
                    TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
    5.10 CASE STUDY ANALYSIS 
           5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION
           5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM
    5.11 TRADE ANALYSIS 
           5.11.1 IMPORT SCENARIO
                     TABLE 7 IMPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
           5.11.2 EXPORT SCENARIO
                     TABLE 8 EXPORT DATA, BY COUNTRY, 2018–2022 (USD MILLION)
    5.12 PATENT ANALYSIS 
           TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020–2023
           FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013–2022
           TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS
           FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
    5.13 KEY CONFERENCES AND EVENTS, 2023–2024 
           TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS
    5.14 STANDARDS AND REGULATORY LANDSCAPE 
           5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
           5.14.2 KEY REGULATIONS AND STANDARDS
                    5.14.2.1 North America
                    5.14.2.2 Europe
                    5.14.2.3 Asia Pacific
                    5.14.2.4 Regulations
                    5.14.2.5 Standards
 
6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY (Page No. - 86)
    6.1 INTRODUCTION 
           FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
           TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES
           FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
           TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
           TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP) 
           6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET
                    TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    6.3 3D THROUGH-SILICON VIA (TSV) 
           6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND
                    TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    6.4 2.5D 
           6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET
                    TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
 
7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION 
    7.1 INTRODUCTION 
           FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
           FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
           TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
           TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
    7.2 LOGIC 
           7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET
                    TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    7.3 IMAGING & OPTOELECTRONICS 
           7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET
                    FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028
                    TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    7.4 MEMORY 
           7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET
                    TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    7.5 MEMS/SENSORS 
           7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET
                    TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    7.6 LEDS 
           7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET
                    TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    7.7 OTHERS 
           TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
 
8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER (Page No. - 106)
    8.1 INTRODUCTION 
           FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
           FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
           TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    8.2 CONSUMER ELECTRONICS 
           8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET
                    TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    8.3 INDUSTRIAL 
           8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET
                    TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    8.4 TELECOMMUNICATIONS 
           8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET
                    TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    8.5 AUTOMOTIVE 
           8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET
                    TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    8.6 MILITARY & AEROSPACE 
           8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET
                    TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    8.7 MEDICAL DEVICES 
           8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING
                    TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
                    TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
 
9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION (Page No. - 121)
    9.1 INTRODUCTION 
           FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
           TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
           TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
    9.2 NORTH AMERICA 
           FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
           TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
           TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
           TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
           9.2.1 US
                    9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America
                               TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.2.2 CANADA
                    9.2.2.1 Establishment of Canada’s Semiconductor Council to drive regional market
                               TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.2.3 MEXICO
                    9.2.3.1 Automotive industry in Mexico to fuel market
                               TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    9.3 EUROPE 
           FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
           TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
           TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
           TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.3.1 UK
                    9.3.1.1 Increased use of 5G networks to fuel market
                               TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.3.2 GERMANY
                    9.3.2.1 Automotive industry to drive market
                               TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.3.3 FRANCE
                    9.3.3.1 Highly developed transportation and communication networks to drive market
                               TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.3.4 REST OF EUROPE
                    TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    9.4 ASIA PACIFIC 
           FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
           TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
           TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
           TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
           9.4.1 CHINA
                    9.4.1.1 Increased semiconductor manufacturing to drive market
                               TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.4.2 JAPAN
                    9.4.2.1 Increased production of consumer electronics and automobiles to drive market
                               TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.4.3 TAIWAN
                    9.4.3.1 Presence of many key OSAT companies to fuel market
                               TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.4.4 SOUTH KOREA
                    9.4.4.1 High manufacturing capacity to drive market
                               TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                               TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.4.5 REST OF ASIA PACIFIC
                    TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
    9.5 ROW 
           TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019–2022 (USD MILLION)
           TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023–2028 (USD MILLION)
           TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
           TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.5.1 MIDDLE EAST & AFRICA
                    TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
           9.5.2 SOUTH AMERICA
                    TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019–2022 (USD MILLION)
                    TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023–2028 (USD MILLION)
 
10 COMPETITIVE LANDSCAPE (Page No. - 154)
     10.1 INTRODUCTION 
     10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN 
             TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
             10.2.1 PRODUCT PORTFOLIO
             10.2.2 REGIONAL FOCUS
             10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES
     10.3 MARKET SHARE ANALYSIS, 2022 
             TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022)
     10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET 
             FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
     10.5 KEY COMPANY EVALUATION QUADRANT, 2022 
             10.5.1 STARS
             10.5.2 PERVASIVE PLAYERS
             10.5.3 EMERGING LEADERS
             10.5.4 PARTICIPANTS
                        FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022
     10.6 COMPETITIVE BENCHMARKING 
             10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY
             10.6.2 COMPANY FOOTPRINT, BY REGION
             10.6.3 OVERALL COMPANY FOOTPRINT
     10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022 
             TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES
             10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
                        10.7.1.1 Company footprint, by packaging technology
                        10.7.1.2 Company footprint, by region
             10.7.2 PROGRESSIVE COMPANIES
             10.7.3 RESPONSIVE COMPANIES
             10.7.4 DYNAMIC COMPANIES
             10.7.5 STARTING BLOCKS
                        FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022
     10.8 COMPETITIVE SITUATION AND TRENDS 
             10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS
                        TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019–2023
             10.8.2 DEALS
                        TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019–2023
 
11 COMPANY PROFILES (Page No. - 169)
     11.1 INTRODUCTION 
     11.2 KEY PLAYERS 
(Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)*  
             11.2.1 SAMSUNG
                        TABLE 115 SAMSUNG: BUSINESS OVERVIEW
                        FIGURE 52 SAMSUNG: COMPANY SNAPSHOT
             11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
                        TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW
                        FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT
             11.2.3 INTEL CORPORATION
                        TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW
                        FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT
             11.2.4 ASE TECHNOLOGY HOLDING CO., LTD.
                        TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW
                        FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT
             11.2.5 AMKOR TECHNOLOGY
                        TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW
                        FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
             11.2.6 BROADCOM
                        TABLE 120 BROADCOM: BUSINESS OVERVIEW
                        FIGURE 57 BROADCOM: COMPANY SNAPSHOT
             11.2.7 TEXAS INSTRUMENTS INC.
                        TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW
                        FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT
             11.2.8 UNITED MICROELECTRONICS CORPORATION
                        TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW
                        FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
             11.2.9 JCET GROUP CO., LTD.
                        TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW
                        FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT
             11.2.10 POWERTECH TECHNOLOGY INC.
                        TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW
                        FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
*Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.  
     11.3 OTHER PLAYERS 
             11.3.1 CADENCE DESIGN SYSTEMS, INC.
             11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD.
             11.3.3 ADVANCED MICRO DEVICES, INC.
             11.3.4 TEZZARON
             11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED
             11.3.6 FUJITSU
             11.3.7 XPERI INC.
             11.3.8 MONOLITHIC 3D INC.
             11.3.9 DECA TECHNOLOGIES
             11.3.10 3M
             11.3.11 GLOBALFOUNDRIES INC.
             11.3.12 NHANCED SEMICONDUCTORS
             11.3.13 MOLDEX3D
             11.3.14 CEREBRAS
             11.3.15 AYAR LABS, INC.
 
12 APPENDIX (Page No. - 218)
     12.1 DISCUSSION GUIDE 
     12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 
     12.3 CUSTOMIZATION OPTIONS 
     12.4 RELATED REPORTS 
     12.5 AUTHOR DETAILS 

The research study involved 4 major activities in estimating the size of the 3D IC and 2.5D IC packaging market. Exhaustive secondary research has been done to collect important information about the market and peer markets. The validation of these findings, assumptions, and sizing with the help of primary research with industry experts across the value chain has been the next step. Both top-down and bottom-up approaches have been used to estimate the market size. Post which the market breakdown and data triangulation have been adopted to estimate the market sizes of segments and sub-segments.

Secondary Research

In the secondary research process, various secondary sources were referred to for identifying and collecting information required for this study. The secondary sources include annual reports, press releases, and investor presentations of companies, white papers, and articles from recognized authors. Secondary research was mainly done to obtain key information about the market’s value chain, the pool of key market players, market segmentation according to industry trends, and regional outlook and developments from both market and technology perspectives.

Primary Research

In the primary research, various primary sources from both supply and demand sides were interviewed to obtain qualitative and quantitative insights required for this report. Primary sources from the supply side include experts such as CEOs, vice presidents, marketing directors, equipment manufacturers, technology and innovation directors, end users, and related executives from multiple key companies and organizations operating in the 3D IC and 2.5D IC market ecosystem.

3D IC and 2.5D IC Packaging Market Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

In the complete market engineering process, both top-down and bottom-up approaches were used along with several data triangulation methods to estimate and forecast the overall market segments and subsegments listed in this report.

Estimating market size by bottom-up approach (demand side)

  • Identifying the entities in the semiconductor value chain influencing the entire 3D IC and 2.5D IC packaging industry, along with the related software and service providers
  • Analyzing each type of entity along with related major companies identifying service providers for the implementation of products and services
  • Estimating the market for these 3D IC and 2.5D IC end users
  • Understanding the demand generated by the semiconductor industry-related companies
  • Tracking ongoing and upcoming implementation of 3D IC and 2.5D IC packaging developments by various companies and forecasting the market based on these developments and other critical parameters
  • Arriving at the market size by analyzing 3D IC and 2.5D IC packaging companies based on their countries, and then combining it to get the market estimate by region
  • Verifying estimates and crosschecking them by a discussion with key opinion leaders, which include CXOs, directors, and operation managers
  • Studying various paid and unpaid sources of information, such as annual reports, press releases, white papers, databases, and so on

Market Size Estimation Methodology-Bottom-up Approach

3D IC and 2.5D IC Packaging Market Size, and Bottom-up Approach

Data Triangulation

After arriving at the overall market size from the market size estimation process explained in the previous section, the total market was split into several segments and subsegments. Data triangulation procedure was employed, wherever applicable, to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The data was triangulated by studying various factors and trends from the demand and supply sides, and the market size was validated using top-down and bottom-up approaches.

Market Definition

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs), while a 2.5-dimensional integrated circuit (2.5D IC) is a package with active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

Stakeholders

  • Suppliers of Raw Materials and Manufacturing Equipment
  • Providers and Manufacturers of Components
  • Providers of Software Solutions
  • Manufacturers and Providers of Semiconductor Devices
  • Original Equipment Manufacturers (OEMs)
  • ODM and OEM Technology Solution Providers
  • Suppliers and Distributors of Semiconductor Manufacturing Devices
  • System Integrators
  • Middleware Providers
  • Assembly, Testing, and Packaging Vendors
  • Market Research and Consulting Firms
  • Associations, Organizations, Forums, and Alliances Related to the Semiconductor Packaging
  • Technology Investors
  • Governments, Regulatory Bodies, and Financial Institutions
  • Venture Capitalists, Private Equity Firms, and Startups
  • End Users

The main objectives of this study are as follows:

  • To define, describe, and forecast the 3D IC and 2.5D IC packaging market, in terms of value, based on application, packaging technology, and end user
  • To forecast the market size, in terms of value, for various segments with respect to four regions, namely, North America, Europe, Asia Pacific, and Rest of the World
  • To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze the micromarkets1 with respect to individual growth trends, future prospects, and contributions to the total market
  • To analyze opportunities in the market for stakeholders by identifying high-growth segments of the 3D IC and 2.5D IC packaging market
  • To provide a detailed overview of the value chain of the market and analyze market trends with Porter’s five forces analytical framework
  • To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies2 along with detailing the competitive landscape for market leaders
  • To analyze strategic developments such as product launches and related developments, acquisitions, expansions, and agreements in the 3D IC and 2.5D IC packaging market
  • To track and analyze competitive developments, such as partnerships, collaborations, agreements, joint ventures, mergers and acquisitions, expansions, product launches, and other developments in the market

Available Customizations:

With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

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Company Information:

  • Detailed analysis and profiling of additional market players (up to five)
Custom Market Research Services

We will customize the research for you, in case the report listed above does not meet with your exact requirements. Our custom research will comprehensively cover the business information you require to help you arrive at strategic and profitable business decisions.

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Report Code
SE 4844
Published ON
May, 2023
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